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    AUSN SOLDER Search Results

    AUSN SOLDER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    AUSN SOLDER Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible


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    MP-06503 PDF

    Hokuriku crystal

    Abstract: No abstract text available
    Text: SMD Crystal Clock Oscillators Ultra-small SMD Type Crystal Clock Oscillators : KCO-500 Series Features Ultra-small package 5.0 mmx3.2 mm , 1.2 mm thick Power supply voltage 3.3V type High reliability is achieved by metal cap and AuSn vacuum sealing Most suitable for automatic mounting, reflow soldering


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    KCO-500 KCO-500 6864MHz 000MHz Hokuriku crystal PDF

    Hokuriku crystal

    Abstract: No abstract text available
    Text: SMD Crystal Clock Oscillators Ultra-small SMD Type Crystal Clock Oscillators : KCO-500 Series 䂓Features 䊶Ultra-small package 5.0 mm㬍3.2 mm , 1.2 mm thick 䊶Power supply voltage 3.3V type 䊶High reliability is achieved by metal cap and AuSn vacuum sealing


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    KCO-500 KCO-500 6864MHz 000MHz Hokuriku crystal PDF

    AuSn eutectic

    Abstract: AN3017 k-242 305O self-aligned AuSn solder
    Text: Procedure for Multifunction Self-Aligned Gate MSAG AuSn Eutectic Solderability 1. AN3017 Rev — Introduction The following procedure is M/A-COM’s recommended instruction for eutecticly attaching die to pedestals 2. Materials/Supplies 2.1 The following are materials and supplies required to perform eutectic soldering.


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    AN3017 AuSn eutectic AN3017 k-242 305O self-aligned AuSn solder PDF

    tanaka TS3332LD epoxy

    Abstract: tanaka TS3332LD TS3332LD tanaka epoxy remix capacitors Die Attach epoxy stamping tanaka free circuit diagram of rf id Broadband Amplifiers Application Notes, appendix 3 Thermal Epoxy
    Text: Epoxy Die Attach Considerations for HPA MMICs 1 Scope MMICs have been traditionally mounted on a RF circuit board, or directly to a plated metal carrier, using a wide range of conductive epoxies, or eutectic solder (e.g. AuGe, AuSn). Eutectic and epoxy has been used in both


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: SMD Crystal Clock Oscillators Ultra-small SMD Type Crystal Clock Oscillators : KCO-500 Series Features Ultra-small package 5.0 mmx3.2 mm , 1.2 mm thick Power supply voltage 3.3V type High reliability is achieved by metal cap and AuSn vacuum sealing Most suitable for automatic mounting, reflow soldering


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    KCO-500 KCO-500 6864MHz 000MHz PDF

    laser diode submount

    Abstract: AuSn solder submount CuW laser diode bar ausn submount AuSn
    Text: Preliminary Data sheet 60W 806nm High Power Laser Diode Bar on Submount Features BS60C-806-01 • Telecom grade AuSn mounting technology The Bookham Technology BS60C-806-01 laser diode bar on submount series has been designed to provide the high output power and high reliability required for


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    806nm BS60C-806-01 BS60C-806-01 21CFR laser diode submount AuSn solder submount CuW laser diode bar ausn submount AuSn PDF

    AuSn solder

    Abstract: No abstract text available
    Text: V i s h ay I n t e rt e c h n olog y, I n c . I INNOVAT AND TEC O L OGY AuSn Series N HN LASER DIODE SUBSTRATE MOUNTS O 19 62-2012 Resistors - Deposited Gold Tin Thin Film Patterned Substrates with Deposited Gold/Tin Pads Key Benefits • • • • • •


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    VMN-PL0464-1202 AuSn solder PDF

    Untitled

    Abstract: No abstract text available
    Text: V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 Resistors - Vishay Electro-Films LED Submounts INTRODUCTION Vishay Electro-Films, with its complete in-house capability, offers a wide variety of solutions for


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    9001/2000-registered VMN-PL0400-1204 PDF

    Untitled

    Abstract: No abstract text available
    Text: Heat Sin nks, Stand doffs s & Sh hims s •   DLI offe ers numero ous dielecttric options s to suit diifferent the ermal and electrical requirem ments! Each de evice is cu ustom tailored to the customer’’s specifica ations. Please use u the ch hecklist on the final page


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    AS9100Â PDF

    Untitled

    Abstract: No abstract text available
    Text: C02E10.pdf 03.9.2 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF


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    C02E10 1000T12 PDF

    MIL-STD-883 method 2019

    Abstract: No abstract text available
    Text: C02E9.pdf 02.4.27 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage storageand andoperating, operating,rating, rating,soldering solderingand andmounting, mounting,handling handling)ininthis thisPDF


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    C02E9 1000T12 MIL-STD-883 method 2019 PDF

    405nm LED

    Abstract: C470-XB900-A C470-XB900-B xbt-m silicon carbide LED cree bonding wire cree Au Sn eutectic C405-XB900-A C405-XB900-B CXXX-XB900-X
    Text: G•SiC Technology XBright Power Chip LED CXXX-XB900-X ® The Leader in Silicon Carbide Solid State Technology Features Applications • XBright™ Technology • General Lighting • Larger “Power Chip” Design • White LEDs • High Performance


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    CXXX-XB900-X 405nm) 470nm) OS1600 405nm LED C470-XB900-A C470-XB900-B xbt-m silicon carbide LED cree bonding wire cree Au Sn eutectic C405-XB900-A C405-XB900-B CXXX-XB900-X PDF

    AuSn solder

    Abstract: No abstract text available
    Text: TGA2501-TS 6 - 18 GHz 2.8 Watt Power Amplifier Key Features and Performance • • • • • • • Preliminary Measured Performance Bias Conditions: VD = 8 V ID = 1.2 A 34.5 dBm Midband Pout 24 dB Nominal Gain 10 dB Typical Input Return Loss 5 dB Typical Output Return Loss


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    TGA2501-TS 18Ghz, 0007-inch AuSn solder PDF

    70T50

    Abstract: No abstract text available
    Text: M04E.pdf 05.9.6 !Note Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this PDF catalog to prevent smoking and/or burning, etc. This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.


