usb schema
Abstract: simple subwoofer schema usb camera schema camera phone 8254-2 subwoofer pre Phoenix BIOS keystrokes 72 PC RAM DIODE S4 74 intel 8042
Text: 39 C H A P T E R 3 PC 99 Basic Requirements This chapter summarizes the basic features required for all PC 99 systems, with specific requirements for Consumer, Office, Mobile, Workstation, and Entertainment PC systems. For definitions of common terms, acronyms, and abbreviations used in this guide,
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om6357
Abstract: bgy502 nexperia OM6357-7 UAA3537 14585 datasheet ARM7 interface with gsm module 14585 BGY288 UBA2008
Text: Nexperia System Solution 5110 / 5120 Multimedia-enabled cellular system solution for GSM/GPRS mobile handsets These market-proven, ARM7-based GSM/GPRS platforms bring multimedia options with industry-leading power consumption to the basic, entry-level phone market.
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Triband 900 1800
Abstract: C166 voice record to SD card scheme modem MMI E-GOLD
Text: Product Brief BP2 Entry & Basic Platform Infineon’s cost-optimised GSM/GPRS platform BP2 is one of the highest integrated and most complete system solutions available today. It allows customers to develop and market mobile phones in record time. Included are all components needed to
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B134-H8365-X-0-7600
Triband 900 1800
C166
voice record to SD card scheme
modem MMI
E-GOLD
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Untitled
Abstract: No abstract text available
Text: DSO Nano Manual v1.0b Intro DSO mobile is a pocket size digital storage oscilloscope fulfills basic electronic engineering requirements. It is base on ARM Cortex -M3 compatible 32 bit platform, equipped with 320*240 color display, SD card capability, USB connection, and chargeable batteries.
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12bit
DS0201
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core i5 MOTHERBOARD CIRCUIT diagram
Abstract: I7 motherboard circuit diagram intel i5 block diagram COMX-CORE-750 COMX-CORE-710 processor intel core i7 usb 2.0 to hdmi circuit core i5 MOTHERBOARD block diagram AMI bios power management block diagram for intel core i5 processor
Text: COMX-CORE Series COM Express Modules PRELIMINARY DATA SHEET COM Express modules are designed to provide standard PC processing functionality for high performance applications nn Intel Core i5 and i7 mobile platform based COM Express module nn Basic size 125 mm x 95 mm
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st 9318
Abstract: cosm NEC Electronics nec ram M17161EJ2V0PF
Text: COSMORAM About COSMORAM Common Specification for Mobile RAM z Agreed by Fujitsu, NEC Electronics and Toshiba z 1st Announcement in March 14, 2002 z Standard Body ¾ Function Truth Table ¾ Configuration Register Definition ¾ Basic Timing Diagram ¾ Pin Assignment
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M17161EJ2V0PF
104MHz
54MHz
M17161EJ2V0PF00
st 9318
cosm
NEC Electronics
nec ram
M17161EJ2V0PF
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IC SEM 2004
Abstract: IC SEM 2005 cosmoram NTS 10 SEM 2006 TOSHIBA roadmap Memory Selection Guide Toshiba
Text: COSMORAM Rev. 2.0 Sep./2004 1 About COSMORAM Common Specification for Mobile RAM z Agreed by Fujitsu, NEC Electronics and Toshiba z 1st Announcement in March 14, 2002 z Standard Body ¾ Function Truth Table ¾ Configuration Register Definition ¾ Basic Timing Diagram
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104MHz
54MHz
2001s
IC SEM 2004
IC SEM 2005
cosmoram
NTS 10
SEM 2006
TOSHIBA roadmap
Memory Selection Guide Toshiba
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TAL ATS
Abstract: IC SEM 2004 IC SEM 2005 UNL 2003 TOSHIBA cosmoram LPD-D
Text: COSMORAM Ver. 2.0 Sep./2004 1 About COSMORAM Common Specification for Mobile RAM z Agreed by Fujitsu, NEC Electronics and Toshiba z 1st Announcement in March 14, 2002 z Standard Body ¾ Function Truth Table ¾ Configuration Register Definition ¾ Basic Timing Diagram
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104MHz
54MHz
2001ty
TAL ATS
IC SEM 2004
IC SEM 2005
UNL 2003 TOSHIBA
cosmoram
LPD-D
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x-gold 101 pmb7880
Abstract: mobile phone basic block diagram infineon x-gold x-gold x-gold 101 sip voip Antenna Factor gsm 900 sim 900 RTC gsm modem block diagram sim gsm modem circuit diagram
Text: Solution Brief XMM 1013 Low-Cost Dual-Mode GSM/Wi-Fi Platform THE INFINEON XMM™1013 is the first low-cost mobile device platform that introduces Voice-over-IP capability in voice-centric phones. In addition to providing the user with the basic ability to make GSM telephone calls, to send and receive SMS
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XMMTM1013
