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    AMKOR TECHNOLOGY PBGA MOISTURE Search Results

    AMKOR TECHNOLOGY PBGA MOISTURE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-SATDRIVEX2-001 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-001 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 1m Datasheet
    CS-SATDRIVEX2-002 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-002 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 2m Datasheet
    CS-SATDRIVEX2-000.5 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-000.5 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 0.5m Datasheet
    CS-SASDDP8282-000.5 Amphenol Cables on Demand Amphenol CS-SASDDP8282-000.5 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 0.5m Datasheet
    CS-SASDDP8282-001 Amphenol Cables on Demand Amphenol CS-SASDDP8282-001 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 1m Datasheet

    AMKOR TECHNOLOGY PBGA MOISTURE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


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    nitto GE

    Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
    Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application


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    Amkor Wafer level mold compound

    Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
    Text: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm


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    l2aa

    Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
    Text: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement


    Original     		PDF CO-029) l2aa tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound

    CCL-HL832NX-A

    Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
    Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize


    Original     		PDF CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832

    IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

    Abstract: J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING PMC-970951 IPC-D-275 JESD22-A113
    Text: APPLICATION NOTE PMC-970951 ISSUE 1 PMC-Sierra,Inc. SURFACE MOUNT ASSEMBLY of PBGA/TEBGA PACKAGES SURFACE MOUNT ASSEMBLY OF PBGA/TEBGA PACKAGES Issue 1: Sept. 1997 PMC-Sierra, Inc. 105-8555 Baxter Place, Burnaby, BC Canada V5A 4V7 604 415 - 6000 PMC-Sierra,Inc.


    Original     		PDF PMC-970951 PMC-970951R1 IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING IPC-D-275 JESD22-A113

    "0.4mm" bga "ball collapse" height

    Abstract: BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package 304 QFP amkor BGA and QFP Package ibm paste profile pitch 0.4mm BGA pcb warpage* in smt reflow Amkor SBGA
    Text: Applications Notes on Surface Mount Assembly of Amkor/Anam PBGA and SuperBGA Packages Paul Mescher October, 1995 amkor anam 1347 N. Alma School Road Chandler, AZ 85224 1.0 Introduction Ball Grid Array packages provide a new challenge for the surface mount industry. In all


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    Untitled

    Abstract: No abstract text available
    Text: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe


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    DC04 display

    Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
    Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79


    Original     		PDF DC04-0001 DC04 display how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt

    CM16C550P

    Abstract: 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP
    Text: Rev. 2.1 i960 Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF 74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP

    tsmc 0.35um 2p4m cmos

    Abstract: K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC
    Text: Quality And Reliability Report 2004 Period Covered: 2003


    Original     		PDF DC04-0001 tsmc 0.35um 2p4m cmos K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC

    KSZ8041

    Abstract: LM2576 MTBF vcsel spice model MIC4129 mic44r22 ksz8692 MICREL MIC marking DFB laser diode spice model KSZ9021RLI KSZ8041TLI
    Text: Military Catalog May 2009 Dear Valued Customer, Micrel is an enduring DSCC certified company that has, for many years, provided Mil-Std-883B products in hermetic ceramic packages. We have also provided products governed by source controlled drawings SCD where baseline control is important. Our in-house, U.S.-based wafer


    Original     		PDF Mil-Std-883B M0014-051409 KSZ8041 LM2576 MTBF vcsel spice model MIC4129 mic44r22 ksz8692 MICREL MIC marking DFB laser diode spice model KSZ9021RLI KSZ8041TLI

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160