Untitled
Abstract: No abstract text available
Text: Computer modeling of transport phenomena in RF ablation applicator Adriana Druma, PhD Aavid Thermalloy 1 2015 ANSYS, Inc. April 20, 2015 ANSYS Confidential Company information Aavid is a privately held company, founded in 1964 as Aavid Engineering Aavid has been the world leader in thermal management solutions and partner of choice for electronics
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sun* sparcstation 20
Abstract: HP 9000 A500 Motherboard dell precision 690 Accelgraphics aic-7880 ansys TD-400 pentium pro memory management indigo mechanical engineering project
Text: Pentium Pro Processor Workstation Performance Brief June 1997 Order Number: 242999-003 Pentium Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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com/r5000/R5000
sun* sparcstation 20
HP 9000 A500
Motherboard dell precision 690
Accelgraphics
aic-7880
ansys
TD-400
pentium pro memory management
indigo
mechanical engineering project
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Application Note Document Number: AN4473 Rev. 1.0, 9/2012 Compact Thermal Model for Dual 24 V High Side Switch Family 1 Introduction This application note describes the R/C thermal models of the MC06XS4200, MC10XS4200, and MC20XS4200 devices.
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AN4473
MC06XS4200,
MC10XS4200,
MC20XS4200
16-bit
STR0326182960
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Motherboard dell precision 690
Abstract: aic-7880 RS6000 ibm 478 motherboard HP 9000 A500 Motherboard dell seagate logic board seagate hard disks seagate ST15150N Accelgraphics
Text: Pentium Pro Processor Workstation Performance Brief September 1996 Order Number: 242999-001 Pentium Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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com/r5000/R5000
Motherboard dell precision 690
aic-7880
RS6000
ibm 478 motherboard
HP 9000 A500
Motherboard dell
seagate logic board
seagate hard disks
seagate ST15150N
Accelgraphics
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ansys darveaux
Abstract: JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333
Text: Proceedings of IPACK2005 Proceedings of IPACK2005 ASME InterPACK '05 ASME InterPACK July 17-22, San Francisco, California,'05 USA July 17-22, San Francisco, California, USA IPACK2005-73239 IPACK2005-73239 Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD
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IPACK2005
IPACK2005-73239
ansys darveaux
JXA8900R
IPACK2005-73239
pitarresi
53RD
IPACK2005
Ansys led
5800-LV
SMD 5AG
A333
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ansys darveaux
Abstract: pitarresi ansys optimization BGA Ball Crack 8L-10L
Text: Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family L. Zhang, R. Sitaraman*, V. Patwardhan, L. Nguyen, and N. Kelkar National Semiconductor Corporation 3707 Tahoe Way, M/S 19-100 Santa Clara, CA 95051
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Untitled
Abstract: No abstract text available
Text: Quick Reference Guide High Speed Backplane Interconnect Solutions The emergence of faster data rates, and decreasing signal rise times, requires better performing, high speed connectors. TE Connectivity’s broad portfolio of high speed backplane connectors provides system designers the flexibility they require to solve their
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BUSBAR calculation
Abstract: BUSBAR calculation datasheet rogers busbar Ansys led A copper busbar voltage drop i300a busbar design ansys BUSBAR Fz2400
Text: Thermal Properties of Power Terminals in High Power IGBT Modules A. Cosaert1, M. Beulque1, M. Wölz2, O. Schilling2, H. Sandmann2, R. Spanke2, K. Appelhoff2 1 2 Rogers NV, Gent, Belgium eupec GmbH, Warstein, Germany Abstract Power dissipation in the leads of IGBT modules has to be taken into account for modern inverter design. This is
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intel+Socket+775+pinout
Abstract: MEGTRON 6
Text: Design Guidelines for 100 Gbps - CFP2 Interface 2014.01.16 AN-684 Subscribe Send Feedback This document shows an example layout design that implements a 4 x 25/28 Gbps CFP2 module interface that meets the insertion and return loss mask requirements proposed in the working clause draft version
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AN-684
CEI-28G-VSR.
