ISL12020M
Abstract: No abstract text available
Text: DATASHEET Low Power RTC with Battery Backed SRAM, Integrated ±5ppm Temperature Compensation and Auto Daylight Saving ISL12020M Features The ISL12020M device is a low power Real Time Clock RTC with an embedded temperature sensor and crystal. Device functions include oscillator compensation, clock/calendar,
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ISL12020M
ISL12020M
768kHz
AMSEY14
5m-1994.
015mm
FN6667
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HMC408
Abstract: QFN PACKAGE Junction to PCB thermal resistance HMC408LP3 RO4350 SN63
Text: v00.0703 APPLICATION NOTES THERMAL MANAGEMENT FOR SURFACE MOUNT COMPONENTS Introduction As the power dissipation and availability of surface mount RF power amplifiers has increased, the need for careful thermal management of the next higher level assembly has become increasingly important. Previous generation
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TR13
Abstract: No abstract text available
Text: Package Details SMA Case Mechanical Drawing Lead Code: Part Marking: 4-6 Character Alpha/Numeric Code Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SMA Case
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EIA-481-1-A
TR13
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934 marking code
Abstract: Diode SMA marking code PB TR13 SMA marking AG Package Details - SMA
Text: Package Details - SMA Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: 4-6 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R1 (10-December 2002)
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10-December
EIA-481-1-A
10-March
934 marking code
Diode SMA marking code PB
TR13
SMA marking AG
Package Details - SMA
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TR13
Abstract: No abstract text available
Text: Package Details - SMB Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: 3-6 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R1 (10-December 2002)
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10-December
EIA-481-1-A
10-March
TR13
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TR13
Abstract: No abstract text available
Text: Package Details SMB Case Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: 3-6 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SMB Case
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EIA-481-1-A
Inform17
TR13
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TR13
Abstract: No abstract text available
Text: Package Details SMC Case Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: 3-6 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SMC Case
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EIA-481-2-A
TR13
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TR13
Abstract: No abstract text available
Text: Package Details - SMC Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: 3-6 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R1 (10-December 2002)
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10-December
EIA-481-2-A
10-March
TR13
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TR13
Abstract: No abstract text available
Text: Package Details - SMC Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: 3-6 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R1 (10-December 2002)
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10-December
EIA-481-2-A
C31-5
10-September
TR13
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Thermal resistance characterization of Power MOSFETs
Abstract: MOSFETs thermal resistance of low power semiconductor
Text: Thermal resistance characterization of Power MOSFETs Anup Bhalla Alpha & Omega Semiconductor January 2003. I. Introduction Power MOSFET junction temperature influences many operational parameters and device lifetime. To estimate device junction temperature in a circuit, or to compare
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igbt failure fit
Abstract: No abstract text available
Text: AOS Semiconductor Product Reliability Report AOB10B60D, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOB10B60D. Accelerated environmental tests are performed on a specific sample size, and then followed by
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AOB10B60D,
AOB10B60D.
AOB10B60D
10-5eV
igbt failure fit
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Intel XScale PXA270
Abstract: PowerVR register planar YUV display input PowerVR tile 2700G5
Text: R Intel 2700G7 Multimedia Accelerator Datasheet November 2004 Document Number: 304430-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
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2700G7
Intel XScale PXA270
PowerVR register
planar YUV display input
PowerVR tile
2700G5
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2700G5
Abstract: powervr register PowerVR tile Intel XScale PXA270 2700G3 pxa25 powervr registers
Text: R Intel 2700G Multimedia Accelerator Datasheet For the Intel® 2700G3 Multimedia Accelerator and the ® Intel 2700G5 Multimedia Accelerator April 2004 Document Number: 300948-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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2700G
2700G3
2700G5
powervr register
PowerVR tile
Intel XScale PXA270
pxa25
powervr registers
