AF14
Abstract: AC22 AE23 EPF10K200S AE10-AE11 AE20-AE21 AJ43
Text: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)
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Original
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EPF10K200S
240-Pin
356-Pin
484-Pin
599-Pin
600-Pin
672-Pin
AF14
AC22
AE23
AE10-AE11
AE20-AE21
AJ43
|
PDF
|
t25 4 J9
Abstract: t25 4 j5 T25 4 E8 t25 4 F6 EPF10K200S T25 4 E5 t35 4 c8 af14 ba43 bf44
Text: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)
|
Original
|
EPF10K200S
240-Pin
356-Pin
484-Pin
599-Pin
600-Pin
672-Pin
t25 4 J9
t25 4 j5
T25 4 E8
t25 4 F6
T25 4 E5
t35 4 c8
af14
ba43
bf44
|
PDF
|
t25 4 J9
Abstract: be37 AR-17 BA41 AA43 t25 4 L9 BA43 t25 4 F6 t25 4 H9 BE43
Text: EPF10K200S Device Pin-Outs ver. 1.1 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)
|
Original
|
EPF10K200S
240-Pin
356-Pin
484-Pin
599-Pin
600-Pin
672-Pin
t25 4 J9
be37
AR-17
BA41
AA43
t25 4 L9
BA43
t25 4 F6
t25 4 H9
BE43
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PDF
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EP20K100E
Abstract: t25 4 j5
Text: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8
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Original
|
EP20K100E
144-Pin
208-Pin
240-Pin
324-Pin
356-Pin
PT-EP20K100E-1
t25 4 j5
|
PDF
|
XC95216-20PQG160I
Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but
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Original
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XC95216
352-pin
XC95288
XCN07010
352-pin
XC95216-20PQG160I
XC95216-15PQ160I
471 E25
XC95216 Family
XC95216-10PQ160C
XC95216-10PQ160I
XC95216-15PQG160C
XC95216-15PQG160I
XC95216-10PQG160I
XC9500
|
PDF
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T25 4 h5
Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
Text: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –
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Original
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EP20K60E
144-Pin
208-Pin
240-Pin
324-Pin
356-Pin
T25 4 h5
AE23
AF23
356-pin
215 bga
BGA128
|
PDF
|
AE23
Abstract: EP20K100E
Text: EP20K100E I/O Pins ver. 1.1 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP PQFP PQFP FineLine 1 (1) (1) BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8
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Original
|
EP20K100E
144-Pin
208-Pin
240-Pin
144-Pin
324-Pin
356-Pin
AE23
|
PDF
|
60068-2-14Na
Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
Text: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.
|
Original
|
E174442.
16x16
19x19
20x20
60068-2-14Na
13x13
C17200
pin grid array ppm
IEC, cyclic moisture resistance test
510-PP-NNN-XX-XXX101
17x17 bga thermal resistance
|
PDF
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AE23
Abstract: EP20K100E AF-1
Text: EP20K100E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – – – – 8 8 8 Pad Number Orientation Pin/Pad Function 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA FineLine BGA BGA
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Original
|
EP20K100E
144-Pin
208-Pin
240-Pin
144-Pin
324-Pin
356-Pin
AE23
AF-1
|
PDF
|
AH35
Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
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Original
|
EP20K1000C
652-Pin
672-Pin
020-Pin
AH35
AA10
AM11
AN10
AN11
817 g24
b34 844
AB30
af31
|
PDF
|
AA10
Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
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Original
|
EP20K600C
652-Pin
672-Pin
020-Pin
AA10
AE10
AF10
AG10
AJ10
AK10
AF31
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF
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Original
|
VL493T2863E-E7S/E6S
128MX72
VL493T2863E
128Mx8
25-bit
200-pin
200-pin,
|
PDF
|
74HC595 SMD
Abstract: smd transistor w18 T2D DIODE 46 8 pin SMD ic 2068 smd 1a2 QE r525 QE R519 T04 p6 smd GMC31X7R104K50NT u1g SMD
Text: LXD9781 BGA Demo Board with FPGAs for RMII-to-MII Conversion Developer Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249044-001 LXD9781 BGA Demo Board with FPGAs for RMII-to-MII Conversion User Guide.
