CS-007
Abstract: Amkor Electronics Amkor mold compound
Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld
|
Original
|
|
PDF
|
E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
|
Original
|
DS577G
E700G
|
PDF
|
jedec package MO-247
Abstract: Amkor TSCSP MO-247 coreless substrate DS813
Text: data sheet advanced product development tsCSP Features: Thin Substrate CSP tsCSP : Very Thin, Superior Performance, Cost Effective Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard
|
Original
|
|
PDF
|
jedec package MO-247
Abstract: MO-247 DS813B Amkor TSCSP DS813
Text: data sheet advanced product development tsCSP Features: Thin Substrate CSP tsCSP : Very Thin, Superior Performance, Cost Effective Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard
|
Original
|
|
PDF
|
amkor exposed pad
Abstract: exposed QFP 128 amkor exposed QFP 144
Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small
|
Original
|
|
PDF
|
amkor
Abstract: amkor exposed pad
Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)
|
Original
|
DS571J
|
PDF
|
JEDEC Jc-11 free
Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
Text: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new
|
Original
|
wirebon00
JEDEC Jc-11 free
PSVFBGA
FCCSP
0.3mm pitch csp package
Amkor Technology
amkor flip
Amkor CSP mold compound
Amkor Wafer level mold compound
0.65mm pitch BGA
mold cap
|
PDF
|
laptop ic list
Abstract: NS6040 contactor Amkor Technology handler
Text: data sheet TEST CONTACTOR FusionQuad Test Contactor Test Hardware List: Amkor FusionQuad® Test Contactor: Amkor Technology is now offering the FusionQuad® Test Contactor Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective
|
Original
|
NS6040
DS815B
laptop ic list
contactor
Amkor Technology
handler
|
PDF
|
MS-026
Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is
|
Original
|
|
PDF
|
QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
|
Original
|
|
PDF
|
DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
|
Original
|
|
PDF
|
CY7C65630
Abstract: CY4602A CY4602 CY4605 CY7C65620 CY7C65640A CY7C656XX usb esd eye pattern
Text: Application Note AN5044 CY7C656xx PCB Design Recommendations Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,
|
Original
|
AN5044
CY7C656xx
CY7C65620/30
CY7C65640A,
CY7C65630,
CY7C65620
AN5044
CY7C65630
CY4602A
CY4602
CY4605
CY7C65640A
usb esd eye pattern
|
PDF
|
joint filler board
Abstract: thick bga die size Amkor mold compound MS-034 amkor flip with or without underfill
Text: LAMINATE data sheet FCMBGA Thermal Performance: Flip Chip Molded Ball Grid Array FCMBGA Packages: FCMBGA packages are designed to allow die protrusion over the mold cap. This ensures the thinnest bond line and best thermal impedance between the FC die and the attached heat sink.
|
Original
|
|
PDF
|
|
|
CY4602
Abstract: physical layer design for USB 2.0 USB 2.0 HUB CY7C65630 "4 port" passive hub magic eye schematic diagram 48v dc motor speed controller usb common mode choke CY7C65620 CY7C65640A
Text: Application Note AN5044 CY7C656xx PCB Design Recommendations Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,
|
Original
|
AN5044
CY7C656xx
CY7C65620/30
CY7C65640A,
CY7C65630,
CY7C65620
AN5044
CY4602
physical layer design for USB 2.0
USB 2.0 HUB
CY7C65630
"4 port" passive hub
magic eye
schematic diagram 48v dc motor speed controller
usb common mode choke
CY7C65640A
|
PDF
|
MO-153
Abstract: JEDEC MO-153 38 MO-187 MO-194
Text: LEADFRAME data sheet ExposedPad TSSOP Features: ExposedPad TSSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard TSSOP packages. The ExposedPad TSSOP can increase heat dissipation
|
Original
|
|
PDF
|
CY7C65630
Abstract: CY7C65620 CY4602 CY4605 CY7C65640A CY7C656XX
Text: Application Note AN5044 CY7C656xx PCB Design Recommendations - AN5044 Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,
|
Original
|
AN5044
CY7C656xx
CY7C65620/30
CY7C65640A,
CY7C65630,
CY7C65620
CY7C65630
CY4602
CY4605
CY7C65640A
|
PDF
|
CY7C65630
Abstract: CY4602 CY4605 CY7C65620 CY7C65640A CY7C656XX
Text: EZ-USB Hubs CY7C656XX PCB Design Recommendations AN5044 Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/CY7C65630/CY7C65640A Software Version: None Associated Application Notes: None Application Note Abstract AN5044 presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630, and
|
Original
|
CY7C656XX)
AN5044
CY7C65620/CY7C65630/CY7C65640A
AN5044
CY7C65640A,
CY7C65630,
CY7C65620
CY7C65630
CY4602
CY4605
CY7C65640A
CY7C656XX
|
PDF
|
MS-029
Abstract: 144 QFP body size amkor
Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit
|
Original
|
out029
MS-029/022
MS-029
144 QFP body size
amkor
|
PDF
|
outline of the heat slug for JEDEC
Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
Text: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit
|
Original
|
MS-029/022
outline of the heat slug for JEDEC
heat slug for JEDEC
JEDEC Matrix Tray outlines
MS-029
QFP JEDEC tray
amkor exposed pad
245C
amkor
|
PDF
|
MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
|
Original
|
|
PDF
|
ic packages
Abstract: MO-137
Text: LEADFRAME data sheet ExposedPad SOIC/SSOP Features: ExposedPad SOIC/SSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power-constrained standard SOIC and SSOP packages. The ExposedPad SOIC/ SSOPs can increase heat dissipation by
|
Original
|
MS-012
MO-137
ic packages
MO-137
|
PDF
|
Amkor Technology 1999
Abstract: JESD51-1 QFN PACKAGE Junction to PCB thermal resistance JESD51-4 HFAN-08-1 AN569 JESD51-2 JESD51-3 SLMA002 thermal analysis on pcb
Text: Application Note: HFAN-08.1 Rev.1; 04/08 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested
|
Original
|
HFAN-08
JESD51-7:
JESD51-8:
JESD51-9:
JESD51-10:
SZZA017A,
Amkor Technology 1999
JESD51-1
QFN PACKAGE Junction to PCB thermal resistance
JESD51-4
HFAN-08-1
AN569
JESD51-2
JESD51-3
SLMA002
thermal analysis on pcb
|
PDF
|
JESD51-1
Abstract: "thermal via" QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance JESD51-3 SLMA002 AN569 JESD51-2
Text: Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested
|
Original
|
HFAN-08
4hfan081
JESD51-7:
JESD51-8:
JESD51-9:
JESD51-10:
SZZA017A,
JESD51-1
"thermal via"
QFN "100 pin" PACKAGE thermal resistance
QFN PACKAGE thermal resistance
JESD51-3
SLMA002
AN569
JESD51-2
|
PDF
|
