TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
|
Original
|
PDF
|
|
ASTM D2240, D412
Abstract: ASTM D412 D1458 D149 D150 D2240 D257 D374 D412 PPK10
Text: Poly-Pad K-10 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits • Thermal impedance: 0.60°C-in2/W @50 psi • Polyester based • For applications requiring non-silicone conformal coatings • Designed for silicone-sensitive applications
|
Original
|
PDF
|
D2240
D1458
ASTM D2240, D412
ASTM D412
D1458
D149
D150
D2240
D257
D374
D412
PPK10
|
ASTM D2240, D412
Abstract: ASTM D412 ASTM D5470 d1458 D2240 D257 D374 D412 D149 D150
Text: Poly-Pad K-10 Polyester Based Thermally Conductive Insulation Material Features and Benefits • Thermal impedance 2 0.60°C-in /W @50 psi Typical Properties of Poly-Pad K-10 Property Imperial Value Metric Value Test Method Color Yellow Yellow Visual
|
Original
|
PDF
|
D2240
D1458
ASTM D2240, D412
ASTM D412
ASTM D5470
d1458
D2240
D257
D374
D412
D149
D150
|
MIL-I-49456
Abstract: SIL-PAD E59150 MIL-M-38527 SIL-PAD K10 MIL-M-38527C ASTM D412 for rubber MIL-M-87111 ASTM D412 D150
Text: Sil-Pad K-10 ® The High Performance Kapton Based Insulator Features and Benefits • Thermal impedance 2 0.41°C-in /W @50 psi Typical Properties of Sil-Pad K-10 Property Imperial Value Metric Value Test Method Beige Beige Visual Color Reinforcement Carrier
|
Original
|
PDF
|
D2240
D1458
MIL-I-49456
SIL-PAD
E59150
MIL-M-38527
SIL-PAD K10
MIL-M-38527C
ASTM D412 for rubber
MIL-M-87111
ASTM D412
D150
|
Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Poly-Pad K-10 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits T YPICAL PROPERT IES OF POLY-PAD K-10 PROPERTY IMPERIAL VALUE Color Yellow Reinforcement Carrier Kapton Thickness inch / (mm) 0.006 Hardness (Shore A) 90 Breaking Strength (lbs/inch) / (kN/m)
|
Original
|
PDF
|
O-220
|
Untitled
Abstract: No abstract text available
Text: Poly-Pad K-10 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits TYPICAL PROPERTIES OF POLY-PAD K-10 PROPERTY IMPERIAL VALUE Color Yellow Reinforcement Carrier Kapton Thickness inch / (mm) 0.006 Hardness (Shore A) 90 Breaking Strength (lbs/inch) / (kN/m)
|
Original
|
PDF
|
O-220
|
SIL-PAD
Abstract: D412 SIL-PAD K10 D1458 D149 D150 D2240 D257 D374 kapton film
Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators TYPICAL PROPERTIES OF SIL-PAD K-10
|
Original
|
PDF
|
D2240
D1458
SIL-PAD
D412
SIL-PAD K10
D1458
D149
D150
D2240
D257
D374
kapton film
|
bergquist
Abstract: SIL-PAD K10 ASTM D2240, D412 astm D150 ASTM D2240 ASTM D412 D412 D1458 D149 D150
Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators TYPICAL PROPERTIES OF SIL-PAD K-10
|
Original
|
PDF
|
D2240
D1458
bergquist
SIL-PAD K10
ASTM D2240, D412
astm D150
ASTM D2240
ASTM D412
D412
D1458
D149
D150
|
Untitled
Abstract: No abstract text available
Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in 2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators T YPICAL PROPERT IES OF SIL-PAD K-10
|
Original
|
PDF
|
D2240
D1458
|
Heatsinks
Abstract: No abstract text available
Text: VM Series Variable Mount Heatsink Series Ohmite introduces this new versatile heatsink design. This new design can accommodate several different industry packages. This design also lets the customer choose a mounting style using screws or clips for secure mounting to the heatsink. These one
