Untitled
Abstract: No abstract text available
Text: 5 2 1 4 3 SJ1-42535TS-SMT 2 3 5 1 10.4 0.409 0.5 1.60 0.063 2 PLCS 0.5 0.020 4 4 2 3 7.0 0.276 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 HOUSING TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 TERMINAL 5 Copper Alloy Copper Alloy Copper Alloy Copper Alloy
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SJ1-42535TS-SMT
112th
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Untitled
Abstract: No abstract text available
Text: 2 1 4 3 6 SJ1-42535RS-SMT 2 3 1 6 10.4 0.409 0.5 1.60 0.063 2 PLCS 0.5 0.020 4 4 2 3 7.0 0.276 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 HOUSING TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 TERMINAL 6 Copper Alloy Copper Alloy Copper Alloy Copper Alloy
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SJ1-42535RS-SMT
112th
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MF202
Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical
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16-pin
MF202
160P6)
152P6T)
135S8)
42Alloy)
leadframe materials
QFP PACKAGE thermal resistance
POWER QFP
MITSUBISHI INTEGRATED CIRCUIT PACKAGES
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Untitled
Abstract: No abstract text available
Text: SJ1-42534-SMT PCB LAYOUT TOP VIEW 2 3 2 1 4 3 1 1.8X2.8 10.4 0.409 0.5 1.60 0.063 2 PLCS 0.5 0.020 (2 PLCS) 4 4 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 2 3 TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 HOUSING Copper Alloy Copper Alloy Copper Alloy Copper Alloy
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SJ1-42534-SMT
112th
300mA
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Untitled
Abstract: No abstract text available
Text: SJ1-42536-SMT 2 3 1 4 3 6 5 2 1 5.00 0.197 5 6 1.8X2.8 3 PLCS 10.4 0.409 0.5 1.60 0.063 (2 PLCS) 4 4 4.5 0.177 (2 PLCS) 4.50 0.177 9.5 0.374 0.15 2 3 HOUSING TERMINAL 1 TERMINAL 2 TERMINAL 3 TERMINAL 4 TERMINAL 5 TERMINAL 6 Copper Alloy Copper Alloy Copper Alloy
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SJ1-42536-SMT
112th
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 1 2 D 20 RELEASED FOR PUBLICATION BY - 6 5 4 3 2 20 LOC GP ALL RIGHTS RESERVED. MATERIAL: CAGE ASSEMBLY - NICKEL-SILVER ALLOY. EMI SPRINGS - COPPER ALLOY. HEATSINK - ALUMINUM ALLOY. HEATSINK CLIP - STAINLESS STEEL.
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26FEB2010
ECO-11-019224
05JAN2012
ECO-10-004036
ECO-13-014600
10OCT2013
10JUL2007
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Amphenol MIL CIRCULAR CONNECTORS
Abstract: amphenol MIL-C-5015 DL3102A DS5015 3106A amphenol 2 pin male circular plug socapex 14S-7 25043 amphenol 12 pin male circular plug
Text: DS 5015 Characteristics • Intermateable and intermountable with other MIL-C-5015 Style connectors. • Several kinds of plating, all cadmium free (olive drab zinc alloy, black zinc alloy, electroless nickel upon request). • Solder contacts, silver plated copper alloy, from AWG 16 to AWG 0.
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MIL-C-5015
MIL-C-5015
Amphenol MIL CIRCULAR CONNECTORS
amphenol MIL-C-5015
DL3102A
DS5015
3106A
amphenol 2 pin male circular plug
socapex
14S-7
25043
amphenol 12 pin male circular plug
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Highlight Optoelectronics
Abstract: HL-110 HL008
Text: AlInGaP YELLOW GREEN LED CHIPS DEVICE NO. HL-008 UG 1. Scope： This specification applies to AlInGaP/GaAs LED chips. 2. Structure： Emission area：Smooth surface Electrodes： P Anode side：Aluminum alloy (or Gold alloy). N(Cathode)side：Gold alloy. 3. Size：
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HL-008
Highlight Optoelectronics
HL-110
HL008
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BR55
Abstract: BR32 BR42 BR16 BR23 MIL-PRF-23648
Text: GE Sensing Features Type BR11/14/16/25 Small glass encapsulated bead thermistors on fine diameter alloy lead-wires. Type BR32/42/55 Large glass encapsulated bead thermistors on fine diameter platinum alloy lead-wires. • Suitable for most low cost temperature measurement,
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BR11/14/16/25
BR32/42/55
24-Value
MS90178.
