JEDEC tray standard
Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
Text: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)
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BGA45
1849-pin
1752-pin
BGA45
SSD-A-H7053-1
JEDEC tray standard
JEDEC TRAY DIMENSIONS
SSD-A-H7053-1
45374
H705
BGA4545
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tray datasheet bga
Abstract: tray bga
Text: 180°C MAX NX BG1422 2.0 0712 8 REV.A A' 18.40 12.75 A 14.2 110.4 135.9 UNIT : mm 22.2 24.40 268.4 23.30 315.0 322.6 SECTION A – A' 5.52 (6.35) 7.62 22.2 Applied Package Quantity (pcs) 119-pin Plastic BGA (14x22) MAX. 84 Tray Material NX BG1422 2.0 Carbon PES
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BG1422
119-pin
tray datasheet bga
tray bga
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1152 BGA tray
Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
Text: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.
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FBGA14
117-pin
FBGA14
SSD-A-H7531
1152 BGA tray
tray datasheet bga
jedec bga tray
tray bga
JEDEC tray standard
JEDEC TRAY DIMENSIONS
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BGA 14 TRAY
Abstract: JEDEC TRAY DIMENSIONS jedec bga tray BGA package tray tray bga JEDEC tray standard
Text: TRAY CONTAINER 24.40 23.30 14.35 135°C MAX A' 12.75 A BGA14x22A-1 18.40 NEC 135.9 110.4 PPE 7×12=84 UNIT : mm 22.30 268.4 315.0 322.6 SECTION A – A' 6.12 (6.35) 7.62 22.30 Applied Package Quantity (pcs) 119-pin Plastic BGA (14×22) MAX. 84 BGA14×22A-1
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BGA14
119-pin
SSD-A-H6789-1
BGA 14 TRAY
JEDEC TRAY DIMENSIONS
jedec bga tray
BGA package tray
tray bga
JEDEC tray standard
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tray datasheet bga
Abstract: No abstract text available
Text: UNIT : mm A' 29.26 180°C MAX TBGA 29 x 29 × 1.7mm 31.40 20.85 29.26 31.60 31.10 252.8 315.0 322.6 SECTION A – A' 29.26 5.82 7.62 6.35 135.9 94.2 A Applied Package 272-pin • Plastic BGA ( Quantity (pcs) 29) MAX. 36 Tray Material Heat Proof Temp. Surface resistance
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272-pin
tray datasheet bga
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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mask rom
Abstract: No abstract text available
Text: DDR Code Information 1/2 Last Updated : November 2008 K7DXXXXXXX - XXXXXXX 1 2 3 4 5 1. Memory (K) 6 7 8 9 10 11 12 13 14 15 16 17 18 13. Temp, Power - COMMON (Temp, Power) 2. Sync(DDR) SRAM : 7 C : Commercial, Normal I : Industrial, Normal 3. Small Classification
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333MHz
350MHz
375MHz
400MHz
mask rom
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mask rom
Abstract: No abstract text available
Text: Late Write Code Information 1/2 Last Updated : November 2008 K7PXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory (K) 13. Temp, Power - COMMON (Temp, Power) 2. Sync(Late Write) SRAM : 7 C : Commercial, Normal I : Industrial, Normal
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250MHz
300MHz
mask rom
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tray datasheet bga
Abstract: 4925 B JEP95
Text: BGA Package 35-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1879 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW
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35-Lead
5M-1994
MS-028
JEP95
tray datasheet bga
4925 B
JEP95
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JEP95
Abstract: tray datasheet bga MS-028
Text: BGA Package 45-Lead 11.25mm x 9.00mm × 4.92mm (Reference LTC DWG# 05-08-1869 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 7 PACKAGE TOP VIEW
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45-Lead
5M-1994
MS-028
JEP95
JEP95
tray datasheet bga
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4925 B
Abstract: tray datasheet bga JEP95 4925 B transistor OB35
Text: BGA Package 35-Lead 11.25mm x 6.25mm × 3.42mm (Reference LTC DWG# 05-08-1878 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW
