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    BGA 8X8 100 Search Results

    BGA 8X8 100 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 8X8 100 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-054-04-005428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 054-04-005 8X8 #


    Original     		PDF C17200) 64-56A 64-22A/31A 65-17A

    BGA 8x8 100

    Abstract: No abstract text available
    Text: Product Number: 599-11-063-04-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 063-04-001 8X8


    Original     		PDF C17200) 64-56A 64-22A/31A 65-17A BGA 8x8 100

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-064-04-000428 Description: BGA Socket 1mm BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 064-04-000 8X8 # Of Pins


    Original     		PDF C17200) 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-064-04-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 064-04-000 8X8 # Of Pins Mill-Max Part Number 64 599-10-064-04-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


    Original     		PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-054-04-005429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 054-04-005 8X8 # Of Pins Mill-Max Part Number 1 599-10-054-04-005429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


    Original     		PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    HLQFP 176 Package

    Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
    Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)


    Original     		PDF 13x36 13x45 14x37 17x56 17x57 O-92L OT-25 10x10 15x15 HLQFP 176 Package FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    pogo pins

    Abstract: IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901
    Text: IC274 Series Test Contactor SMT Pogo Pins (LGA, BGA, CSP - 0.50 to 1.50mm Pitch) Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max.


    Original     		PDF IC274 10mA/20mV pogo pins IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901

    56 pin BGA IC Socket

    Abstract: bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310
    Text: IC274 Series Test Contactor SMT - Spring Probe Contact Style Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +100°C


    Original     		PDF IC274 10mA/20mV 56 pin BGA IC Socket bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310

    132-ball

    Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
    Text: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages


    Original     		PDF

    COOLRUNNER-II examples

    Abstract: 245RL CPLD XC2C64 from Xilinx CoolRunner-II family CP132 equivalent 8x8 keyboard and microcontroller interfacing EPM240Z M100 XC2C128 XC2C256 XC2C64
    Text: White Paper Reduce Total System Cost in Portable Applications Using Zero-Power CPLDs Introduction Traditionally, portable system designers have used ASICs and ASSPs to implement memory interfaces, I/O expansion, power-on sequencing, discrete logic functions, display, and other functions in portable systems. Cost


    Original     		PDF

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		PDF E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray

    AN1010

    Abstract: BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BCM8320 BDN14-6CB EXTRUDED ALUMINUM
    Text: Application Note AN1010 Cooling Critical Components Introduction Design engineers are routinely faced with applications that require special thermal management attention. A CTS customer recently solved its thermal concern by selecting a CTS/IERC extruded aluminum “Peel and


    Original     		PDF AN1010 BCM8320 AN1010 BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BDN14-6CB EXTRUDED ALUMINUM

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


    Original     		PDF DS550R

    MX29GL256

    Abstract: 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D
    Text: Spansion NOR Flash Memory Competitive Cross Reference Guide December 2009 Parallel 1.8V Density Voltage Bus Mb (V) VIO (V) Type Bus Sector Width Type # Initial Access Burst Speed Banks Times (ns) (MHz) Packages Temp Range Recommended Pin Software Spansion OPN Compatible Compatible Notes


    Original     		PDF AT49SV163D 48-Pin 48-Ball S29AS016J EN29SL800 S29AS00gest MX29GL256 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D

    bga PCB footprint

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 0,8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		PDF 599-XX-XXX-04-001429 599-XX-XXX-04-001442 bga PCB footprint

    EM8471

    Abstract: SM2288 vga to ypbpr Sigma designs REALMAGIC EM8475 Composite Video to VGA decoder circuit BGA 328 i2s specification IPTV Sigma Designs
    Text: EM8470 EM8471 EM8475 EM8476 MPEG-4 Decoder for Set-top, DVD and Streaming Applications Description Common Features The EM847x family is a single-chip MPEG audio/video decoder that supports DVD-Video, Superbit DVD, SVCD, VCD and audio CD media formats. Video decoding support includes MPEG-1, MPEG-2 MP@ML and MPEG-4


    Original     		PDF EM8470 EM8471 EM8475 EM8476 EM847x 16-bit EM8400 EM8470 EM8471 SM2288 vga to ypbpr Sigma designs REALMAGIC EM8475 Composite Video to VGA decoder circuit BGA 328 i2s specification IPTV Sigma Designs

    SM2288

    Abstract: EM8471 MPEG encoder i2s specification EM8475 SM2210 EM8476 picture-in-picture motion vector dct simple video transmitter fs460
    Text: EM8470 EM8471 EM8475 EM8476 MPEG-4 Decoder for Set-top, DVD and Streaming Applications Description Common Features The EM847x family is a single-chip MPEG audio/video decoder that supports DVD-Video, Superbit DVD, SVCD, VCD and audio CD media formats. Video decoding support includes MPEG-1, MPEG-2 MP@ML and MPEG-4


    Original     		PDF EM8470 EM8471 EM8475 EM8476 EM847x 16-bit EM8400 EM8470 EM8471 SM2288 MPEG encoder i2s specification EM8475 SM2210 EM8476 picture-in-picture motion vector dct simple video transmitter fs460

    GPS chip

    Abstract: GPS oncore ut gps architecture Motorola b4 64-pin BGA motorola MG200 Gps circuit diagram 12-Channel Mixer oncore
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Oncore GPS Chip Mixed Mode RF and Digital Monolithic GPS Sensor MG2000 The Oncore GPS Chip integrated circuit was specifically designed for low power, cost effective host-based GPS applications. Measuring only 8x8 mm, the Oncore GPS Chip monolithic GPS sensor design includes a fully


    Original     		PDF MG2000 12-channel 64-pin GPS chip GPS oncore ut gps architecture Motorola b4 64-pin BGA motorola MG200 Gps circuit diagram 12-Channel Mixer oncore

    h0051

    Abstract: H0020-H0027 H004F h0023 H0013 H0050 h0068 h004A H0011 PDF H004F
    Text: Preliminary Datasheet XE88LC04 Low Power Microcontroller XE88LC04 Ultra low-power MCU with LCD driver General Description Key product Features • The XE88LC04 is an ultra low-power low-voltage microcontroller unit MCU with extremely high efficiency, allowing for 1 MIPS at 300uA and 2.4 V, and


    Original     		PDF XE88LC04 XE88LC04 300uA XX/D0202-135 h0051 H0020-H0027 H004F h0023 H0013 H0050 h0068 h004A H0011 PDF H004F

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		PDF 320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    AD5820

    Abstract: ad6548
    Text: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density


    Original     		PDF T03762-0-1/13 AD5820 ad6548

    8X8 INC

    Abstract: 8x8 vcp LVP 47-10-43 LD8213 8x8 vcp tse 1885 40BS CCIR601 YUV422 8x83404
    Text: 8x8, Inc. 8x83404 LVP DATASHEET 8x8 LVP Lowbitrate Videophone Processor OVERVIEW The 8x8 LVP i a single-chip programmable low bitrate video phone processor. A member of 8x8's MPA Multimedia Processor Architecture family, it forms the heart of either a PC-based or stand-alone


    OCR Scan     		PDF 8x83404 8X8 INC 8x8 vcp LVP 47-10-43 LD8213 8x8 vcp tse 1885 40BS CCIR601 YUV422