BR55
BR32
BR42
BR16
BR23
MIL-PRF-23648
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UM 66 in
Abstract: EL-420-21
Text: LED - Chip ELС-420-21 10.04.2008 rev. 01 Radiation Type Technology Electrodes Violet Special InGaN N cathode up typ. dimensions (±50) µm typ. thickness 145 (±15) µm cathode gold alloy, 2.5 µm anode gold alloy, 1.5 µm Absolute Maximum Ratings at Tamb = 25°C, unless otherwise specified
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EL-420-21
tp100
D-12555
UM 66 in
EL-420-21
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110-H14
Abstract: D4226-1
Text: Pomona Model 4226 E Size, Die Cast Aluminum Box, With Cover And Card Guides MATERIALS: Shielded Housing: Die cast aluminum, Alloy A380 or A384: Finish: Blue paint per FED-STD-595, Color No. 25109 Marking: “POMONA ELECTRONICS, CALIF” Cover: 2.03 .080 thick aluminum, Alloy 110-H14
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FED-STD-595,
110-H14
MIL-A-8625
\Release\DataSheets\FlukeDataSheet\d4226
D4226-1
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Untitled
Abstract: No abstract text available
Text: Terminals 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Material: Terminal: Brass - Copper Alloy C36000 , ASTM-B-16 Contact: Beryllium Copper - Copper Alloy (C17200), ASTM-B-194
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C36000)
ASTM-B-16
C17200)
ASTM-B-194
MIL-G-45204
MIL-P-81728
QQ-N-290
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Untitled
Abstract: No abstract text available
Text: Terminals 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com Material: Terminal: Brass - Copper Alloy C36000 , ASTM-B-16 Contact: Beryllium Copper - Copper Alloy (C17200), ASTM-B-194
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C36000)
ASTM-B-16
C17200)
ASTM-B-194
MIL-G-45204
MIL-P-81728
QQ-N-290
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SVT Package Weight mg 45000 Product Group Type No. S30VT60 – S30VT160 S50VT60 – S50VT160 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating
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S30VT60
S30VT160
S50VT60
S50VT160
2011/65/EU.
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SSOP42-P-450-0
Abstract: No abstract text available
Text: APPENDIX 3.9 Package outline 3.9 Package outline 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 Weight g 0.63 JEDEC Code – Lead Material Alloy 42/Cu Alloy e b2 22 Caution ! E HE e1 I2 42 F Symbol TBD 21 1 A D Recommended Mount Pad
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42P2R-A
42pin
450mil
SSOP42-P-450-0
42/Cu
42P2R-A
42P4in
42S1B-A
600mil
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Untitled
Abstract: No abstract text available
Text: Q F P Alloy 42 Lead Frame 0.50mm * ★ : eecier Oe« BODY SIZE O.fjbmri 28; 160 V :; 0 bornir. 203 0.40mm 256 20BP6Y 32 rch PIN CO 266P6J* 240 H Q F P (Copper Alloy Lead Frame + Copper Heat Spreader) H Q F P (Alloy 42 Lead Frame + Copper Heat Spreader)
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20BP6Y
266P6J*
PtNd52P6T)
208P6tt)
100P6Q
176P6Q
208P6Q
80P6C
100P6V
28P0K
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EZ00
Abstract: FW00
Text: DATE CODE AM P LOGO NOTE: 1. MATERAL HOUSING : HIGH TEMPERATURE THERMOPLASTIC, UL 9 4 V —0. COLOR: SEE TABLE. CONTACT : COPPER ALLOY. PIN : COPPER ALLOY SHIELD : COPPER ALLOY. ±0.1 2. FINISH CONTACT : SILVER PLATING. PIN : NICKEL PLATING SHIELD : NICKEL PLATING.
