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    AH009 Price and Stock

    Glenair Inc 467AH009LF12FR

    Circular MIL Spec Backshells ACCESSORIES - G-SPRING ADAPTERS/RING
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    Mouser Electronics 467AH009LF12FR
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    Newark 467AH009LF12FR Bulk 97 1
    • 1 $1261.97
    • 10 $786.6
    • 100 $342
    • 1000 $342
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    Glenair Inc 467AH009LF10FR

    Circular MIL Spec Backshells ACCESSORIES - G-SPRING ADAPTERS/RING
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    Mouser Electronics 467AH009LF10FR
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    Newark 467AH009LF10FR Bulk 170 1
    • 1 $1142.88
    • 10 $712.36
    • 100 $309.73
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    KOA Speer Electronics Inc RK73H1ETTP9310F

    Thick Film Resistors - SMD 0.1watts 931ohms 1%
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    TTI RK73H1ETTP9310F Reel 300,000 10,000
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    KOA Speer Electronics Inc RK73H1ETTP9102F

    Thick Film Resistors - SMD 0.1watts 91Kohms 1%
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    TTI RK73H1ETTP9102F Reel 170,000 10,000
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    KOA Speer Electronics Inc RK73H1ETTP9531F

    Thick Film Resistors - SMD 0.1watts 9.53Kohms
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    TTI RK73H1ETTP9531F Reel 110,000 10,000
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    AH009 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E

    Abstract: GH sc-59 to-92 hall sensor ultrasonic range meter IC Ultrasonic welding circuit transistor Common collector configuration thermoset plastics Application Note 27703 HALL EFFECT TO 92 leadframe
    Text: GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical effect is combined with modern integrated circuit IC


    Original     		PDF

    N140 ALLEGRO

    Abstract: HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Allegro Hall-Effect ICs Ultrasonic welding generator GTS2000
    Text: Application Note 27703.1B GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical effect is combined with modern integrated circuit IC


    Original     		PDF 1-508-ALLEGRO N140 ALLEGRO HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Allegro Hall-Effect ICs Ultrasonic welding generator GTS2000

    HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E

    Abstract: hall effect sensor GH SC-59 HALL EFFECT Loctite 406 LT HALL SENSOR to-92 hall sensor Ultrasonic welding circuit
    Text: GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical effect is combined with modern integrated circuit IC


    Original     		PDF

    LEAPER-3

    Abstract: 74189 7489 sram 4N34 89C51 interfacing with lcd display ic 74192 pin configuration interfacing 20x4 LCD with 89c51 IC 74189 DATA LEAP-U1 LEAPER-10 driver
    Text: COMPANY PROFILE 1 Leap Electronic was established in 1980 located in Taipei Taiwan. With great experienced employees, Leap has dedicated on test equipment and provided a whole and perfect environment of development. Additional, the Company has been qualified by major IC manufacturer such as ATMEL, AMD, MICROCHIP, WINBOND,etc.


    Original     		PDF PIC16C52/54/54A PIC16C55/56/57/57A/58A PIC12C508/509 PIC16C61 PIC16C620/621/622 PIC16C71/710 PIC16C62/63/64/65 PICC16C72/73/74/74A PIC16C83/84 PIC17C42/42A/43/44 LEAPER-3 74189 7489 sram 4N34 89C51 interfacing with lcd display ic 74192 pin configuration interfacing 20x4 LCD with 89c51 IC 74189 DATA LEAP-U1 LEAPER-10 driver

    Loctite 406

    Abstract: HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Injection mold foam Ultrasonic welding generator FLEX THERMOSET COMPOUND N140 AH010 N140 ALLEGRO
    Text: Application Note 27703.1† GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical


    Original     		PDF

    27703.1-AN

    Abstract: Die Attach epoxy stamping smd hall effect sensor water "Magnetic Sensor" pressure low die bond sensor RTV ultrasonic movement sensor working hall effect Ultrasonic welding circuit ultrasonic liquid level sensor ic JCM Technical Services
    Text: Application Information Guidelines for Designing Subassemblies Using Hall-Effect Devices By John Sauber and Bradley Smith Allegro MicroSystems, Inc. Introduction Stress Sensitive Locations The Hall effect, discovered by E. H. Hall in 1879, is the basis for all Hall-effect devices. When this physical effect


    Original     		PDF

    N140 ALLEGRO

    Abstract: Ultrasonic welding generator Allegro Hall-Effect ICs GH SC-59 Loctite 406 pressure low die bond sensor RTV HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E FLEX THERMOSET COMPOUND TO-236A TRA-CON
    Text: Application Note 27703.1‡ GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical


    Original     		PDF