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    SA57-IHZ

    Abstract: No abstract text available
    Text: AN51 APEX – AN51 AN51 Thermal Modeling of Power Devices Product Innovation From in a Surface Mount Configuration Thermal Modeling of Power Devices in a Surface Mount Configuration Introduction This Application Note demonstrates how to develop a thermal model for power ICs. It then explains how the modeling of power ICs can be used to calculate the maximum power delivery possible during normal operation.


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    AN51U SA57-IHZ PDF