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    BACK CONTACT RESISTOR Search Results

    BACK CONTACT RESISTOR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D1U54T-M-2500-12-HB4C Murata Manufacturing Co Ltd 2.5KW 54MM AC/DC 12V WITH 12VDC STBY BACK TO FRONT AIR Visit Murata Manufacturing Co Ltd
    D1U74T-W-1600-12-HB4AC Murata Manufacturing Co Ltd AC/DC 1600W, Titanium Efficiency, 74 MM , 12V, 12VSB, Inlet C20, Airflow Back to Front, RoHs Visit Murata Manufacturing Co Ltd
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet

    BACK CONTACT RESISTOR Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.


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    MIL-STD-883, 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment


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    100ppm/ -10001F-E 2ST-10001F-E 105-F-0306 PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment


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    100ppm/ 2ST-10001F-E -10001F-E 105-D-1198 PDF

    F0306

    Abstract: No abstract text available
    Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment


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    100ppm/ -10001F-E 2ST-10001F-E 105-F-0306 F0306 PDF

    Untitled

    Abstract: No abstract text available
    Text: TX CALIFORNIA MICRO DEVICES Back-Contact Thin Film Resistor Series California Micro Devices TX Series back contact 20 mil resistor chips offer the superior properties of Tantalum Nitride material in a single-bond design. Conductive epoxy or eutectic die-attachment to an active substrate


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    100Vdc C1350800 PDF

    Untitled

    Abstract: No abstract text available
    Text: TX CALIFORNIA MICRO DEVICES Back-Contact Thin Film Resistor Series California Micro Devices TX Series back contact 20 mil resistor chips offer the superior properties of Tantalum Nitride material in a single-bond design. Conductive epoxy or eutectic die-attachment to an active substrate


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    100Vdc C1350800 PDF

    Untitled

    Abstract: No abstract text available
    Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value


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    MIL-STD-883. 08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value


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    MIL-STD-883. 08-Apr-05 PDF

    electrofilms back contact

    Abstract: bcr resistor
    Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value


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    MIL-STD-883. 03-Aug-04 electrofilms back contact bcr resistor PDF

    Untitled

    Abstract: No abstract text available
    Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value


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    MIL-STD-883. 29-Mar-04 PDF

    WBCR-008

    Abstract: bcr efi electrofilms back contact
    Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.


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    MIL-STD-883. 07-Aug-01 WBCR-008 bcr efi electrofilms back contact PDF

    Untitled

    Abstract: No abstract text available
    Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor With Part Mark FEATURES Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip requires


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    MIL-STD-883. 07-Aug-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip


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    MIL-STD-883. 03-Aug-04 PDF

    Untitled

    Abstract: No abstract text available
    Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip


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    MIL-STD-883. 23-Mar-04 PDF

    Untitled

    Abstract: No abstract text available
    Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip


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    MIL-STD-883. 08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip


    Original
    08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip


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    18-Jul-08 PDF

    Untitled

    Abstract: No abstract text available
    Text: MINI-SYSTEMS INC llllM BACK CONTACT RESISTORS L517&5D OOOO'ifib 327 S7E I> MSBC SERIES The MSBC series back contact chip resistor offers designers a space-saving design in a .020" * .020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the


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    125mW, MSBC-2-S-T-10K-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The M S B C series back contact chip resistor offers designers a space-saving design in a . 0 2 0 " x . 0 2 0 " size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the


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    125mW, 100ppm MSBC-2-S-T-10K-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi­


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    15x15 20x20 22x22 QDD02M7 PDF

    BCP 39

    Abstract: WBCR-008
    Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact S Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi­


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    50ppm/ 400Q1kU BCP 39 WBCR-008 PDF

    100S3

    Abstract: WBCR-008
    Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi­


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    50ppm/ 100S3 WBCR-008 PDF

    Untitled

    Abstract: No abstract text available
    Text: FEATURES The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assembly time. They are manufactured in the smallest chip size available. BCR SERIES THIN-FILM BACK-CONTACT These chips are manufactured using state-of-the-art thin-film techniques, are


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    MIL-STD-883. PDF

    tantalum nitride

    Abstract: bcr electrofilms back contact resistor
    Text: ELECTRO-FILMS INC/ SEMI- 3ME 3101535 QQGQ174 b THIN-FILM BACK-CONTACT RESISTOR tFEA T U R ES t ì o The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assem bly time. They are manufactured in the sm allest chip size available.


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    MIL-STD-883. tantalum nitride bcr electrofilms back contact resistor PDF