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    BARE DIE Search Results

    BARE DIE Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    THS4541YR Texas Instruments Bare die 850-MHz precision fully differential amplifier 0-DIESALE -40 to 125 Visit Texas Instruments
    ISL70062SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A NMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL70061SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A PMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL73062SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A NMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
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    BARE DIE Price and Stock

    Infineon Technologies AG BTS550P (BARE DIE)

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    Bristol Electronics BTS550P (BARE DIE) 2,958
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    Harris Semiconductor CA3130 BARE DIE

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    Bristol Electronics CA3130 BARE DIE 666
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    Motorola Semiconductor Products 1N4625 BARE DIE

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    Bristol Electronics 1N4625 BARE DIE 600
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    Motorola Semiconductor Products 2N2219A BARE DIE

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    Bristol Electronics 2N2219A BARE DIE 388
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    ams OSRAM Group MIRA130 BARE DIE

    (Alt: Q65114A0078)
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    EBV Elektronik MIRA130 BARE DIE 31 Weeks 1,593
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    BARE DIE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    infineon c167 bare die

    Abstract: C167CR-LC AN10 AN11 AN12 C166 C167CR SAK-C167CR-LC c167 bare die 4536 timer circuits
    Text: Microcontrollers C166 Family 16-Bit Single-Chip Microcontroller C167CR-LC, Bare Die, Step FA Data Sheet 1999-11 Bare Die Delivery www.infineon.com C167CR-LC Step FA C167CR-LC Revision History: (Bare Die Delivery) 1999-11, Step FA Previous Versions: 10.97


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    16-Bit C167CR-LC, C167CR-LC C167CR infineon c167 bare die C167CR-LC AN10 AN11 AN12 C166 SAK-C167CR-LC c167 bare die 4536 timer circuits PDF

    infineon c167 bare die

    Abstract: ba 4614 4614 Ba 4164 ram bosch ac drive AN10 AN11 C166 C167CR SAK-C167CR-4RC
    Text: Microcontrollers C166 Family 16-Bit Single-Chip Microcontroller C167CR-xC, Bare Die, Step GA Data Sheet 1999-11 Bare Die Delivery www.infineon.com C167CR-xC Step GA C167CR-xC Revision History: (Bare Die Delivery) 1999-11, Step GA Previous Versions: 1999-11


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    16-Bit C167CR-xC, C167CR-xC C167CR infineon c167 bare die ba 4614 4614 Ba 4164 ram bosch ac drive AN10 AN11 C166 SAK-C167CR-4RC PDF

    Untitled

    Abstract: No abstract text available
    Text: V I S H AY I N T E R T E C H N O L O G Y, I N C . OPTOELECTRONICS Bare Die Optoelectronics Bare Die Portfolio Infrared Emitters and Photo Detectors TABLE OF CONTENTS Introduction to Bare


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    VMN-SG2200-1502 PDF

    me 4946

    Abstract: SAK-C167CR-LC c167 bare die 7313 28 pin integrated circuit BOSCH bosch ac drive AN10 AN11 C167CR-LC
    Text: Microcomputer Components 16-Bit CMOS Single-Chip Microcontroller Bare Die, Step BA C167CR/C167SR-LC Data Sheet 05.97 Bare Die Delivery C167CR-LC/C167SR-LC Revision History: (Bare Die Delivery) Original Version 05.97 Previous Releases: - Page Subjects Controller Area Network (CAN): License of Robert Bosch GmbH


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    16-Bit C167CR/C167SR-LC C167CR-LC/C167SR-LC D-81541 C167xR-LC 07May97 me 4946 SAK-C167CR-LC c167 bare die 7313 28 pin integrated circuit BOSCH bosch ac drive AN10 AN11 C167CR-LC PDF

    AN-1060

    Abstract: Silicon Controlled Rectifier Manual an1060 ultrasonic bond Three bond jedec tray bare die JESD 49
    Text: AN-1060 International Rectifier • 233 Kansas Street, El Segundo, CA 90245 ! USA BARE DIE: HANDLING AND STORAGE By Richard Clark Introduction International Rectifier supply a range of power devices in a variety of packages and in Bare Die form. The Bare Die products are available in a


