PCT-GF30
Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX166
CuZn36Pb3
C36000)
20x20
514-83-256M20-001148.
CH-2800
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514-PP-NNNMXX-XXX148
Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm
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AC100Vrms/DC150V
E18-084-17-400
540PLCC
UL94V-0
600Vrms
514-PP-NNNMXX-XXX148
IEC60325
558-10-NNNPXX-XXX102
CuSn4Pb4Zn4
540-88-044
16x16 bga
PT4642
558-10-NNNPXX-XXX103
540-88-032-24-000-1
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BG329
Abstract: BGA 27X27 pitch
Text: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines
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CS128
CS180
BG272
BG313
BG329
FG144
FG256
FG484
FG676
FG896
BGA 27X27 pitch
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35x35 bga
Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169
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PREC68
35x35 bga
C17200
C54400
540-88-084-17-400
CuSn4Pb4Zn4
MO-052 footprint
157 BGA socket
51877
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX152
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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PPC750FX
Abstract: 1mm pitch BGA socket thick bga die size 750FX SG-BGA-6051 0.125mm BGA
Text: GHz BGA Socket - Direct mount, solderless Features Top View Socket supports IBM PowerPC 750FX as well as other BGA devices. Directly mounts to target PCB needs tooling holes with included hardware. High speed, reliable elastomer connection. Minimum real estate required.
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750FX
225mm
725mm
025mm
SG-BGA-6051
125mm
PPC750FX
1mm pitch BGA socket
thick bga die size
0.125mm BGA
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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558-10-NNNMXX-XXX104
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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60068-2-14Na
Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
Text: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.
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E174442.
16x16
19x19
20x20
60068-2-14Na
13x13
C17200
pin grid array ppm
IEC, cyclic moisture resistance test
510-PP-NNN-XX-XXX101
17x17 bga thermal resistance
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
CH-2800
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Preci-Dip
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
20x20
CH-2800
Preci-Dip
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Preci-Dip Durtal SA
Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin
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CH-2800
540-PP-020-24-000-1
540-PP-028-24-000-1
540-PP-032-24-000-1
540-PP-044-24-000-1
540-PP-052-24-000-1
540-PP-068-24-000-1
540-PP-084-24-000-1
Preci-Dip Durtal SA
C17200
510-91-168-17
pga 132 packaging
CuSn4Pb4Zn4
94vo fr4
Durtal
SMD 2.54 90 Header
514-PP-NNNMXX-XXX148
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SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.
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025mm
FR4/G10
Sn63Pb37
SG-BGA-6046
SG-MLF-7004
156 QFN 12X12
diode sg 87
1mm pitch BGA socket
SG-BGA-6094
BGA Solder Ball compressive force
17X17* BGA 289
SG-MLF-7003
SG-BGA-6033
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SF-BGA400A-B-41
Abstract: No abstract text available
Text: 21.00mm [0.827"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 21.00mm [0.827"] Top View 19.00mm [0.748"] Ø 0.23mm [0.009"] ±0.0005" Side View 1.68mm [0.066"] 2 1 3 Description: Giga-snaP BGA SMT Foot 400 position male terminal pins to solder balls 1.0mm [0.039"] centers, 20x20 array
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20x20
FR4/G10
SF-BGA400A-B-41
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SG-BGA-7026
Abstract: DP-110
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 16.125mm
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125mm
SG-BGA-7026
DP-110
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SG-BGA-6150
Abstract: b 6150
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. Ø 15mm High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 32.225mm
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225mm
SG-BGA-6150
725mm
725mm
025mm
125mm.
b 6150
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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SG-BGA-7111
Abstract: micron 100 ball BGA 7111
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 15.225mm Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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225mm
SG-BGA-7111
725mm
025mm
125mm.
micron 100 ball BGA
7111
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SG-BGA-6136
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 22.225mm Ball guide prevents over compression of elastomer
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225mm
5M-1994.
20x20
SG-BGA-6136
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PA-PGA181-02W
Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for
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12X12mm.
FR4/G10
PA-PGA181-02W
PA-SO42-S-01
actel 14100
BGA169C
PA-PGA68-01
ax 6001 mp3
PA-QIP90-01
PA-PLCC84-02
intel 82310
PA-PGA301-01
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SG-BGA-6202
Abstract: LA 6202
Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 26.225mm Ball guide prevents over compression of elastomer
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225mm
725mm.
725mm
025mm
SG-BGA-6202
125mm
LA 6202
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Untitled
Abstract: No abstract text available
Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and
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26x26
985-15x15
nnn-03-30
985-16X16-nnn-03-30
985-17X17-nnn-03-30
18X18-nnnâ
19X19--n
985-20X20-nm-03-30
985-21X21
-nnn-03-30
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Untitled
Abstract: No abstract text available
Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and
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26x26
15X15
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Untitled
Abstract: No abstract text available
Text: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*
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NP276
100MQ
100VDC
100VAC
NP276-119
NP276-
NP276-1
190BGA^
27x27
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