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    ALTERA BGA PACKAGES PART MARKING Search Results

    ALTERA BGA PACKAGES PART MARKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    ALTERA BGA PACKAGES PART MARKING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ADV0607

    Abstract: XZ-070 altera Date Code Formats Date Code Formats altera date code format ALTERA PART MARKING EP2C35 EP2C50 date code marking altera top marking
    Text: Revision 0: Initial Release CUSTOMER ADVISORY ADV0607 UFBGA 484 Package Coplanarity Enhancement Change Description Altera will enhance the coplanarity of its Ultra FineLine BGA UFBGA 484 packages as part of the company’s continuous product-quality improvement process. This enhancement


    Original     		ADV0607 ratin2C35 EP2C50 XZ0701T JESD46-B, 21-Nov-06 ADV0607 XZ-070 altera Date Code Formats Date Code Formats altera date code format ALTERA PART MARKING EP2C35 EP2C50 date code marking altera top marking PDF

    ADV0012

    Abstract: ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark
    Text: CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Altera will begin marking a one-line internal traceability code on all BGA packages beginning January 2001. The Altera lot number, country of origin, and new internal marking code will be laser marked, or ink marked, on the top of all BGA packages for


    Original     		ADV0012 ADV0012 ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark PDF

    ALTERA PART MARKING

    Abstract: ADV0217 altera Date Code Formats ALTERA BGA packages PART MARKING altera date code format altera marking
    Text: CUSTOMER ADVISORY ADV0217 FULL LASER MARKING INTRODUCTION Change Description: Beginning January 2003, Altera will introduce a full topside laser mark on all Altera plastic body packages. Currently, the Altera device logo, part number, and date code are ink marked, while the Altera lot number and traceability code


    Original     		ADV0217 ALTERA PART MARKING ADV0217 altera Date Code Formats ALTERA BGA packages PART MARKING altera date code format altera marking PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    ADV0217

    Abstract: ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING
    Text: Revision: 1.1.0 CUSTOMER ADVISORY ADV0217 UPDATE FULL LASER MARKING INTRODUCTION Change Description This is an update to ADV0217. See the revision history table for information specific to this update. In January 2003, Altera introduced a full topside laser mark on all Altera plastic body packages.


    Original     		ADV0217 ADV0217. ADV0217 JESD46-C, 20X20 ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    PCN0715

    Abstract: ABF-SH9K ABF-GX3 altera date code altera SOP top marking kyocera date code marking ic 2008 EP1S60 ALTERA 484 BGA packages PART MARKING
    Text: Revision: 1.1.1 PROCESS CHANGE NOTIFICATION PCN0715 ALTERNATE KYOCERA SUBSTRATE FOR FLIP-CHIP PACKAGES Change Description This is an update to PCN0715, published Oct 2007. Altera is introducing an alternate Kyocera substrate as an additional source for the Stratix FPGA Flip-Chip packages. This change is being


    Original     		PCN0715 PCN0715, JESD46-C, PCN0715 ABF-SH9K ABF-GX3 altera date code altera SOP top marking kyocera date code marking ic 2008 EP1S60 ALTERA 484 BGA packages PART MARKING PDF

    ADV0907

    Abstract: ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera Micro FineLine BGA MBGA packages. This change does not affect the form, fit, or function of the


    Original     		ADV0907 ADV0907 ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N PDF

    epm7128 sdram

    Abstract: TQFP 44 PACKAGE footprint TQFP 144 PACKAGE footprint footprint tqfp 208 vhdl code for interleaver Thomson-CSF transmitter EPM7128 Datasheet 7809 data sheet national semiconductor ep1k10 pci Omega Engineering
    Text: & News Views Fourth Quarter 2000 The Programmable Solutions Company® Newsletter for Altera Customers Quartus Version 2000.09 Dramatically Improves fMAX & Compile Times The QuartusTM software version 2000.09 includes the new PowerFitTM fitter that delivers


    Original     		EP20K400E 240-Pin EPM9560A 208-Pin 356-Pin EPM9560 280-Pin epm7128 sdram TQFP 44 PACKAGE footprint TQFP 144 PACKAGE footprint footprint tqfp 208 vhdl code for interleaver Thomson-CSF transmitter EPM7128 Datasheet 7809 data sheet national semiconductor ep1k10 pci Omega Engineering PDF