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    AN-1060 AN-1060 Silicon Controlled Rectifier Manual an1060 ultrasonic bond Three bond jedec tray bare die JESD 49 PDF

    analog devices die list

    Abstract: 54AC245 74ACT04 LM108 LM137K SCAN18373T SCAN18374T SCANPSC100F SCANPSC110F
    Text: N VOLUME NO. 2 1999 BARE DIE USE IS GROWING RAPIDLY CONTENTS he rapid demand for smaller and PAGE 1 Bare Die Use is Growing BARE DIE MEET smaller consumer products is Rapidly pushing designers and manufacQUALITY, RELIABILITY, Page 2 Boundary Scan Assists turers to reassess their selection of comAND PERFORMANCE


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    PDF

    FPD63310

    Abstract: TFTLCD LMC7532 bare die
    Text: N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die TFT-LCD Panels Applications Bare Die/Known Good Die TFT-LCD Panels 1 7 2 CD 1 CD N 3 4 6 5 www.national.com 1 N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die


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    FPD63310 TFTLCD LMC7532 bare die PDF

    MIL-C-17

    Abstract: MIL-C17 ethylene polytetrafluoroethylene PUR Foam dacron polyolefin elastomer copolymer Polyvinyl Chloride
    Text: TITLE Materials Abbreviations DOCUMENT No. REV PAGE MATERIALS ABBREVIATIONS - 1 CONDUCTORS & BRAID MATERIALS AL Aluminum BC Bare Copper BeCu Beryllium-Copper Alloy 172 BCCAI Bare Copper Clad Aluminum CCS Bare Copper Clad Steel GS Galvanized Steel HR High Resistance Wire


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    Mil-C-17 MIL-C-17 MIL-C17 ethylene polytetrafluoroethylene PUR Foam dacron polyolefin elastomer copolymer Polyvinyl Chloride PDF

    Selector Guide

    Abstract: do-218ab DO218AB
    Text: V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Products in Several Versions to Accommodate a Wide Variety of Assembly Techniques and Applications TABLE OF CONTENTS


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    VMN-SG2163-1312 Selector Guide do-218ab DO218AB PDF

    Untitled

    Abstract: No abstract text available
    Text: VISHAY SEMICONDUCTORS www.vishay.com Optical Sensors Application Note Handling IR Emitters and Photo Detector Bare Die By Elena Poklonskaya This application note provides instructions for how to handle and mount IR emitter and photo detector bare die products


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    30-Jul-14 PDF

    rg59

    Abstract: 20AWG
    Text: RG59 DIRECT BURIAL WITH 95% COPPER BRAID SKU: 107-2175/DB/BK Construction RG59 Direct Burial, 20AWG Solid Bare Copper Conductor with 95% Bare Copper Braid, CL2, CM, Polythylene Jacket, 1000ft. Conductor Diameter Dielectric Diameter Braid Coverage Gel Filled


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    107-2175/DB/BK 20AWG 1000ft. 1000ft 005mm 20AWG) x16x9x0 rg59 PDF

    a04e

    Abstract: a027 capacitor A03e a00a 848B AN1066 AN442 MC145003 MC145004 MC14LC5003
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MC14LC5003 MC14LC5004 128 Segment LCD Drivers CMOS • • • • • • 52 1 ORDERING INFORMATION MC14LC5003FU MC14LC5004FU MCC14LC5003 MCC14LC5004 QFP QFP BARE DIE BARE DIE FP32 FP31 FP30 FP29 FP28 FP27 FP26 FP25 FP24


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    MC14LC5003 MC14LC5004 MC14LC5003FU MC14LC5004FU MCC14LC5003 MCC14LC5004 a04e a027 capacitor A03e a00a 848B AN1066 AN442 MC145003 MC145004 MC14LC5003 PDF

    Untitled

    Abstract: No abstract text available
    Text: AN10706 Handling bare die Rev. 02 — 10 June 2011 Application note Document information Info Content Keywords bare die, handling, ESD, clean room, mechanical damages, delivery forms, transport conditions, store conditions Abstract This application note is intended for introducing customers in assembly


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    AN10706 PDF

    Ion Chromatography

    Abstract: No abstract text available
    Text: Application Report SZZA042 - November 2003 Use of Polystyrene for Bare-Die Carrier-Tape Shipping Applications Michael Hayden, Lee Lewis, and Lance Wright Standard Linear & Logic ABSTRACT The packing and shipping of bare-die product is relatively new, especially in the tape-and-reel


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    SZZA042 Ion Chromatography PDF

    Untitled

    Abstract: No abstract text available
    Text: Ums 6-bit phase shifters A comprehensive family of 6-bit phase shifters from L to X-band: • Outstanding accuracy & speed • Bare die and SMT hermetic & plastic package • Class S for Space applications L-BAND Bare Die / SMT Plastic Package Part Number