|
Original
|
PDF
|
VM1-038-1AE
VM2-038-1AE
O-247,
O-220)
1-866-9-OHMITE
Heatsinks
|
Untitled
Abstract: No abstract text available
Text: heatsink B60/C60 Series Ohmite introduces the power C series heat sink with improved Cam N Lock spring clip Pat. Pending . This series offers flexible, high performance and compact heat sink with exchangeable cam clip system for TO-220, TO-247, and TO-264 devices. The built in lip is provided for mounting ease. The optional B
|
Original
|
PDF
|
B60/C60
O-220,
O-247,
O-264
C60XX-058-AE
CLA-T247-21E
O-247
O-264
1-866-9-OHMITE
|
Untitled
Abstract: No abstract text available
Text: heatsink C40 Heat Sink System The C40 Series Heat Sink System Patent Pending offers flexible, high performance and compact heat sinks with an exchangeable cam clip system for TO247, TO-264 and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole
|
Original
|
PDF
|
O-264
OT-227
C40-058-VE
C40-058-AE
CLA-T247-21E
O-247
O-264
1-866-9-OHMITE
|
Heatsinks to-220
Abstract: A366 A228 thermal resistance case heat sink heat sink Tgon 800 SIL-PAD to-247 SIL-PAD density
Text: C Series Ohmite introduces the C series Pat. Pending . This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-247 packages (TO-220 and TO-264 available). This powerful heat sink provides tool and
|
Original
|
PDF
|
O-247
O-220
O-264
O-220
1-866-9-OHMITE
Heatsinks to-220
A366
A228
thermal resistance case heat sink
heat sink
Tgon 800
SIL-PAD to-247
SIL-PAD density
|
|
|
Untitled
Abstract: No abstract text available
Text: B60/C60 Series Heat Sink System Ohmite introduces the power C series heat sink with improved Cam N Lock spring clip Pat. Pending . This series offers flexible, high performance and compact heat sink with exchangeable cam clip system for TO-220, TO-247, and
|
Original
|
PDF
|
B60/C60
O-220,
O-247,
O-264
C60XX-058-AE
CLA-T247-21E
O-247
O-264
1-866-9-OHMITE
|
smd diode K10
Abstract: switching transformer 300w fuse 6.3A 250v IR1150 800V dc to dc boost converter 019-4119-00 C8100 10BQ040N SIL-PAD to-247 330uf 450v
Text: Computing & Communications SBU - AC-DC APPLICATIONS GROUP 101 N.Sepulveda Blvd., EL Segundo 90245 CALIFORNIA, USA IRAC1150-300W Demo Board User’s Guide Rev.2.2 3/29/2005 Rev. 2.2 3/29/2005 International Rectifier Page 1 of 17 Table of Contents 1
|
Original
|
PDF
|
IRAC1150-300W
CISPR-22
115VAC
smd diode K10
switching transformer 300w
fuse 6.3A 250v
IR1150
800V dc to dc boost converter
019-4119-00
C8100
10BQ040N
SIL-PAD to-247
330uf 450v
|
Untitled
Abstract: No abstract text available
Text: HEATSINK C Series TO-126, TO-247, TO-220 and TO-264 Package Heatsinks Ohmite introduces the C series Pat. Pending . This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264
|
Original
|
PDF
|
O-126,
O-247,
O-220
O-264
O-220,
O-247
O-264
C247-075-3VEà
C247-025-1AEà
|
Untitled
Abstract: No abstract text available
Text: C Series F E AT U R E S TO-126, TO-247, TO-220 and TO-264 Package Heatsinks Ohmite introduces the C series Pat. Pending . This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264
|
Original
|
PDF
|
O-126,
O-247,
O-220
O-264
O-220,
O-247
O-264
C247-025-1AE
C247-050-2AE