CEI-28G-VSR
transcei-28G-VSR
intel+Socket+775+pinout
MEGTRON 6
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ansys optimization
Abstract: ansys economic industry and company analysis NEC Systems computer engineering msc diode ansys cfd hp inkjet chip
Text: Manufacturing Industry Solutions on HPC Platforms Dr. Paresh G. Pattani Vice President NEC Systems, Inc. Overview l HPC Solutions for Manufacturing Industry l NEC HPC Platforms Offerings l Intel Itanium processor- based NEC server AzusA l ISV Applications Enabling Plans
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Express5800,
ansys optimization
ansys
economic industry and company analysis
NEC Systems
computer engineering
msc diode
ansys cfd
hp inkjet chip
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alutronic
Abstract: ikcs22f60 IKCS22F60xx igbt subcircuit IGBT1 infineon
Text: Application Note, V1.1, September 2008 Control integrated Power System CIPOS Thermal Performance of the IKCS22F60xx AN-CIPOS-2 Author: P. Türkes http://www.infineon.com/CIPOS Power Management & Drives N e v e r s t o p t h i n k i n g Control integrated Power System (CIPOS™)
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IKCS22F60xx
alutronic
ikcs22f60
IKCS22F60xx
igbt subcircuit
IGBT1 infineon
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Untitled
Abstract: No abstract text available
Text: High Voltage RF LDMOS Technology for Broadcast Applications S.J.C.H. Theeuwen, W.J.A.M. Sneijers, J.G.E. Klappe, J.A.M. de Boet NXP Semiconductors, Gerstweg 2, 6534 AE, Nijmegen, The Netherlands steven.theeuwen@nxp.com, walter.sneyers@nxp.com, jos.klappe@nxp.com, jan.de.boet@nxp.com
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0-50V)
00-500W
IEDM2006,
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Altera Flip Chip BGA warpage
Abstract: thick bga die size crack flip chip ajinomoto Flip Chip Substrate DSASW0010612 ansys BGA cte underfill with or without underfill
Text: Accurate Predictions of Flip Chip BGA Warpage Yuan Li Altera Corporation 101 Innovation Dr, M/S 4202 San Jose, CA 95134 ysli@altera.com, 408 544-7508 Abstract Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and
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CY27S03A
Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability
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CY7C122
CY27S03A
15JC10
CY7C190
cy7c9101
cy7c122 die
VIC068A user guide
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V3300
Abstract: V3400 V5200 V7200 V7350 7811 world
Text: 7811 FireGLV3300DS v2 5/10/06 10:45 AM Page 1 Entry-Level | 128MB • Powered by ATI’s next generation FireGL graphics processor unit with Avivo™ Technology • Scalable ultra-threaded architecture with 2 Parallel Geometry Engines and 4 Pixel Shader Processors
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FireGLV3300DS
128MB
128MB
10-bit
16-bit
V3300
V3400
V5200
V7200
V7350
7811 world
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Rotary Power Generators
Abstract: rotating rectifier ansys bridge rectifier 500a, 217F 600V300A full wave rectifier 1 PHASE
Text: Rotary Power Generators Sensitron • 221 West Industry Court · Deer Park, NY 11729-4681 · Phone 631 586 7600 · Fax (631) 242 9798 · World Wide Web - www.sensitron.com · E-mail - sales@sensitron.com 148-1007 Rotating Rectifier Assemblies Sensitron www.sensitron.com/rotating.asp
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160oC
Rotary Power Generators
rotating rectifier
ansys
bridge rectifier 500a,
217F
600V300A
full wave rectifier 1 PHASE
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LD-CU3536AF
Abstract: photometric data lamps hanging pendant Ansys led indoor ceiling fixture Cree optics pendant incandescent luminaire pendant
