WBCR-008
Abstract: bcr efi electrofilms back contact
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.
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MIL-STD-883.
07-Aug-01
WBCR-008
bcr efi
electrofilms back contact
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Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.
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MIL-STD-883,
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
08-Apr-05
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
08-Apr-05
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electrofilms back contact
Abstract: bcr resistor
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
03-Aug-04
electrofilms back contact
bcr resistor
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
29-Mar-04
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bcr20
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
bcr20
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Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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11-Mar-11
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Waffle Pack Packaging
Abstract: No abstract text available
Text: Waffle Pack Packaging www.vishay.com Vishay Electro-Films VISHAY ELECTRO-FILMS WAFFLE PACK QUANTITY PER PRODUCT FAMILY 2 inch x 2 inch PRODUCT FAMILY CC1CC2CC3CC4CC5CC6CC7CC8SFC SFM SFP SFN SFX SC3 QFM QFN QFX BCR PWA PWB CTT CTA CCC CTR CTN CTM CTQ CCB
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22-Jan-14
50x50
Waffle Pack Packaging
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WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
WBCR02750000F
BCR50000FKAHWS
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
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WBCR02750000F
Abstract: bcr resistor bcr efi ElectroFilm
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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11-Mar-11
WBCR02750000F
bcr resistor
bcr efi
ElectroFilm
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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MIL-STD-883.
08-Apr-05
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Untitled
Abstract: No abstract text available
Text: V i sh ay I n t e rt e ch n o l o g y, I n c . I INNOVAT AND TEC O L OGY BCR N HN Thin Film Resistor O 19 62-2012 Resistors - Space Saving, Back Contact Thin Film, Back Contact Resistor Key Benefits • • • • • Requires only one wire bond, thus saving space
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08-Aug-11
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Vishay Power resistor
Abstract: bcr efi one wire bcr resistor
Text: Thin Film, Back-Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chip can be attached either eutectically or with conductive epoxy • Smaller footprint than alternative configurations
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MIL-STD-883.
29-Mar-04
Vishay Power resistor
bcr efi
one wire
bcr resistor
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Untitled
Abstract: No abstract text available
Text: V ishay I ntertechnolog y, I nc . I INNOVAT AND TEC O L OGY Vishay Electro-Films N HN WIRE BONDABLE PASSIVE COMPONENTS O 19 62-2012 Resistors - High-Reliability Components Full Range of Wire Bondable Passive Components INTRODUCTION Vishay Electro-Films EFI offers a full range of wire bondable passive components that includes
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VMN-PL0439-1204
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military passive component
Abstract: No abstract text available
Text: V i s h ay I n t e r t e c h n o l o g y, I n c . V ishay Ele c tro - Films P A S S I V E C OM P ONENT S Wire Bondable Passive ComponentS Product Family P ROD U C T O V ER V IE W w w w. v i s h a y. c o m INTRODUCTION Vishay Electro-Films EFI offers a full range of wire bondable passive components that includes thin film resistors, MOS
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p65-6788-6668
VMN-PL0439-1003
military passive component
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Untitled
Abstract: No abstract text available
Text: SIEMENS BCP 54 . BCP 56 NPN Silicon AF Transistors • • • • For AF driver and output stages High collector current Low collector-emitter saturation voltage Complementary types: BCR 51 . BCP 53 PNP Type Marking Ordering Code (tape and reel) Pin Configuration
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Q62702-C2117
Q62702-C2119
Q62702-C2120
Q62702-C2148
Q62702-C2122
Q62702-C2123
Q62702-C2149
Q62702-C2125
Q62702-C2106
OT-223
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tantalum nitride
Abstract: bcr electrofilms back contact resistor
Text: ELECTRO-FILMS INC/ SEMI- 3ME 3101535 QQGQ174 b THIN-FILM BACK-CONTACT RESISTOR tFEA T U R ES t ì o The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assem bly time. They are manufactured in the sm allest chip size available.
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MIL-STD-883.
tantalum nitride
bcr electrofilms
back contact resistor
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Untitled
Abstract: No abstract text available
Text: Chip Resistors Features EFI offers the broadest line of thin-film chip resistors for hybrid circuit or chip-on-board applications from a single manufacturer. Both chip and wire or solder/conductive epoxy versions are available. Several variations each of single resistor, center-tapped, back contact, high resistance, and high frequency types are
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ACSR30
Abstract: pcs71 p51 apple p66 apple ice UARTO W65C802 65C26 DF-45 65C265S W65C265S
Text: WDC THE WESTERN DESIGN CENTER, INC. W65C265S S E C T IO N 1 W 65C 265S F U N C T IO N D E S C R IP T IO N 1.1 The W 65C 816S Static 8-and 16-bit M icroprocessor Core The W65C816S 16-bit microprocessor is the fully static may be stopped when PHI2 is high or low version of
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W65C265S
16-bit
W65C816S
W65C816
65C02
ACSR30
pcs71
p51 apple
p66 apple
ice UARTO
W65C802
65C26
DF-45
65C265S
W65C265S
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Untitled
Abstract: No abstract text available
Text: WDC THE WESTERN DESIGN CENTER, INC. W65C265S IN T R O D U C T IO N The W D C W 65C265S m icrocom puter is a com plete fully static 16-bit com puter fabricated on a single chip using a H i-R el low pow er CM OS process. T he W 65C265S com plem ents an established and
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W65C265S
65C265S
16-bit
65C265S
65C816S
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ROY TODD
Abstract: DF27 555 timer W65C802 1203 6d df20 p661 t40 p521 65C02 W65C02S
Text: WDC THE WESTERN DESIGN CENTER, INC. W65C265S IN T R O D U C T IO N The W D C W 65C 265S m icrocom puter is a com plete fully static 16-bit com puter fabricated on a single chip using a H i-Rel low pow er CM O S process. The W 65C265S com plem ents an established and grow ing line
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W65C265S
W65C265S
16-bit
65C265S
65C816S
0000b?
ROY TODD
DF27
555 timer
W65C802
1203 6d
df20
p661
t40 p521
65C02
W65C02S
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Untitled
Abstract: No abstract text available
Text: ► in t e i  I M K i O M F Û fô G M T T O !*!] UPI-452 CHMOS PROGRAMMABLE I/O PROCESSOR 83C452 - 8K x 8 Mask Programmable Internal ROM 80C452 - External ROM/EPROM Two 16-Bit Timer/Counters Boolean Processor Bit Addressable RAM 8 Interrupt Sources Programmable Full Duplex Serial
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UPI-452
83C452
80C452
16-Bit
68-Pin
83C452/80C452
MCS-51
128-Byte
87C452P)
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