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    BGA HEATSINK COMPRESSIVE FORCE Search Results

    BGA HEATSINK COMPRESSIVE FORCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    U77E11D82001 Amphenol Communications Solutions 1X1 SPF CAGE W/ HEATSINK Visit Amphenol Communications Solutions
    U77E11E82001 Amphenol Communications Solutions 1X1 SPF CAGE W/ HEATSINK Visit Amphenol Communications Solutions
    U77E11F82001 Amphenol Communications Solutions 1X1 SPF CAGE W/ HEATSINK Visit Amphenol Communications Solutions
    10151209-001TRLF Amphenol Communications Solutions 22 Positions, Compression Connector,surface Mount,vapour phase soldering Visit Amphenol Communications Solutions
    10152744-001LF Amphenol Communications Solutions 18 Positions, Compression Connector,surface Mount,vapour phase soldering Visit Amphenol Communications Solutions

    BGA HEATSINK COMPRESSIVE FORCE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BGA heatsink compressive force

    Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga
    Text: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers*, Mukta Farooq*, Lewis Goldmann*, Amir Salehi* *IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 *Apple Computer, 1 Infinite Loop, Cupertino, CA 95014


    Original     		64-bit BGA heatsink compressive force BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga PDF

    IXP2400

    Abstract: BGA heatsink compressive force BGA Solder Ball compressive force diode B1205 FCBGA STRAIN GAUGE rosette strain gauge fcBGA PACKAGE thermal resistance INTEL fcBGA PACKAGE thermal resistance thermal test vehicle -intel
    Text: Intel IXP2400 Network Processor Electrical, Mechanical, and Thermal Specification EMTS Application Note March 2003 Document Number: 301146-001 IXP2400 Network Processor EMTS INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		IXP2400 BGA heatsink compressive force BGA Solder Ball compressive force diode B1205 FCBGA STRAIN GAUGE rosette strain gauge fcBGA PACKAGE thermal resistance INTEL fcBGA PACKAGE thermal resistance thermal test vehicle -intel PDF

    B1969

    Abstract: IXP2800 IXP2850 STRAIN GAUGE IXP2400 BGA heatsink compressive force B1975 IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification IXP28
    Text: Intel IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification EMTS Application Note August 2004 Order Number: 278844-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS


    Original     		IXP2800 B1969 IXP2850 STRAIN GAUGE IXP2400 BGA heatsink compressive force B1975 IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification IXP28 PDF

    WS609

    Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
    Text: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is


    Original     		XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152 PDF

    865GV

    Abstract: 865PE 865g Motherboard 865g Motherboard 82865GV GMCH 865P foxconn 865g Intel reflow soldering profile BGA 865PE Intel 865G/865GV/865PE/865P Chipset intel 865gv chipset
    Text: R Intel 865G/865GV/865PE/865P Chipset Thermal Design Guide For the Intel 82865G/82865GV Graphics and Memory Controller Hub GMCH and Intel 82865PE/82865P Memory Controller Hub (MCH) September 2003 Document Number: 252519-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


    Original     		865G/865GV/865PE/865P 82865G/82865GV 82865PE/82865P 865G/865GV/865PE/865P 865GV 865PE 865g Motherboard 865g Motherboard 82865GV GMCH 865P foxconn 865g Intel reflow soldering profile BGA 865PE Intel 865G/865GV/865PE/865P Chipset intel 865gv chipset PDF

    intel packaging handbook 240800

    Abstract: OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36
    Text: Pentium II Processor – Low Power Thermal Design Guide Application Note September 1999 Order Number: 273254-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		NP970482 NP971803 NP971804 intel packaging handbook 240800 OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36 PDF

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets PDF

    BGA heatsink compressive force

    Abstract: E7520 HB96030-DW E7520 Chipset Platform Design Guide 6700PXH TMDG INTEL MOTHERBOARD Chip Level MANUAL pcm45 C19228-001 E7320
    Text: Intel E7520/E7320 Chipset Memory Controller Hub MCH and Intel® 6700PXH 64-Bit PCI Hub Thermal/Mechanical Design Guide for Embedded Applications February 2007 Reference Number: 304387-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELR PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		E7520/E7320 6700PXH 64-Bit BGA heatsink compressive force E7520 HB96030-DW E7520 Chipset Platform Design Guide TMDG INTEL MOTHERBOARD Chip Level MANUAL pcm45 C19228-001 E7320 PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    intel mch 945gc

    Abstract: bga dye pry UL1439 945gc PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet
    Text: Intel Atom Processor 300Δ Series Thermal and Mechanical Design Guidelines — Supporting Nettop Platform for ‘08 September 2008 Document Number: 320530-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRANTIES, EXPRESS OR


