MS-6G
Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f
Text: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :
|
Original
|
Z200-PCN-PA20070101
14X20MM
14X14MM
G600F)
48LQFP
SB5627
W6694ACD
SB5627001
MS-6G
ms-7g
sa5522
SUMITOMO g600f
W83303D
w99682bcdg
W55U01-A2
ms 6g
w89c35d
g600f
|
PDF
|