FPT-256C-C02
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02
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FPT-256C-C02
256-pin
FPT-256C-C02)
F256012SC-3-3
FPT-256C-C02
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FPT-256C-C03
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03
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FPT-256C-C03
256-pin
FPT-256C-C03)
F256014SC-2-3
FPT-256C-C03
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Aluminum nitride QFP
Abstract: 368c diode 368-pin
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 368 PIN CERAMIC FPT-368C-C01 368-pin ceramic QFP Lead pitch 0.40 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-368C-C01
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FPT-368C-C01
368-pin
FPT-368C-C01)
F368002SC-3-3
Aluminum nitride QFP
368c diode
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Untitled
Abstract: No abstract text available
Text: QUAD L-LEADED PACKAGE 304 PIN CERAMIC FPT-304C-C02 Lead pitch 0.50mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Base ceramic material Aluminum nitride 304-pin ceramic QFP FPT-304C-C02 304-pin ceramic QFP (FPT-304C-C02)
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FPT-304C-C02
304-pin
FPT-304C-C02)
F304004SC-3-3
Dimen04
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Aluminum nitride QFP
Abstract: No abstract text available
Text: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC FPT-304C-C02 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-304C-C02
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FPT-304C-C02
304-pin
FPT-304C-C02)
F304004SC-3-3
Aluminum nitride QFP
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Aluminum nitride QFP
Abstract: nitride
Text: QUAD FLAT L-LEADED PACKAGE 160 PIN CERAMIC FPT-160C-C02 Lead pitch 0.65mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm Base ceramic material Aluminum nitride 160-pin ceramic QFP FPT-160C-C02 160-pin ceramic QFP (FPT-160C-C02)
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FPT-160C-C02
160-pin
FPT-160C-C02)
F160008SC-3-2
071AMIC
Aluminum nitride QFP
nitride
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368-pin
Abstract: Aluminum nitride QFP
Text: QUAD FLAT L-LEADED PACKAGE 368 PIN CERAMIC FPT-368C-C01 Lead pitch 0.40mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Base ceramic material Aluminum nitride 368-pin ceramic QFP FPT-368C-C01 368-pin ceramic QFP (FPT-368C-C01)
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FPT-368C-C01
368-pin
FPT-368C-C01)
F368002SC-3-3
Aluminum nitride QFP
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296-0025
Abstract: Aluminum nitride QFP
Text: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02 256-pin ceramic QFP (FPT-256C-C02)
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FPT-256C-C02
256-pin
FPT-256C-C02)
F256012SC-3-3
296-0025
Aluminum nitride QFP
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nitride
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 160 PIN CERAMIC FPT-160C-C04 160-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm Base ceramic material Aluminum nitride FPT-160C-C04 160-pin ceramic QFP (FPT-160C-C04)
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FPT-160C-C04
160-pin
FPT-160C-C04)
F160010SC-2-2
nitride
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nitride
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03 256-pin ceramic QFP (FPT-256C-C03)
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FPT-256C-C03
256-pin
FPT-256C-C03)
F256014SC-2-3
nitride
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nitride
Abstract: Aluminum nitride QFP method 208
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-208C-C03 208-pin ceramic QFP (FPT-208C-C03)
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FPT-208C-C03
208-pin
FPT-208C-C03)
F208013SC-2-3
nitride
Aluminum nitride QFP
method 208
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nitride
Abstract: Aluminum nitride QFP C1995
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C04 Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Aluminum nitride 208-pin ceramic QFP FPT-208C-C04 208-pin ceramic QFP (FPT-208C-C04)
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FPT-208C-C04
208-pin
FPT-208C-C04)
FFPT-208C-C04
nitride
Aluminum nitride QFP
C1995
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Aluminum nitride QFP
Abstract: 368-pin
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 368 PIN CERAMIC To Top / Package Lineup / Package Index FPT-368C-C01 368-pin ceramic QFP Lead pitch 0.40 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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FPT-368C-C01
368-pin
FPT-368C-C01)
F368002SC-3-3
Aluminum nitride QFP
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304-pin dimensions
