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Catalog Datasheet	MFG & Type	PDF	Document Tags
QFP PACKAGE thermal resistance Abstract: 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL Text: Packaging of Atmel Data Conversion Circuits Introduction This document aims at highlighting the main issues in thermal management for fast and dense devices such as the Atmel Data Conversion products ADCs and DMUX . It especially deals with packaging, electrical and thermal considerations in order to put	Original	PDF	TS83xxxxx/ AT84xxx TS81102G0 QFP PACKAGE thermal resistance 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL

Catalog Datasheet

MFG & Type

PDF

Document Tags

QFP PACKAGE thermal resistance

Abstract: 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL
Text: Packaging of Atmel Data Conversion Circuits Introduction This document aims at highlighting the main issues in thermal management for fast and dense devices such as the Atmel Data Conversion products ADCs and DMUX . It especially deals with packaging, electrical and thermal considerations in order to put

Original

PDF

TS83xxxxx/ AT84xxx TS81102G0 QFP PACKAGE thermal resistance 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL