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    BGA PACKAGE 14X14 Search Results

    BGA PACKAGE 14X14 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE 14X14 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    BGA PACKAGE OUTLINE

    Abstract: 14X14 1537M
    Text: connected to H2 15.37mm [0.605"] 1.18mm [0.047"] BGA package outline 3.48mm [0.137"] A1 16.48mm [0.649"] Top View 1 1.00mm 1.59mm [0.063"] Bottom View 2.09mm [0.082"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


    Original     		FR4/G10 14X14 FX-BGA160C/BGA160C-01 FX-BGA160C/160C-01 BGA PACKAGE OUTLINE 1537M PDF

    1mm pitch BGA 14X14

    Abstract: 14X14 SF-BGA156A-B-11 BGA Solder Ball 1mm BGA Package 14x14 pitch 0.4mm BGA
    Text: C Package Code: BGA156A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.53mm [0.021"] 2 0.53mm [0.021"]


    Original     		BGA156A FR4/G10 14X14 SF-BGA156A-B-11 1mm pitch BGA 14X14 14X14 BGA Solder Ball 1mm BGA Package 14x14 pitch 0.4mm BGA PDF

    14X14

    Abstract: SF-BGA196D-B-11 pitch 0.4mm BGA
    Text: C Package Code: BGA196D D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.50mm [0.531"] 0.50mm [0.020"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"]


    Original     		BGA196D FR4/G10 14X14 SF-BGA196D-B-11 14X14 pitch 0.4mm BGA PDF

    bga 196 land pattern

    Abstract: 0.4mm pitch BGA BGA Package 14x14 1mm pitch BGA 14X14 1mm pitch BGA SF-BGA196C-B-11 14X14 pitch 0.4mm BGA BGA Solder Ball 1mm
    Text: C Package Code: BGA196C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 1.00mm pitch typ. 0.53mm [0.021"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]


    Original     		BGA196C FR4/G10 14X14 SF-BGA196C-B-11 bga 196 land pattern 0.4mm pitch BGA BGA Package 14x14 1mm pitch BGA 14X14 1mm pitch BGA 14X14 pitch 0.4mm BGA BGA Solder Ball 1mm PDF

    pitch 0.4mm BGA

    Abstract: 14X14 SF-BGA160C-B-11 0.4mm pitch BGA
    Text: C Package Code: BGA160C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.00mm [0.512"] X Top View (reference only) 1.00mm pitch typ. 0.53mm [0.021"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.53mm [0.021"]


    Original     		BGA160C FR4/G10 14X14 Allo24 SF-BGA160C-B-11 pitch 0.4mm BGA 14X14 0.4mm pitch BGA PDF

    BGA-160

    Abstract: 0.4mm pitch BGA 14X14 SF-BGA160D-B-11 BGA Package 14x14 pitch 0.4mm BGA 160 BGA Package 14x14
    Text: C Package Code: BGA160D D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.53mm [0.021"] 0.508 mm [0.020"]


    Original     		BGA160D FR4/G10 14X14 SF-BGA160D-B-11 BGA-160 0.4mm pitch BGA 14X14 BGA Package 14x14 pitch 0.4mm BGA 160 BGA Package 14x14 PDF

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256 PDF

    STMicroelectronics smd marking code

    Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/04/744 LEAD-FREE CONVERSION PROGRAM Compliance with RoHS 1 1 RoHS = Restriction of the use of certain Hazardous Substances European directive 2002/95/EC November 18, 2004 Page 1/12 2004 STMicroelectronics - All Rights Reserved


    Original     		CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking PDF

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets PDF

    STMicroelectronics smd marking code

    Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product


    Original     		MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    X-RAY INSPECTION

    Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as


    Original     		AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance PDF

    samsung ddr3 ram MTBF

    Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
    Text: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


    Original     		BR-12-ALL-001 samsung ddr3 ram MTBF KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd PDF

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow PDF

    7303b

    Abstract: LGA 1150 ED-7300 ED-7303B
    Text: JEITA package codes are uniformly given to our IC packages according to the JEITA standard “EIAJ ED-7303B”. The construction of JEITA package code is explained below. JEITA Package Code excerpt from the JEITA standard “EIAJ ED-7303B” 1. Construction of package code


    Original     		ED-7303B. ED-7303B) ISO-R370) -SOP28 -QFP80 7303b LGA 1150 ED-7300 ED-7303B PDF

    SG-BGA-6048

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 20.225mm Ball guide prevents over compression of elastomer


    Original     		225mm 5M-1994. 14x14 SG-BGA-6048 PDF

    SG-BGA-6086

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 20.225mm Ball guide prevents over compression of elastomer


    Original     		225mm 5M-1994. SG-BGA-6086 PDF

    SG-BGA-6133

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 20.225mm Ball guide prevents over compression of elastomer


    Original     		225mm 5M-1994. SG-BGA-6133 PDF

    6029

    Abstract: SG-BGA-6029 BGA Package 14x14
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 18.225mm Ball guide prevents over compression of elastomer


    Original     		225mm SG-BGA-6029 6029 BGA Package 14x14 PDF

    841S101

    Abstract: No abstract text available
    Text: Comprehensive Portfolio from the Leader in PCI Express Solutions Integrated DeviceTechnology | | POWER MANAGEMENT ANALOG & RF INTERFACE & CONNECTIVITY | CLOCKS & TIMING | MEMORY & LOGIC | TOUCH & USER INTERFACE | VIDEO & DISPLAY | AUDIO PCI Express Timing Solutions


    Original     		100MHz REVB0111 841S101 PDF

    SG-BGA-7027

    Abstract: 14X14 DP-110
    Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 13.125mm Easily removable socket lid


    Original     		125mm DP110 SG-BGA-7027 14X14 DP-110 PDF

    SOP48

    Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
    Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7


    OCR Scan     		QFP12 QFP13 QFP15 QFP14 12X12X1 14X20X2 14X14X1 SOP48 CF RM sot89 SOP38 14X14X2 epson QFP 216 45x45 mm bga 14x14x2.7 PDF