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    PDF

    flux-eutectic

    Abstract: UP78 silicon carbide LED Alpha Metals
    Text: XBright & XThin® Au/Sn Die Attachment Recommendations XBright and XThin LEDs are the latest generation of solid-state light emitting diodes available from Cree. XBright and XThin chips use a geometrically shaped Epi-down chip design combined with InGaN epitaxy and Cree’s proprietary


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    CPR3AN01 flux-eutectic UP78 silicon carbide LED Alpha Metals PDF

    PD10g

    Abstract: No abstract text available
    Text: PIN Photodiode 10Gbit/s Product Number: PD10GPM03201707 Features ƒ High Responsitivity ƒ High Sensitivity ƒ Flip-Chip Mountable ƒ Bondable ƒ Surface Sensitive General Description The PDPIN10G is a PIN diode on InP to be exposed from the surface AR-coating . It is suitable for 10Gbit/s


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    10Gbit/s PD10GPM03201707 PDPIN10G 10Gbit/s 1260nm 1565nm, PD10GPM03201707 SM/7100-03 PD10g PDF

    Untitled

    Abstract: No abstract text available
    Text: PIN Photodiode 4Gbit/s Product Number: PD4G0PM06001707 Features ƒ High Responsitivity ƒ High Sensitivity ƒ Flip-Chip Mountable ƒ Bondable ƒ Surface Sensitive General Description This product is a PIN diode on InP to be exposed from the surface AR-coating . It is suitable for up to 4Gbit/s


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    PD4G0PM06001707 10Gbit/s 1260nm 1565nm, PD4G0PM06001707 SM/7100-07 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thin Film North America Review of Select Products - 2009 THIN FILM NA RESISTORS PRECISION DIVIDERS AND NETWORKS MATCHED PAIRS MP, MPM, MPD SC70, SOT23, SOT143 SERIES MATCHED NETWORKS ORN, NOMC, OSOP (SOIC 8, 14, 16, 20) SERIES CSO CUSTOMS MARKET TRENDS ¾ TRANSITIONING AWAY FROM CUSTOMS TO STANDARD OFF-THE-SHELF VALUES


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    OT143) OT-23, OT-143 com/doc/61081 VMN-PT9187-0605 PDF

    Untitled

    Abstract: No abstract text available
    Text: TGA2502 13 - 15 GHz 4W Power Amplifier Key Features • • • • • • 0.5 um pHEMT Technology >25 dB Nominal Gain >36 dBm Nominal Psat 44 dBm Nominal IP3 @ 14 GHz Bias 7V @ 1.3A Idq, 2.1A under RF drive Chip Dimensions 2.5mm x 2.7mm x 0.1 mm Chip Dimensions 2.5 mm x 2.7 mm x 0.1 mm


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    TGA2502 PDF

    C395-XB290-E400-B

    Abstract: UV led 220 nm peak silicon carbide LED cree uv LED hysol OS4000 epoxy C395-XB290-E400-A C405-XB290-E400-A C405-XB290-E400-B C460-XB290-E1000-A C460-XB290-E1000-B
    Text: G•SiC Technology XBright LEDs CXXX-XB290-EXXXX-X ® The Leader in Silicon Carbide Solid State Technology Features Applications • XBright™ • Outdoor LED Video Displays • High Performance – 16.0 mW 395nm Ultraviolet – 17.0 mW (405nm) Ultraviolet


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    CXXX-XB290-EXXXX-X 395nm) 405nm) 460nm) 470nm) 505nm) 527nm) C395-XB290-E400-B UV led 220 nm peak silicon carbide LED cree uv LED hysol OS4000 epoxy C395-XB290-E400-A C405-XB290-E400-A C405-XB290-E400-B C460-XB290-E1000-A C460-XB290-E1000-B PDF

    RUCYT101K00009GNTC

    Abstract: tray 10x10mm RUCYT201K00014GNTC
    Text: Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.


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    K99E-13 RUCYT101K00009GNTC tray 10x10mm RUCYT201K00014GNTC PDF

    TGA2502

    Abstract: 9948465 21A 8 BALL
    Text: TGA2502 13 - 15 GHz 4W Power Amplifier Key Features • • • • • • 0.5 um pHEMT Technology >25 dB Nominal Gain >36 dBm Nominal Psat 44 dBm Nominal IP3 @ 14 GHz Bias 7V @ 1.3A Idq, 2.1A under RF drive Chip Dimensions 2.5mm x 2.7mm x 0.1 mm Chip Dimensions 2.5 mm x 2.7 mm x 0.1 mm


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    TGA2502 TGA2502 9948465 21A 8 BALL PDF

    AuSn solder

    Abstract: fsx51x die-attach FSX51 AuSn
    Text: GaAs FET FHX35X/002 FSX51X/011 BONDING PROCEDURE FOR FET CHIPs Caution must be excercised to prevent static build up by proper grounding of all equipment and per­ sonnel. All operations must be performed in a clean, dust-free and dry environment. 1. Storage Condition: Store in a clean, dry nitrogen environment.


    OCR Scan
    FHX35X/002 FSX51X/011 FHX35X/002, FSX51X/011. AuSn solder fsx51x die-attach FSX51 AuSn PDF