MLCC CRACK
Abstract: MLCC CSAM CRACK DETECTION PATTERNS 1 MHZ ULTRASONIC transducers High Q Ultrasonic Transducer MHZ ULTRASONIC transducers Acoustic microscopy water ultrasonic 1 Mhz transducer MHZ ULTRASONIC transducers water CRACK
Text: KEMET T E C H T O P I C S … T H E L E A D I N G E D G E V OL . 8, N O . 3 y P UBLISHED BY KEMET E LECTRONICS C ORP . y P. O. B OX 5928 y G REENVILLE , SC 29606 y 864 963-6300 y N OVEMBER 1998 KEMET is continually searching for improved tools to aid
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JEDEC J-STD-020C
Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public
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J-STD-020C
J-STD-020B
1-580987-46-X
JEDEC J-STD-020C
JESD47
Reliability Test Methods for Packaged Devices
Infineon moisture sensitive package
JESD-47
JESD22-A120
AMD reflow soldering profile BGA
J-STD-035
semiconductors cross reference
ipc-sm-786A
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Reflow
Abstract: JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1
Text: IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public
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J-STD-020D
J-STD-020D
Reflow
JEDEC J-STD-020d.1
JEP-140
JEP140
J-STD-035
JESD22-B112
JEDEC J-STD-020d
JESD47
JESD22-B108
IPC-020d-5-1
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TETRA etch
Abstract: ADI LOT CODE IE reliability test data analysis reliability data analysis report
Text: ADI Reliability Handbook PRODUCT ANALYSIS IN ADI Introduction Product analysis or failure analysis is a key contributor to ADI’s overall quality improvement. In order to maintain its success, it’s imperative that customers have a high level of confidence in ADI’s competency as a supplier. Part of the in-built product analysis philosophy is to emphasize the concept of
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leica aotf
Abstract: epcos crystal confocal CTI QUARTZ
Text: Direct Link 1050 Applications & Cases Acousto-optic tunable filters for microscopes January 2007 A brighter, sharper image Modern microscopes illuminate their object with laser beams. Known as confocal microscopes, they focus the laser light onto a tiny point of the
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AN1907
Abstract: MRF9045MR1 TO270
Text: MOTOROLA Order this document by AN1907/D SEMICONDUCTOR APPLICATION NOTE AN1907 Surface Mount Solder Attach Method for the MRF9045MR1 in the TO-270 Plastic RF Package Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton
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AN1907/D
AN1907
MRF9045MR1
O-270
AN1907
TO270
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QMI 509 epoxy
Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Text: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer
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32-lead
6600HR
28-44lead
635mils
01BLL-SI
610221877M
CY62128BLL-SI
QMI 509 epoxy
SUMITOMO eme-6600hr
SOJ package MSL
QMI 509 epoxy datasheet
CY7C63001A-SC
JESD22
EME6600HR
mold compound
EME 6600HR
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EME 7320
Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
Text: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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160-lead
CY7C375I-AC
EME 7320
Ablestik
Ablestik 8361
7320
a144g
SUMITOMO EME G
A100A
CY7C09579V-AC
JESD22
ASE Cypress
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TO-270
Abstract: Cu-194 AN1907 sn-pb-ag solder preform SOCKET HEAD CAP SCREWS the tom and jerry show MRF9045MR1 copper bond wire motorola MOTOROLA SEMICONDUCTOR
Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1907/D AN1907 Surface Mount Solder Attach Method for the MRF9045MR1 in the TO-270 Plastic RF Package Freescale Semiconductor, Inc. Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton
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AN1907/D
AN1907
MRF9045MR1
O-270
TO-270
Cu-194
AN1907
sn-pb-ag solder preform
SOCKET HEAD CAP SCREWS
the tom and jerry show
copper bond wire motorola
MOTOROLA SEMICONDUCTOR
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active filter module
Abstract: EMI filter SMHP120 FMD28-461SL
Text: FEATURES • • • • • • • • • • • DC/DC CONVERTERS 120 VOLT INPUT Fully qualified to Class H –55° to +125°C operation 80 to 175 VDC input Fully Isolated Magnetic feedback Fixed frequency, 600 kHz typical Topology – Single Ended Forward
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SMHP120
MIL-PRF-38534)
MIL-PRF-38534,
active filter module
EMI filter
FMD28-461SL
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MP8000CH
Abstract: MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto
Text: Cypress Semiconductor Package Qualification Report QTP# 000102 VERSION 1.0 March, 2000 84 Lead Plastic Leaded Chip Carrier NITTO 8000CH Molding Compound Level 3 Anam-Manila, Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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8000CH
MP8000CH
37KPHIL-M
CY7C373I-JC
30C/60
MP8000C
8361H
MP800
CY7C373I-JC
JESD22
nitto chip
Nitto
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99045
Abstract: CY37512P208-NC JESD22 ASE Cypress copper bond wire
Text: Cypress Semiconductor Qualification Report QTP# 99045 VERSION 1.0 September, 1999 208 Lead PQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7068 Cypress Semiconductor Assembly: ASE Taiwan Package: 208 Lead PQFP
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30C/60
CY37512P208-NC
150C/-55C
99045
CY37512P208-NC
JESD22
ASE Cypress
copper bond wire
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140C
