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    APR5000 Search Results

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    APR5000 Price and Stock

    Pulse Electronics Corporation BPF2012LRAPR5000L

    2012 5GHZ BPF TYPEAP
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    DigiKey BPF2012LRAPR5000L Reel 16,000
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    Avnet Americas BPF2012LRAPR5000L Reel 9 Weeks 4,000
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    • 10000 $0.0923
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    Newark BPF2012LRAPR5000L Reel 4,000
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    Sager BPF2012LRAPR5000L 1
    • 1 $0.1016
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    • 1000 $0.1016
    • 10000 $0.0855
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    Metcal APR-5000

    Soldering Irons Apr Rework Sys 1Zone No Control/Monitor
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics APR-5000
    • 1 $54926.99
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    Metcal APR-5000-XLS-ML

    Apr-5000-Xls, with Control/Monitor, Multilanguage |Metcal APR-5000-XLS-ML
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark APR-5000-XLS-ML Bulk 1
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    APR5000 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    metcal apr 5000

    Abstract: NZA-555-555-CGA APR-5000 APR-5000-XLS APR-5000-XL reflow temperature bga laptop NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA LGA rework
    Text: Advance Package Rework Systems OK O K I N T E R N A T I O N A LT M T o o l s OK International has been a leading manufacturer of tools for the electronics assembly work bench for almost 60 years. And, as the industry has evolved, our rework and repair tools have


    Original     		PDF APR-5000 BRO-APR-US-05 metcal apr 5000 NZA-555-555-CGA APR-5000 APR-5000-XLS APR-5000-XL reflow temperature bga laptop NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA LGA rework

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    HG3002LCD

    Abstract: APR-5000 Steinel steinel "air gun" reflow profile metcal heat gun desoldering
    Text: VISHAY SILICONIX Power MOSFETs Application Note 839 Guidelines for Handling Failed Power MOSFETs on PCB Assemblies By Kandarp Pandya INTRODUCTION When a power MOSFET fails, the challenge is to determine the root cause of failure and implement a containment plan.


    Original     		PDF HG3002LCD 15-Jun-10 APR-5000 Steinel steinel "air gun" reflow profile metcal heat gun desoldering

    JESD22-A113

    Abstract: QFN-20 reflow ipc-SM-782 JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
    Text: Silicon Laboratories SMT Soldering Guidelines for MCU Products SCOPE: For all of the Silicon Laboratories Microcontroller Products in QFN, TQFP/LQFP, and PDIP packages. I. SMT Soldering Considerations for QFN Packages • See the CARSEM QFN application note, which can be found at http://www.carsem.com/.


    Original     		PDF IPC-SM-782 APR-5000 QFN-24 -QFN11 JESD22-A113 QFN-20 reflow JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		PDF SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000

    74397

    Abstract: steinel HG3002LCD steinel "air gun" APR-5000 AN828 AR5000 SiE802DF Simple test MOSFET Procedures PolarPAK WEIGHT
    Text: AN828 Vishay Siliconix Working With PolarPAK In-Lab Soldering and Re-Working Recommendations By Kandarp Pandya INTRODUCTION ® PolarPAK , a new-generation Vishay Siliconix power MOSFET package, offers double-sided cooling with a metal surface on both the top and bottom sides. As it


    Original     		PDF AN828 SiE802DF 21-Aug-06 74397 steinel HG3002LCD steinel "air gun" APR-5000 AN828 AR5000 Simple test MOSFET Procedures PolarPAK WEIGHT