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    Text: ANLPS204 MIC45208-1/MIC45208-2 52-Lead H4QFN 10mm x 10mm Package Soldering Guidelines Introduction This document provides a simplified guideline focused on the solderability process for the MIC45208 power module. It is intended to assist with the PCB layout design and should be used in conjunction with the MIC45208


    Original     		ANLPS204 MIC45208-1/MIC45208-2 52-Lead MIC45208 MIC45208 PDF