Untitled
Abstract: No abstract text available
Text: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)
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D2196
D2240
D100ersâ
LBSA2000
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Untitled
Abstract: No abstract text available
Text: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —
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D2196
D1002
LBSA1800
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Untitled
Abstract: No abstract text available
Text: Bond-Ply 660P Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape Features and Benefits Configurations Available: Polyimide Film Polyimide Film — Thickness inch / (mm) 0.008 0.203 ASTM D374 Glass Transition (°F) / (°C) TEST METHOD
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E1356
D1002
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Untitled
Abstract: No abstract text available
Text: DC0037/01/PC99AL-0.10-0.1 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss
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DC0037/01/PC99AL-0
PC99AL
D5470
DC0037/01
DC0037/02
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Untitled
Abstract: No abstract text available
Text: DC0041/01/PC99AL-0.10-0.1 Die Cut PCM Resistor Pad Features Low thermal resistance Natural tack Applications Resistor Pad REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss
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DC0041/01/PC99AL-0
PC99AL
D5470
DC0041/01
DC0041/02
DC0041/03
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Untitled
Abstract: No abstract text available
Text: DC0036/01/PC99AL-0.10-0.1 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss
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DC0036/01/PC99AL-0
PC99AL
D5470
DC0036/01
DC0036/02
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Untitled
Abstract: No abstract text available
Text: DC0040/01/PC99AL-0.10-0.1 Die Cut PCM SCR Darlington Module Features Low thermal resistance Natural tack Applications SCR Darlington Module REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374
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DC0040/01/PC99AL-0
PC99AL
D5470
DC0040/01
DC0040/02
DC0040/03
DC0040/04
DC0040/05
DC0040/06
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bergquist
Abstract: astm D149 ASTM-D-3386 D149 BP100 D1002 D374 D412
Text: Bond-Ply 100 Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape Features and Benefits Fiberglass Fiberglass — 0.005, 0.008, 0.011 0.127, 0.203, 0.279 ASTM D374 Temp. Resistance, 30 sec. °F / (°C) 392 200 — Elongation (%45° to Warp & Fill)
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Abstract: No abstract text available
Text: DC0038/01/PC99AL-0.10-0.1 Die Cut PCM Relay Pad Features Low thermal resistance Natural tack Applications Relay Pad REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss
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DC0038/01/PC99AL-0
PC99AL
D5470
DC0038/01
DC0038/02
DC0038/03
DC0038/04
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Untitled
Abstract: No abstract text available
Text: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
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L37-3L
L37-3L
D2240
10psi
D5470
50psi
100psi
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Untitled
Abstract: No abstract text available
Text: GT20 High Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs
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20psi
400psi)
D5470
D2240
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Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
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d412
Abstract: No abstract text available
Text: TG4040S High Performance Thermal Interface Materials Features Low hardness Naturally tacky Low oil bleed Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc. DDR II Module / DVD Applications / Hand-Set applications etc.
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TG4040S
D5470
D2250
10psi
50psi
100psi
d412
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Untitled
Abstract: No abstract text available
Text: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
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L37-3L
L37-3L
D2240
10psi
D5470
50psi
100psi
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Untitled
Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible
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HT-04503
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Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible
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MP-06503
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Untitled
Abstract: No abstract text available
Text: GT30 High Thermal Conductivity Glassfiber Reinforcement Features Natural tack Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs
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20psi
400psi)
D5470
D2240
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Untitled
Abstract: No abstract text available
Text: GT15 Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Electrically isolating Complies with UL standards
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20psi
400psi)
D5470
D2240
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bergquist
Abstract: bergquist silpad
Text: Sil-Pad Tubes Silicone-Based,Thermally Conductive Tubes Features and Benefits TYPICAL PROPERTIES OF SIL-PAD TUBE 400 PROPERTY Color • Thermal conductivity: SPT 400 – 0.9 W/m-K SPT 1000 – 1.2 W/m-K • For clip-mounted plastic power packages IMPERIAL VALUE
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D2240
D1458
bergquist
bergquist silpad
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Untitled
Abstract: No abstract text available
Text: Li-2000 Thermal Tape on rolls Features Good adhesion Low contact thermal impedance High thermal conductivity High bond strength High temp-long term stability Electrically insulating Applications Electronic components: IC / CPU / MOS / LED / M/B / P/S / Heat Sink
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Li-2000
D5470
10psi
30psi
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Untitled
Abstract: No abstract text available
Text: Ti900 Thermally Conductive Insulators on rolls Features High Insulation Strength Low thermal resistance Easy to assemble Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.
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Ti900
D5470
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comparative tracking index ceramic
Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible
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HT-07006
comparative tracking index ceramic
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UL796
Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data HPL-03015 HIGH POWER LIGHTING DIELECTRIC Superior Dielectric Lowers Operating Temperatures Benefits • Very low thermal resistance of 0.02°Cin2/W (0.13°Ccm2/W) • High thermal conductivity of 3.0 W/m-K • High temperature applications
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HPL-03015
UL796
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ASTM d882
Abstract: ASTM A 527 m astm D150 J D882 602-50 ASTM d792 d1922 LEXAN 175 polycarbonate film D882 D882 SPECIFICATION
Text: GE Advanced Materials Specialty Film & Sheet LEXAN* FR25A Film Product Datasheet Description LEXAN FR25A flam e-retardant film Is an opaque, th ln -gau ge polycarbonate film with a velvet finish on one side and a polish finish on the other, and a UL94 V-0 listing to meet the stringent requirem ents In a wide range of electrical, electronic and transportation applications. LEXAN FR25A
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FR25A
FR25Aflame-retardantfilm
FR700
ASTM d882
ASTM A 527 m
astm D150
J D882
602-50
ASTM d792
d1922
LEXAN 175 polycarbonate film
D882
D882 SPECIFICATION
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