Abstract: 304 QFP 304 pin ceramic
Text: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC To Top / Package Lineup / Package Index FPT-304C-C02 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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FPT-304C-C02
304-pin
FPT-304C-C02)
F304004SC-3-3
304-pin dimensions
304 QFP
304 pin ceramic
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256 pin ceramic Quad flat package
Abstract: FPT-256C-C03
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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FPT-256C-C03
256-pin
FPT-256C-C03)
F256014SC-2-3
256 pin ceramic Quad flat package
FPT-256C-C03
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K612
Abstract: underfill FR4 epoxy dielectric constant 3.2 Dielectric Constant Silicon Nitride K810 FR4 substrate height and thickness ltcc chip fine line bga thermal cycling reliability
Text: Bourns Microelectronic Modules Packaging Solutions Device Mounting Technology Surface Mount Technology Surface mounting is still the most common and economical approach for many applications. Bourns® Microelectronic Module products offer the latest in surface mount technology:
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2M/MM0405
K612
underfill
FR4 epoxy dielectric constant 3.2
Dielectric Constant Silicon Nitride
K810
FR4 substrate height and thickness
ltcc chip
fine line bga thermal cycling reliability
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Untitled
Abstract: No abstract text available
Text: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe
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coil gold detector
Abstract: SOLID CONDUCTOR WIRE, MIL SPEC Aluminum nitride QFP 4164 dynamic ram Book Microelectronic cpu aeroflex military mcm military mcm 1553 4164 ram arena
Text: Aeroflex Plainview Custom Hybrid, MCM, Module, Box Assembly and Testing Services Fact Sheet February 2009 INTRODUCTION PRODUCTION CAPABILITIES Aeroflex Plainview for over thirty-five years has been a leader in the microelectronic packaging arena. Our MCM technology
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
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DCDD SOT23-5
Abstract: corning frequency oven marking code H.5 Sot 23-5 10134 motorola MARKING BB SOT23-5 Newmarket Transistors
Text: MCCF33095 MC33095 Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V alternator charging systems. Few external components are required for full
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MCCF33095
MC33095
MCCF33095
DCDD SOT23-5
corning frequency oven
marking code H.5 Sot 23-5
10134 motorola
MARKING BB SOT23-5
Newmarket Transistors
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Untitled
Abstract: No abstract text available
Text: UbE D SILICON SYSTEMS INC • aaSB'ibS Q00S27b 0 ■ SIL T -Y 2-7? CUSTOM SOLUTIONS s m m s iis k m s A TDK Group/Company SILICON SYSTEMS LEADS THE WAY DEVELOPING MIXED-SIGNAL CUSTOM PRODUCTS. Faster to market for mixed-signal applications Whatever your mixed-signal design application, Silicon
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Q00S27b
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TC180G21
Abstract: TC180G TC160G single port RAM TC180 0724 XBRL16 toshiba ASIC
Text: TOSHIBA TC180 Series CMOS ASIC Family 3.0V/3.3V, 0.5nm1 The TC180 series increases system performance and device integration while reducing power. Benefits • True 3.0/3.3V 0.5 micron CMOS process with fast 230ps gate delays • Reduced power consumption makes lower cost plastic packag
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TC180
230ps
TC160G
TDR7247
TC180G21
TC180G
single port RAM
0724
XBRL16
toshiba ASIC
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TOSHIBA GATE ARRAY
Abstract: TC183e Rambus ASIC Cell tc183
Text: TOSHIBA TC183G/E CMOS ASIC Family 3.0V/3.3V and 5.0V, 0.5nm1 TheTC183G/E eases the transition from 5V to 3V based systems. Benefits • Mixed 3.0/3.3V and 5V I/O 0.5 micron CMOS process with fast 230ps gate delay performance with the pow er savings of a 3V core
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TC183G/E
TheTC183G/E
230ps
TC160G
TC163G
0D2D747
TOSHIBA GATE ARRAY
TC183e
Rambus ASIC Cell
tc183
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tc183
Abstract: E17G tc183G TC163G TC180G single port RAM TC183e Toshiba TC8570
Text: TOSHIBA TC183G/ECMOS ASIC Family 3.0V/3.3V and 5.0V, 0.5nm1 TheTC183G/E eases the transition from 5V to 3V based systems. Benefits • Mixed 3.0/3,3V and 5V I/O 0.5 micron CMOS process with fast 230ps gate delay performance with the power savings of a 3V core
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TC183G/ECMOS
TheTC183G/E
230ps
TC160G
TC163G
tc183
E17G
tc183G
TC180G
single port RAM
TC183e
Toshiba TC8570
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