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27--SEP--2002
27-SEP-20Q2
C-440080
EZ00
FW00
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ZN 3055 transistor
Abstract: Transistor w1l 7805 TO-220 V7233 5241E V7331 V5237B V-5240-k mk 5373 V7622
Text: ASSMANN Technical Data & Abbreviations Electronic C om ponen ts Al Surface nature AI203 Aluminiumoxyd Al Mg Si 0,5 Special aluminium alloy {extruded Al 99,5 Special aluminium alloy band) GD-AI Si 12 Special aluminium alloy (Die-cast) BeO Berylliumoxyd K
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AI203
OT-32,
O-126)
O-220
O-220,
ZN 3055 transistor
Transistor w1l
7805 TO-220
V7233
5241E
V7331
V5237B
V-5240-k
mk 5373
V7622
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Y14SM
Abstract: No abstract text available
Text: 4 QMmSQN CHWT I «ÜH i 1 i SPECIFICATIONS: m vmmammmmmummm MM MATERIALS; CAS?: THERMOPLASTIC 34V-0. FRAMt: STEEL. TIN PLATED. ACTUATOR: COPPER ALLOY. NICKEL PLATED. MOVING C0MTACT: COPPER ALLOY, BOLD OVER NICKEL PLATE. FIXED CONV!.CT/TERMINAL: COPPER ALLOY, TIN/LEAD PLATE.
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10-2-SB
Y14SM
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Untitled
Abstract: No abstract text available
Text: RoHS COMPLIANT £ -,- - .315 2.00 , 079 'r V V V T 1 >-4 r\K ' J .079 1.50 .059 Material: Housing: THERMOPLASTIC,UL 94V-0. USB2.0 Contact:Copper alloy USB3.0 Contact:Copper alloy SHELL:Copper alloy,Tin over Nickel plating. Ordering Information 2077 S A H * * 00
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2077SAH*
207702S
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Untitled
Abstract: No abstract text available
Text: C_ |_ D \_ A_ |_ B E_ |_ F_ / NOTES: 1. MATERIAL: 1.1 HOUSING: HALOGEN FREE PLASTIC, HIGH TEMP. UL94V-0; COLOR: BLACK 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL: COPPER ALLOY
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UL94V-0;
87220-02XX-TR
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Untitled
Abstract: No abstract text available
Text: \ A B E_ |_ F_ / C_ |_ D NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP.UL94V-0; 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL:COPPER ALLOY 1.4 LATCH: THERMOPLASTIC, HIGH TEMP.UL94V-0; 2. FINISH:
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UL94V-0;
26CTC
PS-50531
APP970133SMHÂ
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Untitled
Abstract: No abstract text available
Text: B D C J _ E _ I_ £ _ NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L 9 4 V -0 ; 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL:COPPER ALLOY 1.4 LATCH: THERMOPLASTIC, HIGH TEMP.,
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26CTC
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Untitled
Abstract: No abstract text available
Text: * nr JuL EL1M, EL2M, & EL3M Multi-Tier ModularTerminal Blocks MATERIALS: Contact: Copper alloy Plating: Electrolytic tin Hardware: M3 Copper alloy, Nickel plated Housing: Black or green UL94V-0 thermoplastic SPECIFICATIONS: Maximum Operating Temperature: 105° C
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UL94V-0
EL1M022B001
EL1M032B001
EL1M042B00
EL1M052B0Q
EL1M062B00
EL1M072B00
EL1M082B00
EL1M092B00
EL1M102B00
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