|
SIL-PAD 1000 TO 247
Abstract: Tgon 800 SIL-PAD to-264 C1260-40 C126 C264-058 SIL-PAD density TO220 land pattern "Tgon 800" TO220 SMALL heatsink
Text: HEATSINK C Series TO-126, TO-247, TO-220 and TO-264 Package Heatsinks Ohmite introduces the C series Pat. Pending . This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264
|
Original
|
PDF
|
O-126,
O-220,
O-247
O-264
C247-025
C247-050
C247-075
C264-030
C264-058
C264-085
SIL-PAD 1000 TO 247
Tgon 800
SIL-PAD to-264
C1260-40
C126
SIL-PAD density
TO220 land pattern
"Tgon 800"
TO220 SMALL heatsink
|
diode d1n4148 in 3 phase rectifier
Abstract: 019-4119-00 300w power diode fuse 6.3A 250v smd diode K10 ac variac IR1150 international rectifier SMD SIL-PAD to-247 SMD step up transformer 1W
Text: Computing & Communications SBU - AC-DC APPLICATIONS GROUP 101 N.Sepulveda Blvd., EL Segundo 90245 CALIFORNIA, USA IR1150S Demo Board User’s Guide Rev.2.1 3/3/2005 Rev. 2.0 3/3/2005 International Rectifier Page 1 of 17 Table of Contents 1
|
Original
|
PDF
|
IR1150S
CISPR-22
115VAC
diode d1n4148 in 3 phase rectifier
019-4119-00
300w power diode
fuse 6.3A 250v
smd diode K10
ac variac
IR1150
international rectifier SMD
SIL-PAD to-247
SMD step up transformer 1W
|
IRAC1150-300W
Abstract: International Rectifier switching transformer 300w schematic diagram for ac line voltage monitor 330uf 450v d1n4148 SMD step up transformer 1W 019-4119-00 ir1150 application note ac variac
Text: Computing & Communications SBU - AC-DC APPLICATIONS GROUP 222 Kansas Street, EL Segundo 90245 CALIFORNIA, USA IRAC1150-300W Demo Board User’s Guide Rev 3.0 8/2/2005 Rev 3.0 8/2/2005 International Rectifier Page 1 of 18 Table of Contents 1
|
Original
|
PDF
|
IRAC1150-300W
IRAC1150-300W
International Rectifier
switching transformer 300w
schematic diagram for ac line voltage monitor
330uf 450v
d1n4148
SMD step up transformer 1W
019-4119-00
ir1150 application note
ac variac
|
SIL-PAD to-247
Abstract: ASTM-A228 A228 T247 SIL-PAD K10 A366 C110 ASTM-A-366 TO220 HEATSINK Heatsinks TO247
Text: WV Series Heatsinks For TO-220 and TO-247 devices T220 0.72" 18.3mm T247 0.92" (23.4mm) 0.63" (16.0mm) T220 1.20" (30.5mm) T247 1.20-1.26" (30.5-32.0mm) Ohmite Manufacturing has launched a series of heatsink solutions for use with our popular TO-220 and TO-247
|
Original
|
PDF
|
O-220
O-247
O-247
6063T5
900-S,
800-S,
WV-T220-101E
O-220
WV-T247-101E
SIL-PAD to-247
ASTM-A228
A228
T247
SIL-PAD K10
A366
C110
ASTM-A-366
TO220 HEATSINK
Heatsinks TO247
|
K177-353BQ2840
Abstract: K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353
Text: HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and other similar devices requiring effective transfer of generated heat. Highly conductive aluminium foil with adhesive applied to both sides negates the
|
Original
|
PDF
|
KA150-2AC.
300mm
KA150-2AC-30X30
5-100X100
2-100X100
0-100X100
5000Vrms
K177-353BQ2840
K177-NA-353
K1778
TSC209-ZP
k177
TSC506-NY
K200-AC-403
TSC405-ZP
K177-AC-353
K200-AC-353
|
Untitled
Abstract: No abstract text available
Text: HEATSINK For TO-220, TO-247, and TO-264 F E AT U R E S Ohmite’s R2 Series patent pending heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the
|
Original
|
PDF
|
O-220,
O-247,
O-264
O-264
O-220:
|