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    CHP3010-99F CHP3010-QFG CHP4012a98F CHP4012-QEG CHP6013-SRF PDF

    RG-219

    Abstract: No abstract text available
    Text: IMPEDANCE: 50 OHMS INNER CONDUCTOR INNER CONDUCTOR DIAMETER: MATERIAL: .1 9 5 ” BARE COPPER DIELECTRIC DIAMETER: .6 8 0 ” DIELECTRIC MATERIAL: SOLID POLYETHYLENE NUMBER OF SHIELDS: 1 SHIELD MATERIAL: BARE COPPER OUTER DIAMETER: JACKET MATERIAL: .9 4 5 ”


    OCR Scan
    RG219/U RG-219 PDF

    Untitled

    Abstract: No abstract text available
    Text: DC AXIAL FAN 60x60x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: 10M i2 , 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humkdity 15%-90%RH


    OCR Scan
    60x60x1 500VDC/min 500VAC/min mm-H20) FD6010B05W1-81 2W5-81 FD6010B24W1-81 FD6010B24W2-81 FD6010B24W3-81 PDF

    Untitled

    Abstract: No abstract text available
    Text: DC AXIAL FAN 40x40x1 Omm Housing/Blade: Thermoplastic PBT, UL94V-0 Insulation Resistance: 10M£2, 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature: - 10°C~70°C Humidity 35%-85%RH


    OCR Scan
    40x40x1 UL94V-0 500VDC/min 500VAC/min FD4010B05W3-71 FD4010B05W5-71 FD4010B05W7-71 FD4010B12W3-71 FD4010B12W5-71 mm-H20) PDF

    Untitled

    Abstract: No abstract text available
    Text: DC AXIAL FAN 40x40x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: 10M £2, 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humidity 15%-90%RH


    OCR Scan
    40x40x1 500VDC/min 500VAC/min mm-H20) FD4010B05W3-83 FD4010B05W5-83 FD4010B12W3-83 FD4010B12W5-83 FD4010B12W7-83 PDF

    Untitled

    Abstract: No abstract text available
    Text: PASTERNACK ENTERPRISES R G 2 1 7 /U émm mW*. IMPEDANCE: 5 0 OHMS INNER CONDUCTOR DIAMETER: .1 0 6 ” INNER CONDUCTOR MATERIAL: BARE COPPER DIELECTRIC DIAMETER: .3 7 0 ” DIELECTRIC MATERIAL: SOLID POLYETHYLENE NUMBER OF SHIELDS: 2 SHIELD MATERIAL: BARE COPPER


    OCR Scan
    RG217/U PDF

    Untitled

    Abstract: No abstract text available
    Text: Multi-Chip Module • MCM-L Type PBGA: MBH20000 Series Features • Use of bare die semiconductors (or more compact and lightweight modularization • Use of multilayer printed wiring board • Multiple numbers of bare dies mountable on one JED EC /EIA J standard package.


    OCR Scan
    MBH20000 PDF

    Untitled

    Abstract: No abstract text available
    Text: DC AXIAL FAN 50x50x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: 10M £2, 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humidity 15%-90%RH


    OCR Scan
    50x50x1 500VDC/min 500VAC/min mm-H20) FD5010B05W3-81 FD5010B24W5-81 FD5010B24W7-81 FD5010B12W9-81 PDF

    RG218 Cable

    Abstract: No abstract text available
    Text: PASTERNACK ENTERPRISES R G 2 1 8 /U IMPEDANCE: 5 0 OHMS INNER CONDUCTOR DIAMETER: .1 9 5 ” INNER CONDUCTOR MATERIAL: BARE COPPER DIELECTRIC DIAMETER: .6 8 0 ” DIELECTRIC MATERIAL: SOLID POLYETHYLENE NUMBER OF SHIELDS: 1 SHIELD MATERIAL: BARE COPPER OUTER DIAMETER:


    OCR Scan
    261-7451VOLTS RG218/U RG218 Cable PDF

    Untitled

    Abstract: No abstract text available
    Text: DC AXIAL FAN 30x30x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: lO M O , 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humidity 15%-90%RH


    OCR Scan
    30x30x1 500VDC/min 500VAC/min mm-H20) FD3010B03W3-81 FD3010B03W5 FD3010B05W7-81 FD3010B1 2W3-81 PDF