"0.4mm" bga "ball collapse" height
Abstract: BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package 304 QFP amkor BGA and QFP Package ibm paste profile pitch 0.4mm BGA pcb warpage* in smt reflow Amkor SBGA
Text: Applications Notes on Surface Mount Assembly of Amkor/Anam PBGA and SuperBGA Packages Paul Mescher October, 1995 amkor anam 1347 N. Alma School Road Chandler, AZ 85224 1.0 Introduction Ball Grid Array packages provide a new challenge for the surface mount industry. In all
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Amkor SBGA
Abstract: JEDEC Matrix Tray outlines MO-192 copper bond wire amkor CO-029 jedec bga tray MO192 192 BGA PACKAGE thermal resistance
Text: LAMINATE data sheet SuperBGA Features: SuperBGA® SBGA Packages: The SuperBGA® (SBGA) technology provides a cavity down, high-power BGA package. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated,
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EL B17 A017
Abstract: EL B17 C007 CodeTAP manual W002 SLOT PGA 370 applied microsystems power tap probe tip EL B17 C012 ampliflex D-10 EL B17 C017
Text: Rev. 4 80960Rx Debug Connector Design Guide August, 1997 Order Number: 272812-004 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s
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80960Rx
PI-PCI32/64)
80960Rx
EL B17 A017
EL B17 C007
CodeTAP manual
W002
SLOT PGA 370
applied microsystems power tap probe tip
EL B17 C012
ampliflex
D-10
EL B17 C017
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CodeTAP
Abstract: HP 16520a CodeTAP manual AMP 140 pin connector HP lcd connector 40 pin to 30 pin to 7 pin corelis JTAG CONNECTOR EL B17 C007 ampliflex SLOT PGA 370 corelis jtag
Text: 80960Rx Debug Connector Design Guide Rev. 4 April 1998 Order Number: 272812-004 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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80960Rx
PI-PCI32/64)
80960Rx
CodeTAP
HP 16520a
CodeTAP manual
AMP 140 pin connector
HP lcd connector 40 pin to 30 pin to 7 pin
corelis JTAG CONNECTOR
EL B17 C007
ampliflex
SLOT PGA 370
corelis jtag
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RM5200
Abstract: MIC29302 footprint 304-SBGA Quantum Effect Devices vero PK100 IPC-D-317B QUANTUM CAPACITIVE LT1085CT LT1584 qed rm5200
Text: PCB Design Notes for the RM7000 Application Note Introduction The RM7000 is a 64-bit MIPS IV Instruction Set Architecture CPU with 48/64-entry TLB memory management unit, double precision floating point unit, a 64-bit multiplexed address and data bus which is capable of operating at up to 125 MHz .
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RM7000
RM7000
64-bit
48/64-entry
128KB
304-ball
RM5200
MIC29302 footprint
304-SBGA
Quantum Effect Devices
vero PK100
IPC-D-317B
QUANTUM CAPACITIVE
LT1085CT
LT1584
qed rm5200
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Untitled
Abstract: No abstract text available
Text: 19-1486; Rev 1; 11/01 ±5V, 600Msps, 8-Bit ADC with On-Chip 2.2GHz Bandwidth Track/Hold Amplifier The innovative design of the internal T/H, which has an exceptionally wide 2.2GHz full-power input bandwidth, results in high, 7.6 effective bits performance at the
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600Msps,
MAX106
MAX106C
25x25x0
21-0073E
H192-3*
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MAX108CHC
Abstract: No abstract text available
Text: 19-1492; Rev 1; 10/01 KIT ATION EVALU E L B AVAILA ±5V, 1.5Gsps, 8-Bit ADC with On-Chip 2.2GHz Track/Hold Amplifier The analog input is designed for either differential or single-ended use with a ±250mV input voltage range. Dual, differential, positive-referenced emitter-coupled
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750MHz
25LSB
250mV
192-Contact
MAX104
MAX106
600Msps)
MAX108
MAX108
MAX108C
MAX108CHC
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Untitled
Abstract: No abstract text available
