ANSYS DARVEAUX Search Results

ANSYS DARVEAUX Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
FLAC1000		Amphenol Communications Solutions	FLA Shorting Cap NEMA ANSI C136.41, Shorting Contacts
FLBC70354001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, Black
FLBC70602001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 60mm Height, Clear
FLBC70756001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 75mm Height, Translucent
FLBC70134001		Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 130mm Height, Black

ANSYS DARVEAUX Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
ansys darveaux Abstract: pitarresi ansys optimization BGA Ball Crack 8L-10L Text: Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family L. Zhang, R. Sitaraman*, V. Patwardhan, L. Nguyen, and N. Kelkar National Semiconductor Corporation 3707 Tahoe Way, M/S 19-100 Santa Clara, CA 95051	Original	PDF
ansys darveaux Abstract: JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333 Text: Proceedings of IPACK2005 Proceedings of IPACK2005 ASME InterPACK '05 ASME InterPACK July 17-22, San Francisco, California,'05 USA July 17-22, San Francisco, California, USA IPACK2005-73239 IPACK2005-73239 Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD	Original	PDF	IPACK2005 IPACK2005-73239 ansys darveaux JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333
underfill Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package	Original	PDF	12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate
General Micro-electronics Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director	Original	PDF
ipc 9704 Abstract: IPC-9702 strain gage test ipc 9702 FR4 1.6mm substrate ansys darveaux CP-01011-1 solder joint IPC9702 strain rosette Text: MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING Anurag Bansal, Yuan Li, and Vadali Mahadev Altera Corporation 101 Innovation Drive M/S 4101, San Jose, CA 95134, USA abansal@altera.com ABSTRACT This study addresses the effects of varying configurations in	Original	PDF	IPC-9702 ipc 9704 strain gage test ipc 9702 FR4 1.6mm substrate ansys darveaux CP-01011-1 solder joint IPC9702 strain rosette