XMMTM1013
X-GOLDTM101,
B153-H9168-X-X-7600
x-gold 101 pmb7880
mobile phone basic block diagram
infineon x-gold
x-gold
x-gold 101
sip voip
Antenna Factor gsm 900
sim 900 RTC
gsm modem block diagram
sim gsm modem circuit diagram
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game port db15 to USB Adapter
Abstract: db-15 pin connector vga adapter ATM master key smart card 1838 t ir receiver DIGITAL COLOR TV RECEIVER PC BIOS extension ramdac sense 15-13 pin vga cable connection s-video cable DVD ID 802
Text: 473 A P P E N D I X E PC 99 Master Checklist If a recommended feature is implemented, it must meet the PC 99 requirements for that feature as defined in this document. Checklist for PC 99 Basic Requirements Consumer Office Mobile Workstation 3.1. System performance meets PC 99 minimum requirements
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Win32
game port db15 to USB Adapter
db-15 pin connector vga adapter
ATM master key smart card
1838 t ir receiver
DIGITAL COLOR TV RECEIVER
PC BIOS extension
ramdac sense
15-13 pin vga cable connection
s-video cable
DVD ID 802
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HDMI TO VGA MONITOR PINOUT
Abstract: pin diagram AMD sempron 1960048820N001 AMD sempron pinout rtl8110sc AMD Sempron 140 turion pin list Chipset Development sb600 Socket S1g1 1960048818N001
Text: SOM-5781 AMD Turion M690E COM-Express Basic Module Features AMD Turion™/Sempron™ processor + AMD M690E/SB600 chipsets Mobile AMD X1250 3D/2D engine, Supports 48-bit LVDS/VGA/HDMI/DVO/ PCIe x 8 Supports two DDR2-800 memory SODIMM sockets up to 4 GB
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SOM-5781
M690E
M690E/SB600
X1250
48-bit
DDR2-800
9-May-2011
HDMI TO VGA MONITOR PINOUT
pin diagram AMD sempron
1960048820N001
AMD sempron pinout
rtl8110sc
AMD Sempron 140
turion pin list
Chipset Development sb600
Socket S1g1
1960048818N001
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mobile hardware integration
Abstract: Linux
Text: Applications Processors Teleca Solutions for Freescale Platforms Running Linux Freescale Semiconductor’s advanced i.MX family of applications processors helps you quickly harness the power of wireless, broadband, multimedia and the Internet. Designed for use in smartphones, wireless
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mobile hardware integration
Abstract: No abstract text available
Text: Applications Processors Teleca Solutions for Freescale Platforms Running Linux Freescale Semiconductor’s advanced i.MX family of applications processors helps you quickly harness the power of wireless, broadband, multimedia and the Internet. Designed for use in smartphones, wireless
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basic mobile circuit
Abstract: audio amplifier mobile MIPI csi LIPO WLCSP SG1002 SG187 IC SC900841JVK 10 bit ADC touch screen mipi controller
Text: Analog, Mixed Signal and Power Management Freescale’s Leading-Edge PMIC Solution Designed for the Intel Atom Z6xx mobile platform Applications Freescale Provides Next-Generation Power Management for Mobile Internet • Netbooks Intel® Atom™ Z6xx Mobile Platform
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338-pin
98ASA10841D
36-pin
98ASA00004D
basic mobile circuit
audio amplifier mobile
MIPI csi
LIPO
WLCSP
SG1002
SG187
IC SC900841JVK
10 bit ADC touch screen
mipi controller
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AR6001
Abstract: AR6001XL AR6001G AR6001GL AR6001 atheros atheros Atheros bluetooth transceiver atheros wlan SDIO voice control robot atheros 802.11 reference design
Text: Atheros ROCm Platform Radio-On-Chip for Mobile ROCm Products Introducing the Atheros ROCm platform of high-performance wireless solutions for mobile and embedded devices. The Atheros ROCm platform gives customers unsurpassed ability to: • Build the most power efficient devices
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AR6001XL
11a/b/g
AR6001XL
AR6001G,
AR6001GL,
AR6001GZ
AR6001X,
AR6001XL,
AR6001XZ
AR6001
AR6001G
AR6001GL
AR6001 atheros
atheros
Atheros bluetooth transceiver
atheros wlan SDIO
voice control robot
atheros 802.11 reference design
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mobile phone basic block diagram
Abstract: GSM intercom circuit diagram block diagram bluetooth headset Intercom Profile ICP Broadcom bluetooth bluetooth based data transfer system block diagram Utron Technology block diagram bluetooth camera mobile phone circuit diagram BCM1200-BTEM
Text: BCM1200-BTEM Brief BLUETOOTH® V2.1 COMMUNICATIONS SOFTWARE FOR MOBILE PHONES FEATURES AND BENEFITS FEATURES AND BENEFITS • Portability—BCM1200-BTEM code is portable and scalable • Advanced Protocol Stack—The Bluetooth v2.1 upper over a wide array of phone design and platform architectures.