Text: Cree XLamp MP-L EasyWhite Pendant Luminaire Reference Design Application Note This application note demonstrates a remarkably simple way to incorporate the Cree XLamp® MP-L EasyWhite™ LED into a pendant light, a popular hanging luminaire that has traditionally used A-form incandescent bulbs and
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CLD-AP40
LD-CU3536AF
photometric data lamps
hanging pendant
Ansys led
indoor ceiling fixture
Cree optics
pendant
incandescent luminaire pendant
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ansys
Abstract: tyra 2.5mm DC power jack Ansys led
Text: Cree XLamp® MP-L EasyWhite Referenzdesign für Pendelleuchten Anwendungsempfehlung Die vorliegende Anwendungsempfehlung zeigt eine denkbar simple Methode zur Integration der Cree XLamp® MP-L EasyWhite™ LED in eine Pendelleuchte, eine beliebte Hängelampe, bei der traditionell A-Lampen
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CLD-AP40
ansys
tyra
2.5mm DC power jack
Ansys led
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underfill
Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate
Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package
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12x10-6
17x10-6
6x10-6
underfill
cte table flip chip substrate
ansys darveaux
with or without underfill
FR4 substrate height and thickness
cte table bga
cte table
63Sn37Pb
application for bt 151
FR4 substrate
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ansys
Abstract: ansys optimization WIN32 pentium "II Xeon" ON733 Pentium II Xeon cosmos 2000
Text: Intel Corporate Standard for On-screen presentations. Math Kernel Library Intel Corporation November, 1999 Copyright 1999, Intel Corporation. All rights reserved. G-Number The Math Kernel Library MKL has been developed by Intel as part of its emphasis on tools (compilers, VTune analyzer) and libraries which
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V5200
Abstract: ATI FireGL V5200 dvi dual link V3300 V3400 V7200 V7350 maxon ati shader v5200 ati
Text: 7809 FireGLV5200DS v2 5/8/06 11:34 AM Page 1 Mid-Range | 256MB • Powered by ATI’s next generation FireGL graphics processor unit with Avivo™ Technology • Scalable ultra-threaded architecture with 5 Parallel Geometry Engines and 12 Pixel Shader Processors
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FireGLV5200DS
256MB
256MB
256-bit
10-bit
16-bit
V5200
ATI FireGL V5200
dvi dual link
V3300
V3400
V7200
V7350
maxon
ati shader
v5200 ati
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IRF830
Abstract: No abstract text available
Text: IRF830 Iß ANSYS Power Field Effect Tïansistor aiCTRomcs LIMITED N-Channel Enhancement Mode • Silicon Gate for Fast Switching Speeds • Low R d s oii to Minimize On-Losses, Specified at Elevated Temperature • Rugged — SO A is Power Dissipation Limited
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IRF830
IRF830
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BDX54
Abstract: BDX54C BDX54 circuit BDX53 BDX53A BDX53B BDX53C BDX54A BDX54B
Text: c i h ANSYS BDX54, BDX54A, BDX54B, BDX54C PNP SILICON POWER DARLINGTONS m C TR O M C S LIMITED • Designed for Complementary Use with BDX53, BDX53A, BDX53B and BDX53C • 60 W at 25°C Case Temperature • 8 A Continuous Collector Current TO-220 PACKAGE TOP VIEW
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BDX54,
BDX54A,
BDX54B,
BDX54C
T0-220
BDX53,
BDX53A,
BDX53B
BDX53C
BDX54
BDX54C
BDX54 circuit
BDX53
BDX53A
BDX53C
BDX54A
BDX54B
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SC2092-400-15
Abstract: SC2092-600-15
Text: íh ANSYS QP OftQO QFRIFQ m CTRO M CS SILICON CONTROLLED RECTIFIERS L I M I T E D LP PACKAGE TOP VIEW 2 A Continuous On-State Current 15 A Surge-Current G Glass Passivated Wafer A K 400 V to 600 V Off-State Voltage Max lGT of 200 |jA LP PACKAGE WITH FORMED LEADS
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SC2092-400-15
SC2092-600-15
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