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290618-002
Abstract: graphics intel 740 Intel740Graphics 440LX CCIR601 3D Accelerator DSI RGB Bridge display 320X200
Text: Intel740 Graphics Accelerator Datasheet Release Date: April, 1998 Order Number: 290618-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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Intel740TM
04565-001-Sao
USA/0498/LMA
290618-002
graphics intel 740
Intel740Graphics
440LX
CCIR601
3D Accelerator
DSI RGB Bridge display
320X200
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CHN 647
Abstract: No abstract text available
Text: HMC610LP4 / 610LP4E v10.1008 RMS POWER DETECTOR 75 dB, DC - 3.9 GHz POWER DETECTORS - SMT 7 Typical Applications Features The HMC610LP4 E is ideal for: ±1 dB Detection Accuracy to 3.9 GHz • Log –> Root-Mean-Square (RMS) Conversion Input Dynamic Range: -60 dBm to +15 dBm
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HMC610LP4
610LP4E
16mm2
CHN 647
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INTEL740
Abstract: 440LX CCIR601 VGA VESA DDC2 29061
Text: Intel740 Graphics Accelerator Datasheet February 1998 Order Number: 290618-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
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Intel740
ROMA11
ROMA10
440LX
CCIR601
VGA VESA DDC2
29061
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4000 watts power amplifier circuit diagram pcb l
Abstract: No abstract text available
Text: HMC610LP4 / 610LP4E v08.0708 RMS POWER DETECTOR 75 dB, DC - 3.9 GHz POWER DETECTORS - SMT 7 Typical Applications Features The HMC610LP4 E is ideal for: ±1 dB Detection Accuracy to 3.9 GHz • Log –> Root-Mean-Square (RMS) Conversion Input Dynamic Range: -60 dBm to +15 dBm
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HMC610LP4
610LP4E
4000 watts power amplifier circuit diagram pcb l
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HITTITE MARKING 056 QFN
Abstract: No abstract text available
Text: HMC610LP4 / 610LP4E v09.0808 RMS POWER DETECTOR 75 dB, DC - 3.9 GHz POWER DETECTORS - SMT 7 Typical Applications Features The HMC610LP4 E is ideal for: ±1 dB Detection Accuracy to 3.9 GHz • Log –> Root-Mean-Square (RMS) Conversion Input Dynamic Range: -60 dBm to +15 dBm
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HMC610LP4
610LP4E
HITTITE MARKING 056 QFN
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Untitled
Abstract: No abstract text available
Text: HMC610LP4 / 610LP4E v07.0608 RMS POWER DETECTOR 75 dB, DC - 3.9 GHz POWER DETECTORS - SMT 7 Typical Applications Features The HMC610LP4 E is ideal for: ±1 dB Detection Accuracy to 3.9 GHz • Log –> Root-Mean-Square (RMS) Conversion Input Dynamic Range: -60 dBm to +15 dBm
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HMC610LP4
610LP4E
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P09N02
Abstract: No abstract text available
Text: v00.1106 QUALITY ASSURANCE Record Lot Number on List of Materials for Each Part Listed Inspect MMICs and ICs Clean Housing Install Feedthrus Clean Housing Epoxy Substrates Solder Components Clean Housing Epoxy Attach All Chip Components Wirebond 100% Visual Inspection
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W10N02,
W09N01,
W09N32
W09N03,
MIL-STD-883
P15N04,
P03N01,
P09N02,
P09N02
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OM-325
Abstract: OM338 OM325 AL 5052 OM-338 OPT111 Rebel OM338 thermal conductivity
Text: Opulent YOUR GREEN PARTNER OP REBEL STAR Features Excellent thermal conductivity Excellent insulating ability Excellent Dimensional Stability OP REBEL STAR Excellent Mechanical Aluminum Clad Printed Strength Circuit Board for Lower heat expansibility
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30Sept09
OM-325
OM338
OM325
AL 5052
OM-338
OPT111
Rebel
OM338 thermal conductivity
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PBG1 smd
Abstract: P87C695
Text: INTEGRATED CIRCUITS DATA SHEET SAA6712E XGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 Aug 25 Philips Semiconductors Preliminary specification XGA RGB to TFT graphics engine SAA6712E CONTENTS 8.4 1 FEATURES
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SAA6712E
SAA6721E
SAA6721E.
25-Aug-99
PBG1 smd
P87C695
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soic theta jc value
Abstract: GPM22 ISL12020M VMO 440
Text: Low Power RTC with Battery Backed SRAM, Integrated ±5ppm Temperature Compensation and Auto Daylight Saving ISL12020M Features The ISL12020M device is a low power real time clock RTC with an embedded temperature sensor and crystal. Device functions include oscillator compensation, clock/calendar,
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ISL12020M
ISL12020M
768kHz
AMSEY14
5m-1994.
015mm
FN6667
soic theta jc value
GPM22
VMO 440
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Untitled
Abstract: No abstract text available
Text: Low Power RTC with Battery Backed SRAM, Integrated ±5ppm Temperature Compensation and Auto Daylight Saving ISL12020M Features The ISL12020M device is a low power real time clock RTC with an embedded temperature sensor and crystal. Device functions include oscillator compensation, clock/calendar,
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ISL12020M
ISL12020M
768kHz
AMSEY14
5m-1994.
015mm
FN6667
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