    Original     		E20724-001 E40825-001 945GC E37585-001 intel mch 945gc bga dye pry UL1439 PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet PDF

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		AN-657-1 KS-886H Kostat tray PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    honeywell pcm45

    Abstract: PCM45 HB9703E-M3W HB9703E-DW A13494008 HB9703EDW A13494-008 BGA heatsink compressive force PCM45F D82348-004
    Text: Intel 7500 Chipset Thermal/Mechanical Design Guidelines March 2010 Reference Number: 322825-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS


    Original     		PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    750GX

    Abstract: IBM25PPC750GX powerpc 750l compatible 292-CBGA IBM powerPC schematics 750FX BGA heatsink compressive force BGA Solder Ball compressive force LOCTITE 274 IBM25PPC750G
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: SA14-2765-02 September 2, 2005 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2005 All Rights Reserved Printed in the United States of America August 2005.


    Original     		750GX SA14-2765-02 IBM25PPC750GX powerpc 750l compatible 292-CBGA IBM powerPC schematics 750FX BGA heatsink compressive force BGA Solder Ball compressive force LOCTITE 274 IBM25PPC750G PDF

    IBM25PPC750

    Abstract: IBM25PPC750GX IBM25PPC750G
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: SA14-2765-00 February 17, 2005 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2005 All Rights Reserved Printed in the United States of America February 2005.


    Original     		750GX SA14-2765-00 SA14-2765-00 SA14-2765-00. IBM25PPC750 IBM25PPC750GX IBM25PPC750G PDF

    PPC750GL

    Abstract: PowerPC 750GL IBM25PPC750GL PowerPC 750 IBM25ppc750L PowerPC 750FX
    Text: IBM PowerPC 750GL RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.0 June 1, 2005 Copyright and Disclaimer Copyright International Business Machines Corporation 2005 All Rights Reserved Printed in the United States of America June 2005.


    Original     		750GL PPC750GL PowerPC 750GL IBM25PPC750GL PowerPC 750 IBM25ppc750L PowerPC 750FX PDF

    PowerPC 750GL

    Abstract: IBM25PPC750GL PPC750GL IBM25PPC750 750GL powerpc 750l compatible IBM25PPC750GLECR IBM25PPC750G PowerPC-750GL LOCTITE 274
    Text: IBM PowerPC 750GL RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.2 Preliminary March 13, 2006 Copyright and Disclaimer Copyright International Business Machines Corporation 2005, 2006 All Rights Reserved Printed in the United States of America March 2006.


    Original     		750GL is750GL PowerPC 750GL IBM25PPC750GL PPC750GL IBM25PPC750 powerpc 750l compatible IBM25PPC750GLECR IBM25PPC750G PowerPC-750GL LOCTITE 274 PDF

    BGA heatsink compressive force

    Abstract: No abstract text available
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.0 Preliminary March 29, 2004 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2004 All Rights Reserved Printed in the United States of America March 2004.


    Original     		750GX BGA heatsink compressive force PDF

    socket lga 1156 pinout

    Abstract: intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155
    Text: Intel Core i5-600, i3-500 Desktop Processor Series, Intel® Pentium® Desktop Processor 6000 Series and LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines January 2011 Document Number:322912-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,


    Original     		i5-600, i3-500 LGA1156 E58389 socket lga 1156 pinout intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155 PDF

    PowerPC 750gx

    Abstract: IBM25PPC750GX IBM25PPC750GXE W12 FERRITE 750GX
    Text: IBM PowerPC 750GX RISC Microprocessor Revision Level DD1.X Datasheet Version: 1.1 Preliminary December 27, 2004 Copyright and Disclaimer Copyright International Business Machines Corporation 2003, 2004 All Rights Reserved Printed in the United States of America March 2004.


    Original     		750GX PowerPC 750gx IBM25PPC750GX IBM25PPC750GXE W12 FERRITE PDF

    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate PDF

    lga1155 pinout

    Abstract: socket lga 1155 pinout socket lga 1156 pinout lga1155 land profile pattern Intel socket 1156 PIN LAYOUT intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram REFLOW lga socket 1155 LGA 1155 PIN diagram REFLOW profile lga socket 1155
    Text: Desktop 3rd Generation Intel Core Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines TMSDG January 2013 Document Number: 326767-005


    Original     		LGA1155 UL1439 lga1155 pinout socket lga 1155 pinout socket lga 1156 pinout lga1155 land profile pattern Intel socket 1156 PIN LAYOUT intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram REFLOW lga socket 1155 LGA 1155 PIN diagram REFLOW profile lga socket 1155 PDF