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BCM1200-BTEM
Portability--BCM1200-BTEM
BCM1200-BTEM
1200-BTEM-PB04-R01/31/07
mobile phone basic block diagram
GSM intercom circuit diagram
block diagram bluetooth headset
Intercom Profile ICP
Broadcom bluetooth
bluetooth based data transfer system block diagram
Utron Technology
block diagram bluetooth camera
mobile phone circuit diagram
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mobile phone circuit diagram
Abstract: sh-mobile 3G HSDPA repeater docomo Mobile Controlled Robot mobile hardware integration 3G HSDPA circuits diagram android hardware android mobile
Text: Application: Mobile Solution Standardized Platform Will Accelerate the Development of Future of Mobile Phones As announced on April 26, 2010, Renesas has agreed to work together on an application platform for mobile phones with NTT DOCOMO, Inc. DOCOMO , FUJITSU LIMITED (Fujitsu), NEC Corporation (NEC), Panasonic Mobile
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R70PF0010EJ0101
mobile phone circuit diagram
sh-mobile
3G HSDPA repeater
docomo
Mobile Controlled Robot
mobile hardware integration
3G HSDPA circuits diagram
android hardware
android mobile
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mmx ssse instruction
Abstract: Intel application note SIMD Intel confidential design documents
Text: Intel Celeron® Processor 550 Datasheet Addendum Addendum for Intel Celeron Processor 500 Series Datasheet For Platforms Based on Mobile Intel® 965 Express Chipset Family January 2008 Document Number: 319219-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
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B6610-01
B6611-01
mmx ssse instruction
Intel application note SIMD
Intel confidential design documents
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Infineon technology roadmap
Abstract: device mp4 player FDD service mp4 devices circuit MP4 Player circuit usb 3g modem circuit reference design using infineon
Text: Product Brief MP1 Multimedia Platform Infineon’s MP1 multimedia platform is one of the most versatile and complete system solutions available today. It allows customers to develop and market mobile phones in record time. Our customers receive everything needed
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B134-H8364-X-0-7600
Infineon technology roadmap
device mp4 player
FDD service
mp4 devices circuit
MP4 Player circuit
usb 3g modem circuit
reference design using infineon
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BCM1000-BTW-CE
Abstract: BCM1000-BTW BCM1000-BSP broadcom users guide Bluetooth bluetooth audio interface smartphone BROADCOM BCM1200-BTE 1000bs mobile hardware integration
Text: BCM1000-BSP BLUETOOTH COMMUNICATIONS SOFTWARE FOR WINDOWS® MOBILE 2003 FOR SMARTPHONE FEATURES • Complete ®Bluetooth 1.2 compliant protocol software for Microsoft Smartphone platforms • Includes integrated user interface to enable seamless Bluetooth
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BCM1000-BSP
1000-BSP-PB02-R
BCM1000-BTW-CE
BCM1000-BTW
BCM1000-BSP
broadcom users guide Bluetooth
bluetooth audio interface
smartphone
BROADCOM
BCM1200-BTE
1000bs
mobile hardware integration
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Untitled
Abstract: No abstract text available
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM6225 TM Chipset Solution M U LT I M E D I A VA L U E Affordable, accessible 3G wireless for all The QUALCOMM Value Platform has been designed to expand the market for voice and data services by offering
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rfr6250
Abstract: Qualcomm RF chipset Qualcomm RFR6250 rtr6250 Qualcomm RTR6250 Qualcomm PM6650 MSM6225 qualcomm umts chipset qualcomm 3G solution
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM6225 TM Chipset Solution M U LT I M E D I A VA L U E Affordable, accessible 3G wireless for all The QUALCOMM Value Platform has been designed to expand the market for voice and data services by offering
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Abstract: No abstract text available
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM6225 TM Chipset Solution M U LT I M E D I A VA L U E Affordable, accessible 3G wireless for all The QUALCOMM Value Platform has been designed to expand the market for voice and data services by offering
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Abstract: No abstract text available
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM6225 TM Chipset Solution M U LT I M E D I A VA L U E Affordable, accessible 3G wireless for all The QUALCOMM Value Platform has been designed to expand the market for voice and data services by offering
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