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    AMB1608C3600Z10A

    Abstract: AMB1608C2450Z05 AMB1608C3600Z05 AMB1608C2450
    Text: MD-MDJ009-0912 積層チップバラン AMB1608 シリーズ [特長] „ „ „ [用途] 小型低背化 1.6mm x 0.8mm x 0.6mm 低損失化 (0.6dB typ. /C2450series) RoHS 指令対応 „ „ „ 無線 LAN, Bluetooth モジュール WiMAX,WiBro モジュール


    Original     		MD-MDJ009-0912 AMB1608 /C2450series) AMB1608C1905Z10AT AMB1608C1960Z10AT AMB1608C2350Z05AT AMB1608C2350Z10AT AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C2500Z05 AMB1608C3600Z10A AMB1608C3600Z05 AMB1608C2450 PDF

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    Abstract: No abstract text available
    Text: MD-MDE009-0912 Multilayer Chip Balun: AMB1608 Series Device Features „ „ „ Applications Miniature Size and Low Profile 1.6mm x 0.8mm x 0.6mm Low Insertion Loss (0.6dB typ. /C2450series) RoHS Compliant Wireless LAN, Bluetooth module WiMAX , WiBro „ „


    Original     		MD-MDE009-0912 AMB1608 /C2450series) AMB1608C1905Z10AT AMB1608C1960Z10AT AMB1608C2350Z05AT AMB1608C2350Z10AT AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C2500Z05 PDF