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    BGA 23 X 23 ARRAY Search Results

    BGA 23 X 23 ARRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 23 X 23 ARRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    WLFT 404

    Abstract: No abstract text available
    Text: Hola1 H A H Heatsinks for BGAs B C – particularly suited for Ball Grid Arrays – heatsink dimensions match the respective BGA-type – can be glued directly on the BGA component D art. no. E ICK BGA 10 x 10 WLF . 10 x 10 art. no. F ICK BGA 10 x 10 x 10


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    Untitled

    Abstract: No abstract text available
    Text: A Heatsinks for BGAs B C D – – – – – particularly suited for Ball Grid Arrays heatsink dimensions match the respective BGA-type can be glued directly on the BGA component double-sided adhesive thermal conductive foil WLF . ➔ E 7 surface: black anodised


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    AC-27621

    Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
    Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C


    Original     		PDF NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842

    bga 576 socket

    Abstract: IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket
    Text: IC280 Series Clamshell Ball Grid Array (FBGA / CSP / LGA) Specifications Part Number (Details) 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch 500V AC for 1 minute for 0.80mm pitch 100V AC for 1 minute for 0.75mm pitch


    Original     		PDF IC280 10mA/20mV IC280 696pins IC280-69605 00x37 bga 576 socket IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket

    bga 576 socket

    Abstract: 7400 NP276-37206-AC03134 NP276-62525-A marcon+capacitor+5840 AC-06524 AC-09801 65227 NP276-37206AC-03134 NP276-37206-AC03327
    Text: BGA NP276 Series Arrays Socket Series No. of Leads Material PEI Glass Filled UL94V-0 Beryllium Copper Gold over Nickel Design No. Positioning Pin Identification Depopulated Versions Available Quad Flat Packages ∅ ∅ ∅ ± Speciality Test Products ∅


    Original     		PDF NP276 10mA/20mV UL94V-0 NP276-372 NP276-11935 NP276-37206-AC03143 NP276-15334-* NP276-37206-A -AC09608 bga 576 socket 7400 NP276-37206-AC03134 NP276-62525-A marcon+capacitor+5840 AC-06524 AC-09801 65227 NP276-37206AC-03134 NP276-37206-AC03327

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For .050” Grid Male Pin Adapters & Female Socket Series 587, 582 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 8737/4048 adapter or a 4098/4054


    Original     		PDF XXX-XX-576-15-005 XXX-XX-596-15-005 XXX-XX-644-15-005 XXX-XX-656-15-005 XXX-XX-520-16-005 XXX-XX-665-16-005 XXX-XX-672-16-005 XXX-XX-736-16-005 XXX-XX-768-16-005 XXX-XX-940-16-005

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For .050” Grid Male Pin Adapters & Female Socket Series 587, 582 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-toboard interconnect. • The BGA device is soldered to a 8737/4048


    Original     		PDF XXX-XX-576-15-005 XXX-XX-596-15-005 XXX-XX-644-15-005 XXX-XX-656-15-005 XXX-XX-520-16-005 XXX-XX-665-16-005 XXX-XX-672-16-005 XXX-XX-736-16-005 XXX-XX-768-16-005 XXX-XX-940-16-005

    ic280 yamaichi

    Abstract: IC280-169-127 IC280-196-126 IC280-72918 IC280-72919 X2335
    Text: IC280 Series Clamshell Ball Grid and Fine Ball Grid Array (BGA / FBGA) Part Number (Details) Specifications 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m Ω max. at 10mA/20mV max. or


    Original     		PDF IC280 10mA/20mV IC280-72949 80x26 ic280 yamaichi IC280-169-127 IC280-196-126 IC280-72918 IC280-72919 X2335

    entek Cu-56

    Abstract: thick bga die size Cu-56 stencil tension BGA "direct replacement" bga rework "ball collapse" height
    Text: APPNote #37 BGA Board Level Assembly and Rework Recommendations 4/19/00 Abstract This application note provides the recommendations for board level assembly for the ballgrid array BGA package family. These recommendations were derived from work done by the Universal BGA/DCA (Ball Grid Array/Direct Chip Attach) Consortium. The


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    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


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    HXC125

    Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
    Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The


    Original     		PDF 1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


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    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


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    BGA 23 x 23 array

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


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    IC274-625133

    Abstract: 625133 IC274-11901 IC274-529118 2212X
    Text: IC274 Series Handler Type Ball Grid Array / Chip Scale Package (BGA/FBGA/CSP) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 500V DC 500V AC for 1 minute


    Original     		PDF IC274 10mA/20mV IC274-625133 IC274-11901 IC274-529118 AC-09581 IC274-324* IC274-388* 625133 IC274-11901 2212X

    to 225 footprint

    Abstract: pin grid array ppm
    Text: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		PDF pre-tinn-55 to 225 footprint pin grid array ppm

    106 10k 804

    Abstract: 106F 213B
    Text: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &


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    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    C732B

    Abstract: 337 BGA 337 BGA footprint EPM7032AE EPM7064AE EPM7128A EPM7128AE EPM7256A EPM7256AE EPM7512AE
    Text: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family August 2000, ver. 3.1 Data Sheet • Features. ■ ■ ■ ■ ■ ■ ■ f High-performance 3.3-V EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


    Original     		PDF 7000AE JESD-71 EPM7128A EPM7256A 49-pin 169-pin C732B 337 BGA 337 BGA footprint EPM7032AE EPM7064AE EPM7128AE EPM7256AE EPM7512AE

    TTL pin outs

    Abstract: 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs
    Text: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family September 1999, ver. 2.03 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


    Original     		PDF 7000AE EPM7128A EPM7256A 256-pin TTL pin outs 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs

    Routability

    Abstract: XAPP157 FG676 BGA 23 x 23 array FG1156 FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball
    Text: Application Note: Virtex Series R XAPP157 v1.0 July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilinx supplies full array fine-pitch BGA (Ball Grid Array) packages with 1.00 mm ball pitch.


    Original     		PDF XAPP157 FG1156 Routability XAPP157 FG676 BGA 23 x 23 array FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball

    SQ3300

    Abstract: to 252 footprint
    Text: ADVANCED INTERCONNECTIONS, Ball Grid Array Socketing System 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 80 0-424-9850 / 40 1-823-5200 • Fax 40 1-823-8723 •Email advintcorp@ aol.com • Internet http://wvwv.advlntcorp.com BGA Adapter Sockets


    OCR Scan     		PDF 02SSSfl5 SQ3300 to 252 footprint

    7064B

    Abstract: m7512b
    Text: MAX 7000B M Ï Ï I 3 Â. Programmable Logic Device Family August 1999. ve Data Sheet Features. • Preliminary Information ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array M atrix (MAX ) architecture (see Table 1)


    OCR Scan     		PDF 7000B 7000S 7128B 7256B 7512B 7064B m7512b

    PJO 399

    Abstract: PJO 389 PJO 499 B13128 pjo 489 7512A PJO 376 PJO 386
    Text: MMMA. MAX 7000A Includes MAX7000AE Programmable Logic Device Family May 1999, ver. 2 Data Sheet Features. • ■ ■ Prelim inary Information ■ ■ ■ ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


    OCR Scan     		PDF MAX7000AE EPM7128A EPM7256A EPM7128AE EPM7256AE EPM7512AE PJO 399 PJO 389 PJO 499 B13128 pjo 489 7512A PJO 376 PJO 386