Text: 19-1486; Rev 1; 11/01 ±5V, 600Msps, 8-Bit ADC with On-Chip 2.2GHz Bandwidth Track/Hold Amplifier The innovative design of the internal T/H, which has an exceptionally wide 2.2GHz full-power input bandwidth, results in high, 7.6 effective bits performance at the
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600Msps,
MAX106
MAX106CHC-TD
MAX106CHC-D
25x25x0
21-0073E
H192-3*
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1N5817 523
Abstract: 896KB
Text: 19-1459; Rev 2; 3/02 KIT ATION EVALU E L B AVAILA ±5V, 1Gsps, 8-Bit ADC with On-Chip 2.2GHz Track/Hold Amplifier The MAX104 PECL-compatible, 1Gsps, 8-bit analog-todigital converter ADC allows accurate digitizing of analog signals with bandwidths to 2.2GHz. Fabricated
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25LSB
250mV
192-Contact
MAX104
MAX104
MAX104C
25x25x0
1N5817 523
896KB
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TSMC 0.18 um MOSfet
Abstract: M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221
Text: DSCC Supplemental Information Sheet for Electronic QML-38535 Specification Details: Date: 9/2/2008 Specification: MIL-PRF-38535 Title: Advanced Microcircuits Federal Supply Class FSC : 5962 Conventional: No Specification contains quality assurance program: Yes
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QML-38535
MIL-PRF-38535
MIL-STD-790
MIL-STD-690
-581DSCC
QML-38535
TSMC 0.18 um MOSfet
M38510 10102BCA
IDT7204L
5962-8768401MQA
0.18um LDMOS TSMC
sl1053
TSMC 0.25Um LDMOS
UT63M125BB SMD
RTAX250S-CQ208
5962-04221
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RISC-Processor s3c2410
Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH
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BR-04-ALL-005
BR-04-ALL-004
RISC-Processor s3c2410
MR16R1624DF0-CM8
arm9 samsung s3c2440 architecture
chip 3351 dvd
sp0411n
K9W8G08U1M
sandisk micro SD Card 2GB
arm9 s3c2440
K9F1G08U0A
K6X8008C2B
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DSLAM drawing
Abstract: DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT
Text: VORTEX CHIPSET RELEASED DSLAM APPS NOTE PMC-1990816 ISSUE 1 SIGNAL INTEGRITY AND TIMING SIMULATION DSLAM DSLAM APPS NOTE: SIGNAL INTEGRITY AND TIMING SIMULATION FOR THE VORTEX CHIPSET S/UNI-DUPLEX, S/UNI-VORTEX, S/UNI-APEX AND S/UNI-ATLAS Released Issue 1
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PMC-1990816
DSLAM drawing
DSLAM board layout
hyperlynx
SIGNAL INTEGRITY AND TIMING SIMULATION
PC3T04
IDT74FCT3807
PMC-1990815
PC3B01
74LCX244MCT
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toshiba laptop schematic diagram
Abstract: acer motherboard circuit diagram MAX1270 C source code MAX11871 mp 9141 es dc-dc lm324 pwm speed motor 220v DC MOTOR SPEED CONTROLLER schematic ACER laptop schematic diagram L-band down converter for satellite tuner wideband acer laptop MOTHERBOARD Chip Level MANUAL acer laptop motherboard circuit diagram
Text: Welcome to the Maxim Full-Line Data Catalog. We hope you find this CD-ROM a helpful tool for selecting the best Maxim IC for your design. This CD-ROM contains: The Maxim Full-Line Data Catalog The menu to the left of this page lists the available documents. Use the small
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Amkor SBGA
Abstract: Amkor Technology 170A1
Text: AMI AM I mE M l C O N D U C T O R %s Packaging Capabilities SBGA Description Surface Mount $> The Super Ball Grid Array (SBGA W is a high density cavity down surface mount package for low stress operating environments. The package is comprised of a coper heat spreader to which
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126MHz
Abstract: AX104
Text: JV\y\7L\JV\ 19-1459; R ev 0; 4/9 9 ±5V, 1Gsps, 8- Bi t A DC w i t h On-Chip 2 . 2 G H z T r a c k / H o l d A m p l i f i e r _F e a t u r e s The MAX104 PECL-compatible, 1Gsps, 8-bit analog-tod ig ital co nve rte r ADC allow s a ccurate d ig itizin g of
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25LSB
192-Contact
MAX104
MAX104
126MHz
AX104
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