    PCN0803

    Abstract: TI date code altera date code format marking ic 2008 EP1S60 stiffener ALTERA BGA packages PART MARKING date code marking stratix traceability FC1020
    Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0803 PACKAGE-LID STIFFENER CHANGE FOR THE STRATIX FLIP-CHIP FAMILY Change Description Altera is introducing a dimension change to the package-lid stiffener for the Stratix FPGA flip-chip package. This effectively reduces the overall package height by approximately 0.2mm. This change


    Original     		PCN0803 J-STD-020C) JESD46-C, PCN0803 TI date code altera date code format marking ic 2008 EP1S60 stiffener ALTERA BGA packages PART MARKING date code marking stratix traceability FC1020 PDF

    PCN0904

    Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this


    Original     		PCN0904 65-nm 60-nm PCN0904, EU-REP3C16U484I7N EP3C10E144C7 EP3C10E144C7N EP3C10E144C8 PCN0904 EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N PDF

    PCN0902

    Abstract: HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0902 ADDITIONAL ASSEMBLY SOURCE AND BILL OF MATERIAL CHANGE FOR ALTERA FLIP CHIP PRODUCTS Change Description This is an update to PCN0902; please see the revision history table for information specific to this


    Original     		PCN0902 PCN0902; PCN0902 HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA PDF

    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


    Original     		PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 PDF

    EPM570 footprint

    Abstract: EPM240T100C5 Agilent 3070 Manual transistor SMD marked RNW smd transistors code alg EPM1270F256C5 EPM1270T144 project transistor tester 555 4-bit AHDL adder subtractor 1ff TRANSISTOR SMD MARKING CODE
    Text: MAX II Device Handbook Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com MII5V1-1.2 Copyright 2004 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


    Original     		EPM1270F256C3 EPM1270 EPM1270F256C4 EPM1270F256C5 EPM1270T144C3 EPM1270T144C4 EPM1270T144C5 EPM1270* EPM570 footprint EPM240T100C5 Agilent 3070 Manual transistor SMD marked RNW smd transistors code alg EPM1270T144 project transistor tester 555 4-bit AHDL adder subtractor 1ff TRANSISTOR SMD MARKING CODE PDF

    EPM1270

    Abstract: HP LED handbook linear handbook EPM2210 EPM240 EPM240G EPM240Z EPM570 micro fineline BGA
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating


    Original     		PDF

    altera epm570 Date Code Formats

    Abstract: HP LED handbook EPM1270 ieee 1532 linear handbook EPM2210 EPM240 EPM240G EPM240Z EPM570
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating


    Original     		PDF

    MAX II

    Abstract: No abstract text available
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing


    Original     		PDF

    ALTERA die identifier

    Abstract: MAX2171 MII51005-2 Parallel Flash Loader
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing


    Original     		PDF

    linear handbook

    Abstract: EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 45This
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating


    Original     		PDF

    EPM1270

    Abstract: EPM2210 EPM240 EPM240G EPM570
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing


    Original     		PDF

    EPM240T100C5N

    Abstract: EPM2210GF324C3N EPM1270T144I5 EPM570F256C5N EPM570T144C5N EPM570F256C3 EPM1270T144I5N EPM1270T144C5N EPM1270GT144i5 epm240gt100c5n
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing


    Original     		EPM2210GF256C5N EPM2210GF324C3 EPM2210G EPM2210GF324C3N EPM2210GF324C4 EPM2210GF324C4N EPM2210GF324C5 EPM2210GF324C5N EPM2210GF256I5 EPM2210GF256I5N EPM240T100C5N EPM1270T144I5 EPM570F256C5N EPM570T144C5N EPM570F256C3 EPM1270T144I5N EPM1270T144C5N EPM1270GT144i5 epm240gt100c5n PDF

    32 bit carry select adder code

    Abstract: ieee 1532 micro fineline BGA tms 980 8 bit adder/subtractor using XOR 876 pin bga altera 1270 bga 529 programmable multi pulse waveform generator cpld variable resistor 47
    Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing


    Original     		PDF

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF