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    ALTERA TQFP 32 PACKAGE Search Results

    ALTERA TQFP 32 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    ALTERA TQFP 32 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    TQFP 100 PACKAGE footprint

    Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness


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    100-Pin 256-Pin 484-Pin 672-Pin 20-Pin 32-Pin 7000S, M-GB-ALTERAPKG-01 TQFP 100 PACKAGE footprint 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC PDF

    240 PIN QFP ALTERA DIMENSION

    Abstract: 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions Table of Contents Advanced Packaging Solutions . . . . . . . . . . . . . . . . . . . . . .2


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    100-Pin 256-Pin 484-Pin 672-Pin 225-Pin 7000S, M-GB-ALTERAPKG-01 240 PIN QFP ALTERA DIMENSION 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION PDF

    BC 1098

    Abstract: EPM7384 ALTERA 68 PLCC t187
    Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    232-pin 240-pin 100-pin 256-pin 484-pin 672-pin BC 1098 EPM7384 ALTERA 68 PLCC t187 PDF

    PCN0714

    Abstract: EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A
    Text: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION PCN0714 UPDATE ASSEMBLY PLANT CHANGE FOR PQFP AND TQFP PACKAGES Change Description: This is an update to PCN0714; please see the revision history table for information specific to this update. The plastic quad flat pack PQFP and thin quad flat pack (TQFP) packages currently


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    PCN0714 PCN0714; EP20K100 EP20K60E EP20K100E EP20K160E EP20K200E EP20K300E EPF10K100E EPF10K130E EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


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    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA PDF

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


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    ADV0406

    Abstract: TQFP 32 PACKAGE altera TQFP 32 PACKAGE MS-026 MS-026 TQFP
    Text: CUSTOMER ADVISORY ADV0406 TQFP 32 PACKAGE TOP MOLD AND EJECTOR SIZE CHANGE Change Description: Due to assembly process improvements undertaken at our assembly supplier, slight dimensional changes are being made to the 32 lead thin quad flat pack TQFP packages. The dimension changes involve an increase of the top mold


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    ADV0406 ADV0406 TQFP 32 PACKAGE altera TQFP 32 PACKAGE MS-026 MS-026 TQFP PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


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    7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance PDF

    transistors BC 458

    Abstract: BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA
    Text: アルテラ・デバイス パッケージ・インフォメーション Altera Device Package Information Data Sheet 1998年 1 月 ver.7 イントロダク ション Data Sheet このデータシートにはアルテラのすべてのデバイス・パッケージに関する


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    PGAT-187 -DS-PKG-07/J 10KFLEX 9000MAX EPF10K10 transistors BC 458 BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA PDF

    100 PIN PQFP ALTERA DIMENSION

    Abstract: 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE altera altera TQFP 44 PACKAGE EPM7096S altera TQFP 32 PACKAGE TQFP 144 PACKAGE DIMENSION epm7032s package dimensions EPM7128S altera board
    Text: Saving Board Space with MAX 7000S TQFP Packages April 1997, ver. 1 Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX 7000S


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    7000S 22V10s, EPM7032S EPM7064S 100 PIN PQFP ALTERA DIMENSION 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE altera altera TQFP 44 PACKAGE EPM7096S altera TQFP 32 PACKAGE TQFP 144 PACKAGE DIMENSION epm7032s package dimensions EPM7128S altera board PDF

    PCN0414

    Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
    Text: PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera’s Thin Quad Flat Pack TQFP packages. All


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    PCN0414 EME-G700 PCN0414 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound PDF

    TQFP 144 PACKAGE DIMENSION

    Abstract: EPM7128A DIMENSIONS pqfp 100 TQFP Package 44 lead 100 PIN PQFP ALTERA DIMENSION altera TQFP 32 PACKAGE 100 PIN tQFP ALTERA DIMENSION
    Text: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S


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    7000S 22V10s, 7000S 44-Pin TQFP 144 PACKAGE DIMENSION EPM7128A DIMENSIONS pqfp 100 TQFP Package 44 lead 100 PIN PQFP ALTERA DIMENSION altera TQFP 32 PACKAGE 100 PIN tQFP ALTERA DIMENSION PDF

    EP1C3T100

    Abstract: APEX 20ke development board sram excalibur APEX development board nios SFI-5 APEX nios development board ep20k100 board excalibur Board
    Text: Component Selector Guide February 2003 Altera Corporation S SOPC Solutions The world’s pioneer in system-on-a-programmable-chip SOPC solutions, Altera Corporation offers a complete range of programmable logic device (PLD) products with the flexibility, functionality, package types, and time-tomarket advantages to meet almost any design need.


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    SG-COMP-12 EP1C3T100 APEX 20ke development board sram excalibur APEX development board nios SFI-5 APEX nios development board ep20k100 board excalibur Board PDF

    100 PIN tQFP ALTERA DIMENSION

    Abstract: TQFP 144 PACKAGE DIMENSION 100 PIN PQFP ALTERA DIMENSION TQFP 100 PACKAGE TQFP 144 PACKAGE PQFP chip size TQFP 144 PACKAGE altera altera EPM7032S altera TQFP 32 PACKAGE EPM7128S
    Text: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S


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    7000S 22V10s, 44-Pin 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE DIMENSION 100 PIN PQFP ALTERA DIMENSION TQFP 100 PACKAGE TQFP 144 PACKAGE PQFP chip size TQFP 144 PACKAGE altera altera EPM7032S altera TQFP 32 PACKAGE EPM7128S PDF

    100 PIN "PGA" ALTERA DIMENSION

    Abstract: No abstract text available
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


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    altera ep610

    Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


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    EQFP 144 PACKAGE

    Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16
    Text: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00


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    UBGA49

    Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
    Text: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm


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    100-Pin EPM3512A 160-Pin EPM3256A EPM3128A EPM7256S EPM7192S EPM7160S EPM7064S EPM7128S UBGA49 EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE PDF

    F4558

    Abstract: MAB100 VTQFP EPM7064B 6-8 B1 D458 B200
    Text: EPM7064B I/O Pins ver. 1.0 Table 1 shows all the pins for the 44-pin PLCC, 44-pin TQFP, 48-pin VTQFP, and 49-pin Ultra FineLine BGATM, 100-pin TQFP, and 100-pin FineLine BGA packages. Table 1: EPM7064B Dedicated Pin-Outs 44-pin Dedicated Pin 44-pin PLCC TQFP


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    EPM7064B 44-pin 48-pin 49-pin 100-pin 44-pin F4558 MAB100 VTQFP 6-8 B1 D458 B200 PDF

    4572 IC 8PIN

    Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
    Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines


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    503-Pin 4572 IC 8PIN epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610 PDF