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    BCH32 Search Results

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    BCH32 Price and Stock

    Panasonic Electronic Components MS-SF4BCH-32

    METAL PROTECTION CASE FOR SF4B-C
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MS-SF4BCH-32 Bulk 1
    • 1 $125.31
    • 10 $125.31
    • 100 $125.31
    • 1000 $125.31
    • 10000 $125.31
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    Mouser Electronics MS-SF4BCH-32
    • 1 $159
    • 10 $143.1
    • 100 $136.74
    • 1000 $136.74
    • 10000 $136.74
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    RS MS-SF4BCH-32 Bulk 1
    • 1 $132.35
    • 10 $127.06
    • 100 $127.06
    • 1000 $127.06
    • 10000 $127.06
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    Master Electronics MS-SF4BCH-32
    • 1 $153.87
    • 10 $136.29
    • 100 $123.41
    • 1000 $123.41
    • 10000 $123.41
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    BCH32 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    samsung eMMC 4.5

    Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51 PDF

    huawei usb modem

    Abstract: lpddr1 i.mx508 Cortex-A8 electrophoretic display epd driving epd driver ic atheros wlan SDIO emmc lpddr2 phy
    Text: Fact Sheet i.MX Applications Processors i.MX508 Processor for eReaders Driving the next generation of ereaders, setting a new level of performance while reducing system cost and extending battery life Overview The i.MX508 is the first system-on-a-chip SoC designed specifically for ereaders that


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    MX508 SGTL5000 AR6133 MAX17135ETJ+ EM770 ARM11 IMX508FS huawei usb modem lpddr1 i.mx508 Cortex-A8 electrophoretic display epd driving epd driver ic atheros wlan SDIO emmc lpddr2 phy PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    samsung eMMC 4.5

    Abstract: 153 ball eMMC memory emmc samsung samsung eMMC 5.0 samsung lpddr2 Samsung eMMC 4.41 MCIMX508CVK8B ARM Cortex A9 samsung MCIMX507 "EPD controller"
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 1, 10/2011 MCIMX50 Package Information Plastic Package Case MAPBGA 13 x 13 mm, 0.5 mm pitch 416 pin PBGA i.MX50 Applications Processors for Consumer Products 1 Introduction


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    IMX50CEC MCIMX50 samsung eMMC 4.5 153 ball eMMC memory emmc samsung samsung eMMC 5.0 samsung lpddr2 Samsung eMMC 4.41 MCIMX508CVK8B ARM Cortex A9 samsung MCIMX507 "EPD controller" PDF

    samsung eMMC 4.5

    Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    Samsung eMMC 4.51

    Abstract: samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 Samsung eMMC 4.51 samsung eMMC 4.5 PDF

    Samsung eMMC 4.41

    Abstract: ARM Cortex A9 samsung VFPv3 emmc jedec standard MCIMX50 samsung eMMC 4.5 153 ball eMMC memory
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 0, 7/2011 MCIMX50 Package Information Plastic Package Case MAPBGA 13 x 13 mm, 0.5 mm pitch 416 pin PBGA i.MX50 Applications Processors for Consumer Products 1 Introduction


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    IMX50CEC MCIMX50 Samsung eMMC 4.41 ARM Cortex A9 samsung VFPv3 emmc jedec standard MCIMX50 samsung eMMC 4.5 153 ball eMMC memory PDF

    samsung eMMC 4.5

    Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    BAV90

    Abstract: bd139 smd PMBT2369A BF981 BF966 SMD 2n2907 smd BF980 2N4858 smd BFG65 BC547 smd
    Text: N AMER PHILIPS/DISCRETE GbE D • 1^53=131 0D1202Ô S ■ 11 CONVERSION LIST . CONVERSION LIST conventional type number to S M D type number conventional type microminiature type Conventional type BA243 BA314 BA480 BA481 BA482 BA483 BAT85 BAT 18 BAS 17 BAT 17


    OCR Scan
    0D12DEÃ BA243 BC146/02 BC849B/C BC338 BC818 BA314 BAS17 BCF32/33 BCX20 BAV90 bd139 smd PMBT2369A BF981 BF966 SMD 2n2907 smd BF980 2N4858 smd BFG65 BC547 smd PDF

    C157

    Abstract: GT-BCH3230L C160 C175 mil-std-202 method 108
    Text: UNCONTROLLED DOCUMENT REV, A E.C.N. PART NUMBER REV. G T -B C H 3 2 3 0 L A NUMBER AND REVISION COMMENTS DATE E.C.N. # 1 1 1 4 6 , 1 2 ,1 1 .0 6 4.1 C. 160 ELECTRO-OPTICAL SPECIFICATIONS 1. D.C. FIRING VOLTS d v /d t < 500 V /s ) 2. IMPULSE FIRING VOLTS ( d v / d t =


    OCR Scan
    GT-BCH3230L 00V/us) S/20uS BCH3230L 50LDERINC C157 GT-BCH3230L C160 C175 mil-std-202 method 108 PDF