Abstract: 8361H CEL9200 JESD22 cel-9200 copper bond wire Hitachi-CEL9200
Text: Cypress Semiconductor Qualification Report QTP# 97304 VERSION 1.0 August, 1997 48/56 Ld SSOP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: SSOP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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CEL9200
8361H
JESD22-A112
85C/85
CY2276APVC
140C
8361H
CEL9200
JESD22
cel-9200
copper bond wire
Hitachi-CEL9200
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Untitled
Abstract: No abstract text available
Text: Planar arrays and discoidals 3.1 - Production process flowchart Ceramic powder preparation 3.1 to 3.3 3.2 - Syfer planar array and discoidal reliability product groups Electrode ink material Multilayer build wet process Standard components Standard reliability
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ap8277
AN0011
AN0028
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mp8000
Abstract: MP8000CH4-A2 CY62128-SC 8361H JESD22 MP8000CH4
Text: Cypress Semiconductor Qualification Report QTP# 99412 VERSION 1.0 October, 1999 32 Ld, 450 mil SOIC Package Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor
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400-mil
450-mil
MP8000CH4-A2
8361H
CY62128-SC
619922743M
619922743M2
mp8000
MP8000CH4-A2
CY62128-SC
8361H
JESD22
MP8000CH4
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sumitomo epoxy
Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 000303 VERSION 1.1 March, 2000 Up to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
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to160
CY7C375-AC
sumitomo epoxy
EME 7320
7320
8361H
CY7C375-AC
JESD22
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cel 9200
Abstract: hitachi mold cel CY7C199-VC cda 199 Hitachi CEL 9200 9200 hitachi 8361H JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 000405 VERSION 1.1 July, 2000 SOJ 28 Leads Hitachi Cel 9200 Molding Compound Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
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85C/85
CY7C199-VC
cel 9200
hitachi mold cel
CY7C199-VC
cda 199
Hitachi CEL
9200
9200 hitachi
8361H
JESD22
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MIL-PRF-38534
Abstract: MTR28512TF crane electronic control MTR28512T MIL-PRF-38534 fine leak SPACE POWER ELECTRONICS MID Crane qa-040 38534 Crane
Text: Crane Aerospace & Electronics Power Solutions Quality Assurance Quality Assurance overview and screening tables Crane Aerospace & Electronics, Interpoint Corp. PO Box 97005 • Redmond WA 98073-9705 425.882.3100 • electronics@craneae.com www.craneae.com
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MIL-PRF-38534
AS9100.
MIL-PRF-38534
MIL-PRF-38534.
rL-PRF-38534,
MIL-STD-883
MILPRF-38534.
MTR28512TF
crane electronic control
MTR28512T
MIL-PRF-38534 fine leak
SPACE POWER ELECTRONICS
MID Crane
qa-040
38534
Crane
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SUMITOMO EME6600
Abstract: EME6600 Compound 6600cs 3818 MIL-STD-883c-method 1010 6600CS
Text: Cypress Semiconductor Package Qualification Report QTP# 99234 VERSION 1.1 September 2000 52-208-pin Plastic Quad Flatpack Package PQFP Sumitomo 6600CS molding Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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52-208-pin
6600CS
52-208-Lead
N52D/N208L
52/208-pin
CY82C693-NC
619909669B
SUMITOMO EME6600
EME6600
Compound 6600cs
3818
MIL-STD-883c-method 1010
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BAI 59
Abstract: plaskon FBGA PACKAGE thermal resistance
Text: Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array FBGA Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069
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CY62127VLL-BAI
CY62137VLL-BAIB
BAI 59
plaskon
FBGA PACKAGE thermal resistance
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TSOP32 Package
Abstract: TSOP32 M29W040 PLCC32 QR125
Text: QUALIFICATION REPORT M29W040 T6-U10: 4 Mb x8 FLASH MEMORY in PLCC32 and TSOP32 INTRODUCTION The M29W040 is a 4 Mb Single Supply (2.7V to 3.6V) Flash memory organized as 512K bytes of 8 bits each. It is offered in PLCC32 and TSOP32 packages. It can be programmed and erased in-system or in
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M29W040
T6-U10:
PLCC32
TSOP32
TSOP32
T6-U10
100ns
TSOP32 Package
QR125
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SMD CODE 9Z
Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2
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300mm
SMD CODE 9Z
80C251 PLCC44
J-STD-20
SMD CODE 9T
Smd parts identification
14x14x1.4mm
PLCC18
Temic PART DATE CODE
moisture sensitive handling and packaging
temic ulc products
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AN1907
Abstract: MRF9045NR1 RF Power Devices
Text: Freescale Semiconductor Application Note AN1907 Rev. 1, 6/2006 Solder Reflow Attach Method for High Power RF Devices in Plastic Packages By: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton INTRODUCTION This application note describes a process to solder attach
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AN1907
AN1907
MRF9045NR1
RF Power Devices
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8355F
Abstract: 130C JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 99331 VERSION 2.0 December, 2000 48 Lead Fine Pitch Ball Grid Array FBGA 7mm x 8.5mm ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Kim-Ngan Nguyen
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BA48G
48-ball
O925255
CY62146VLL-BAIB
150C/-55)
8355F
130C
JESD22
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