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Catalog Datasheet	MFG & Type	PDF	Document Tags
SAC387 Abstract: NXR-1400 tamura solder paste SN63 PB37 alpha PowerPAK 1212-8 stencil ekra e5 SAC387 solder MIL-STD-750 method 1037 UP78 SAC-387 Text: VISHAY SILICONIX Power MOSFETs Application Note 914 "PowerPAK 1212-8", The Proven Automotive Package By Kandarp Pandya INTRODUCTION This application note presents useful information on the PowerPAK 1212-8 to facilitate SQE and design engineers. Vishay introduced the PowerPAK power MOSFET package	Original	PDF	1990s AN825 17-May-10 SAC387 NXR-1400 tamura solder paste SN63 PB37 alpha PowerPAK 1212-8 stencil ekra e5 SAC387 solder MIL-STD-750 method 1037 UP78 SAC-387
flux-eutectic Abstract: UP78 silicon carbide LED Alpha Metals Text: XBright & XThin® Au/Sn Die Attachment Recommendations XBright and XThin LEDs are the latest generation of solid-state light emitting diodes available from Cree. XBright and XThin chips use a geometrically shaped Epi-down chip design combined with InGaN epitaxy and Cree’s proprietary	Original	PDF	CPR3AN01 flux-eutectic UP78 silicon carbide LED Alpha Metals
73494 Abstract: NXR-1400 ekra e5 ekra nicolet nxr1400 pyramax tamura solder paste IPC-9701 nicolet SAC387 Text: AN611 Vishay Siliconix Development of a Lead Pb -Free Soldering Process for PolarPAK By Kandarp Pandya ABSTRACT PolarPAK is one of the latest Vishay Siliconix SMD packages with enhanced thermal efficiency. Heat from the semiconductor MOSFET chip is removed from	Original	PDF	AN611 15-mm 31-Aug-05 73494 NXR-1400 ekra e5 ekra nicolet nxr1400 pyramax tamura solder paste IPC-9701 nicolet SAC387
CPR3-AN03 Abstract: pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree Text: APPLICATION NOTE XThinTM Sn Die Attachment Recommendations This applications note provides the user with a basic understanding of Cree’s new low temperature attach version XThin chips, information on the recommended packaging, and an overview of some constraints to be considered when packaging the chips.	Original	PDF	CPR3-AN02, CPR3-AN03 pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree
asm eagle Abstract: WHP-002 flux-eutectic 2151-HTV21-CT-series CPR3-AN03 EZ290 bonding wire cree UP78 EZ1000 1572-17-437GM-20D Text: EZBright LED Handling and Packaging Recommendations This applications note provides the user with a basic understanding of Cree’s EZBright LED chips, as well as recommendations on handling and packaging. Cree’s EZBright LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials	Original	PDF	EZ290TM EZR260TM EZ290, EZR260 EZ1000 CPR3AN04 asm eagle WHP-002 flux-eutectic 2151-HTV21-CT-series CPR3-AN03 EZ290 bonding wire cree UP78 1572-17-437GM-20D
72116 Abstract: tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15 Text: AN825 Vishay Siliconix The Solderability of the PowerPAKr SO-8 and PowerPAK 1212-8 When Using Different Solder Pastes and Profiles Jess Brown and Kandarp Pandya INTRODUCTION Next-generation PowerPAK packages from Vishay Siliconix feature very low thermal resistances, enabling higher power	Original	PDF	AN825 15-Dec-03 72116 tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15
qfn 48 7x7 stencil Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical	Original	PDF
MicroLeadFrame Packages Pad Landing Recommendations Abstract: 3641B atmel Reflow soldering die paddle IPC-SM-782 atmel touch pattern MLF 6x6 amkor exposed pad Text: MicroLeadFrame Packages Pad Landing Recommendations 1. Introduction This application note provides PCB designers with a set of guidelines for successful board mounting of Atmel’s DataFlash memories housed in the MicroLeadFrame package. The MicroLeadFrame package MLF® is a near CSP plastic encapsulated	Original	PDF	3641B MicroLeadFrame Packages Pad Landing Recommendations atmel Reflow soldering die paddle IPC-SM-782 atmel touch pattern MLF 6x6 amkor exposed pad
PCB design for 0.2mm pitch csp package Abstract: led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA Amkor CSP mold compound Soldering guidelines and SMD footprint design led 3mm 8x8 matrix mlf 0.3mm pitch MLF 6x6 guideline pad dimension 1210 Text: Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame MLF® Packages December 2003 Page 1 December 2003 Rev. E Contents 1.0 Introduction 3 2.0 Surface Mount Consideration 3 3.0 PCB Design Requirements 4 3.1 4 4 8 8 10 3.2 3.3 Page 2	Original	PDF
QFN-48 LAND PATTERN Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060 Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when	Original	PDF
Type B PICC BPSK SUBCARRIER LOAD MODULATION Abstract: AT88RF1354 Magnetic card reader writer schematics pcb antenna 13.56 MHz matching RFID loop antenna 13.56 T matching RFID loop antenna 13.56 trench cpr 04 qfn 48 7x7 stencil 125 kHz RFID reader automotive transponder Text: 1. Features • Compatible with all ISO/IEC 14443 Type B Compliant Cards, Tags, and Transponders • High Performance 13.56 MHz RF Communications Interface ― ISO/IEC 14443-2 Type B Compliant 106 Kbps Signaling ― ISO/IEC 14443-3 Type B Compliant Frame and Data Format	Original	PDF	AT88RF1354 547A-RFID-10/08 Type B PICC BPSK SUBCARRIER LOAD MODULATION AT88RF1354 Magnetic card reader writer schematics pcb antenna 13.56 MHz matching RFID loop antenna 13.56 T matching RFID loop antenna 13.56 trench cpr 04 qfn 48 7x7 stencil 125 kHz RFID reader automotive transponder
Magnetic card reader writer schematics Abstract: pcb antenna 13.56 MHz T matching RFID loop antenna 13.56 iso 10373-6 calibration coil AT88RF1354 Type B PICC BPSK SUBCARRIER LOAD MODULATION ISO 14443-2 calibration coil rfid card reader rfid reader schematic Text: Features • Compatible with all ISO/IEC 14443 Type B Compliant Cards, Tags, and Transponders • High Performance 13.56 MHz RF Communications Interface ⎯ ISO/IEC 14443-2 Type B Compliant 106 Kbps Signaling ⎯ ISO/IEC 14443-3 Type B Compliant Frame and Data Format Internal	Original	PDF	AT88RF1354 8547B Magnetic card reader writer schematics pcb antenna 13.56 MHz T matching RFID loop antenna 13.56 iso 10373-6 calibration coil AT88RF1354 Type B PICC BPSK SUBCARRIER LOAD MODULATION ISO 14443-2 calibration coil rfid card reader rfid reader schematic
Untitled Abstract: No abstract text available Text: Features • Compatible with all ISO/IEC 14443 Type B Compliant Cards, Tags, and Transponders • High Performance 13.56 MHz RF Communications Interface ⎯ ISO/IEC 14443-2 Type B Compliant 106 Kbps Signaling ⎯ ISO/IEC 14443-3 Type B Compliant Frame and Data Format Internal	Original	PDF	AT88RF1354 8547Bâ