|
Original
|
LXD9781
12065C104KATMA
SMS-120-01-G-D
R58-60,
1/10W
R230-237
20-SOP
SN74LVTH244ADWR
74HC595 SMD
smd transistor w18
T2D DIODE 46
8 pin SMD ic 2068
smd 1a2
QE r525
QE R519
T04 p6 smd
GMC31X7R104K50NT
u1g SMD
|
PDF
|
DDR2-667
Abstract: DDR2-800 PC2-5300 PC2-6400
Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF
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Original
|
VL493T2863E-E7S/E6S
128MX72
VL493T2863E
128Mx8
25-bit
200-pin
200-pin,
DDR2-667
DDR2-800
PC2-5300
PC2-6400
|
PDF
|
|
|
heller 1700
Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
Text: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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Original
|
240-Pin
heller 1700
BGA reflow guide
reflow hot air BGA
BGA PACKAGE thermal profile
pcb warpage after reflow
BGA Solder Ball collapse
|
PDF
|
mmic-amplifier
Abstract: VPS05178 337 BGA
Text: BGA 312 Silicon Bipolar MMIC-Amplifier 3 Cascadable 50 -gain block 11 dB typical gain at 1.0 GHz 4 9 dBm typical P -1dB at 1.0 GHz 3 dB-bandwidth: DC to 2.0 GHz 2 1 RF IN RF OUT/Bias 1 VPS05178 3 Circuit Diagram 2, 4 GND EHA07312 Type Marking BGA 312
|
Original
|
VPS05178
EHA07312
OT-143
Oct-26-1999
mmic-amplifier
VPS05178
337 BGA
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL393T5263F-F7Y/E7Y/E6Y REV: 1.0 General Information 4GB 512Mx72 DDR2 SDRAM ULP REGISTERED ECC DIMM 240-PIN Description The VL393T5263F is a 512Mx72 DDR2 SDRAM high density DIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, two 25-bit registered buffers in BGA
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Original
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VL393T5263F-F7Y/E7Y/E6Y
512Mx72
240-PIN
VL393T5263F
256Mx8
25-bit
240-pin
80TYP
|
PDF
|
AG10
Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
Text: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7
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Original
|
020-Pin
672-Pin
TRACEPKT10
TRACEPKT11
AG10
AJ10
AK10
b3640
b1333
B10-301
B9432
b12123
B8528
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL393T5263F-F7Y/E7Y/E6Y REV: 1.0 General Information 4GB 512Mx72 DDR2 SDRAM ULP REGISTERED ECC DIMM 240-PIN Description The VL393T5263F is a 512Mx72 DDR2 SDRAM high density DIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, two 25-bit registered buffers in BGA
|
Original
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VL393T5263F-F7Y/E7Y/E6Y
512Mx72
240-PIN
VL393T5263F
256Mx8
25-bit
240-pin
80TYP
|
PDF
|
B8530
Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
Text: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7
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Original
|
020-Pin
672-Pin
TRACEPKT10
TRACEPKT11
B8530
OAH29
B13101
AG10
AJ10
B10-276
B8472
B1370
B3640
|
PDF
|
miniDIMM JEDEC
Abstract: DDR2-800 PC2-6400 minidimm A12209
Text: Product Specifications PART NO.: VL495T5763E-E7Y REV: 1.1 General Information 2GB 256Mx72 DDR2 SDRAM VLP ECC REGISTERED Mini-DIMM 244-PIN Description The VL495T5763E is a 256Mx72 DDR2 SDRAM high density Mini-DIMM. This memory module consists of nine CMOS 256Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA
|
Original
|
VL495T5763E-E7Y
256Mx72
244-PIN
VL495T5763E
256Mx8
25-bit
244-pin
VN-281009
miniDIMM JEDEC
DDR2-800
PC2-6400
minidimm
A12209
|
PDF
|
PC2-3200
Abstract: PC2-5300 DM-3110
Text: Product Specifications PART NO: REV: 1.0 VL493T5666E-E6M/D5M/CCM General Information 2GB 256MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description: The VL493T5666E is a 256Mx72 DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine DDP CMOS 256Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA
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Original
|
VL493T5666E-E6M/D5M/CCM
256MX72
VL493T5666E
256Mx8
25-bit
200-pin
PC2-3200
PC2-5300
DM-3110
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL495T5263A-E6Y REV: 1.2 General Information 4GB 512Mx72 DDR2 SDRAM ECC REGISTERED Mini-DIMM 244-PIN Description The VL495T5263A is a 512Mx72 DDR2 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 28-bit registered buffer in BGA
|
Original
|
VL495T5263A-E6Y
512Mx72
244-PIN
VL495T5263A
256Mx8
28-bit
244-pin
VN-281009
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SIEMENS BGA 312 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 Q-gain block • 11 dB typical gain at 1.0 GHz • 9 dBm typical P.\ ¿b at 1 0 Gl• 3 dB-bandwidth: DC to 2.0 Gl RFINoCircuit Diagram EHA07312 Type Marking Ordering Code BGA 312 BMs
|
OCR Scan
|
EHA07312
Q62702-G0042
OT-143
|
PDF
|
