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    BGA 81 BALL Search Results

    BGA 81 BALL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 81 BALL Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BlueCore 3 csr

    Abstract: CSR BLUECORE SPI BlueCore 4 BSC COMPUTER SCIENCE digital logic design Notes BlueCore 4 csr BlueCore 5 csr CSR BLUECORE application BLUECORE uart module CSR BLUECORE module csr rf
    Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included


    Original     		81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d BC01bv BlueCore 3 csr CSR BLUECORE SPI BlueCore 4 BSC COMPUTER SCIENCE digital logic design Notes BlueCore 4 csr BlueCore 5 csr CSR BLUECORE application BLUECORE uart module CSR BLUECORE module csr rf PDF

    BlueCore 3 csr

    Abstract: BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application
    Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included


    Original     		81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d bc01bv BlueCore 3 csr BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application PDF

    SF-BGA81A-B-41

    Abstract: No abstract text available
    Text: 10.00mm [0.394"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 10.00mm [0.394"] Top View 8.00mm [0.315"] Ø 0.20mm [0.008"] ±0.0005" 1.68mm [0.066"] 2 3.76mm [0.148"] 1 Side View 3 Description: Giga-snaP BGA SMT Foot 81 position male terminal pins to solder balls


    Original     		FR4/G10 SF-BGA81A-B-41 PDF

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    IPC-SM-780

    Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		oC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life PDF

    IPC-SM-780

    Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		varyinI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP IPC-SM-786 PDF

    IPC-SM-785

    Abstract: 84501 GR-1217-CORE 74221 84500 74213 Telcordia 74390 8453 back to board connector
    Text: BOARD-TO-BOARD CONNECTORS MEG-ARRAY HIGH SPEED MEZZANINE CONNECTORS FEATURES RoHS Compliant Lead-Free Ball Grid Array (BGA) termination for process friendly attachment .050" x .050" BGA interface pitch optimizes routing and electrical performance Stack Heights available from 4mm to


    Original     		GR-1217-CORE NPS-25298-2 IPC-SM-785 84501 74221 84500 74213 Telcordia 74390 8453 back to board connector PDF

    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		PDF

    bc 352 b

    Abstract: BU-61860 BU-61740B3
    Text: www.ddc-web.com Micro-ACE * µ-ACE MODEL: BU-61740B3/61840B3/61860B3 FEATURES • • • • • .815 X .815 inches Smallest Complete 1553 Terminal 128-Ball Plastic BGA Package 0.120 inch Max Height Enhanced Mini-ACE Architecture Multiple Configurations:


    Original     		BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 bc 352 b BU-61860 BU-61740B3 PDF

    STANAG 3838

    Abstract: BU-61740B3
    Text: www.ddc-web.com TM µ-ACE Micro-ACE MODEL: BU-61740B3/61840B3/61860B3 FEATURES • • • • • .80 X .80 inches Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE Architecture Multiple Configurations:


    Original     		BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 STANAG 3838 BU-61740B3 PDF

    BU-6474XB

    Abstract: BU-64840R3 BU-64860B3
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3 PDF

    STANAG 3838

    Abstract: BU-BU-64863B BU-64840R3 BU-61860B3-601
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 STANAG 3838 BU-BU-64863B BU-64840R3 BU-61860B3-601 PDF

    BU6184

    Abstract: vram 64k BU-6186 BU-61840B3 BU-6184
    Text: www.ddc-web.com TM µ-ACE Micro-ACE MODEL: BU-61740B3/61840B3/61860B3 FEATURES • • • • • .80 X .80 inches Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE Architecture Multiple Configurations:


    Original     		BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 BU6184 vram 64k BU-6186 BU-61840B3 BU-6184 PDF

    bu61740b

    Abstract: BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal
    Text: Micro-ACE , Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 bu61740b BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal PDF

    Untitled

    Abstract: No abstract text available
    Text: Package Diagrams Index of Package Diagrams 100-Pin TQFP . 100-Ball BGA . 120-Pin PQFP .


    Original     		100-Pin 100-Ball 120-Pin 128-Pin 133-Pin 144-Ball 160-Pin 176-Pin PDF

    10123982-001LF

    Abstract: 84512-102 74221-101LF
    Text: BOARD TO BOARD CONNECTORS MEG-Array MEZZANINE Connector system HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY DESCRIPTION The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by


    Original     		10123982-291LF 74221-091LF 74221-191LF 74221-291LF 74388-091LF 74388-191LF 74388-291LF 74390-091LF 74390-191LF 74390-291LF 10123982-001LF 84512-102 74221-101LF PDF

    SF-BGA81A-B-42

    Abstract: No abstract text available
    Text: Patent Pending Ordering Information: Solder Ball Alloy Part Number Suffix Top View Sn63Pb37 Sn96.5Ag3.0Cu0.5 10.00mm [0.394"] -42 1.00mm [0.039"] -42F* 1.00mm typ. *RoHS Compliant 1.00mm [0.039"] 10.00mm [0.394"] 1.33mm [0.052"] 2.36mm [0.093"] Side View Detail A


    Original     		Sn63Pb37 Alloy172, 254mm/0 203mm SF-BGA81A-B-42 PDF

    84516-102LF

    Abstract: 84500-102LF 84520-102 74390 74217 84501-201 84512-202 GR-1217-CORE 55755-001LF 84512-102LF
    Text: BOARD TO BOARD CONNECTORS MEG-ARRAY CONNECTOR SYSTEM DESCRIPTION The MEG-Array® connector is designed to meet the needs of 10Gb/s applications requiring up to 528 signal pins per connector. The combination of multiple stack heights 4mm to 14mm and multiple sizes (81 signals to 528 signals)


    Original     		10Gb/s as01LF 84535-101LF 84535-201LF 74217-001LF 74217-101LF 74217-201LF 55755-001LF 55755-101LF 55755-201LF 84516-102LF 84500-102LF 84520-102 74390 74217 84501-201 84512-202 GR-1217-CORE 55755-001LF 84512-102LF PDF

    Untitled

    Abstract: No abstract text available
    Text: BOARD TO BOARD CONNECTORS MEG-ARRAY MEZZANINE CONNECTOR SYSTEM HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY DESCRIPTION The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by the


    Original     		55715-001LF 55715-101LF 55715-201LF 84513-001LF 84513-101LF 84513-201LF 84517-001LF 84517-101LF 84517-201LF 55724-001LF PDF

    Lead Free reflow soldering profile BGA

    Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
    Text: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array


    Original     		EB635 Lead Free reflow soldering profile BGA Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181 PDF

    PACKAGE DIMENSIONS

    Abstract: No abstract text available
    Text: Package Diagrams Index of Package Diagrams 100-Ball caBGA Package . 12 120-Pin PQFP Package . 12 128-Pin PQFP Package . 13 128-Pin TQFP Package . 13


    Original     		20-Pin 20-Pin 300-Mil) 24-Pin 24-Pin 28-Pin PACKAGE DIMENSIONS PDF

    Untitled

    Abstract: No abstract text available
    Text: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and


    Original     		PDF

    CABGA 6x6

    Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
    Text: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is


    Original     		GA98111PDF2/99 CABGA 6x6 CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56 PDF

    uaa 3100

    Abstract: uaa 4003 s0315 v 3700 bga
    Text: ADVANCED BGA Footprints A rranged by Pitch and Ball Count . INTERCONNECTIONS. See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com


    OCR Scan     		PDF