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35-Lead
5M-1994
MS-028
JEP95
4925 B
tray datasheet bga
JEP95
4925 B transistor
OB35
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4925 B
Abstract: MS-028 BGA package tray 40 x 40 JEP95 tray datasheet bga JEP95 MS-028
Text: BGA Package 40-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1867 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW
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40-Lead
5M-1994
MS-028
JEP95
4925 B
BGA package tray 40 x 40
JEP95
tray datasheet bga
JEP95 MS-028
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tray datasheet bga
Abstract: JEP95
Text: BGA Package 32-Lead 15mm x 11.25mm × 3.42mm (Reference LTC DWG # 05-08-1851 Rev B) A DETAIL A Z 8 A2 aaa Z 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.27 – 0.37 // bbb Z 2.45 – 2.55 H DETAIL B J K
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32-Lead
5M-1994
MS-028
JEP95
tray datasheet bga
JEP95
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JEP95
Abstract: tray datasheet bga BGA-32
Text: BGA Package 32-Lead 15mm x 11.25mm × 4.98mm (Reference LTC DWG # 05-08-1860 Rev A) A DETAIL A Z 8 A2 aaa Z 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.33 – 0.43 // bbb Z 3.95 – 4.05 H DETAIL B J K
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32-Lead
5M-1994
MS-028
JEP95
JEP95
tray datasheet bga
BGA-32
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JEP95
Abstract: BGA144 tray datasheet bga JEP95 MS-028 bga tray
Text: BGA Package 144-Lead 15mm x 15mm × 4.92mm (Reference LTC DWG # 05-08-1880 Rev Ø) DETAIL A Z A M A2 aaa Z L K J H G F E D C B PIN 1 A 1 PIN “A1” CORNER 2 b A1 4 ccc Z 3 4 5 b1 MOLD CAP 6 F D SUBSTRATE 7 0.27 – 0.37 8 // bbb Z 3.95 – 4.05 9 DETAIL B
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144-Lead
5M-1994
MS-028
JEP95
JEP95
BGA144
tray datasheet bga
JEP95 MS-028
bga tray
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JEP95
Abstract: No abstract text available
Text: BGA Package 133-Lead 15mm x 15mm × 3.42mm (Reference LTC DWG # 05-08-1877 Rev Ø) DETAIL A Z A 12 A2 aaa Z 11 10 9 8 7 6 5 4 3 2 PIN 1 1 A PIN “A1” CORNER B b A1 4 ccc Z C D E b1 MOLD CAP F F D SUBSTRATE G 0.27 – 0.37 H // bbb Z 2.45 – 2.55 J DETAIL B
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133-Lead
5M-1994
MS-028
JEP95
JEP95
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JEP95
Abstract: JEP95 MS-028 BGA 8 x 8 tray
Text: BGA Package 221-Lead 15mm x 11.25mm × 2.82mm (Reference LTC DWG# 05-08-1886 Rev Ø) Z A aaa Z E Y A2 X DETAIL A SEE NOTES 13 12 11 10 9 8 7 6 5 4 3 2 1 PIN 1 3 A A1 PIN “A1” CORNER B ccc Z C 4 D b E b1 MOLD CAP F SUBSTRATE // bbb Z H J F Z H2 D G H1
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221-Lead
MS-028
JEP95
JEP95
JEP95 MS-028
BGA 8 x 8 tray
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JEP95
Abstract: No abstract text available
Text: BGA Package 71-Lead 15mm x 9.00mm × 3.42mm (Reference LTC DWG# 05-08-1885 Rev Ø) A aaa Z E Y Z DETAIL A A2 X SEE NOTES 7 6 5 4 3 2 1 PIN 1 3 A A1 PIN “A1” CORNER B ccc Z 4 C D b b1 MOLD CAP E SUBSTRATE D G Z // bbb Z F F H1 H2 H DETAIL B J e Øb (71 PLACES)
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71-Lead
5M-1994
MS-028
JEP95
JEP95
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JEP95
Abstract: No abstract text available
Text: BGA Package 140-Lead 11.25mm x 9.00mm × 2.72mm aaa Z (Reference LTC DWG # 05-08-1849 Rev A) A Y E E1 Z aaa Z DETAIL A e A2 b PIN 1 A B PIN “A1” CORNER C A1 4 b ccc Z D E F b1 MOLD CAP D G D1 H SUBSTRATE J 0.27 – 0.37 // bbb Z 1.95 – 2.05 K L DETAIL B
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140-Lead
5M-1994
JEP95
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JEP95
Abstract: MS-028
Text: BGA Package 44-Lead 15mm x 15mm × 5.02mm (Reference LTC DWG # 05-08-1881 Rev Ø) A DETAIL A Z 11 A2 aaa Z 10 9 8 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.37 – 0.47 // bbb Z 3.95 – 4.05 H DETAIL B
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44-Lead
5M-1994
MS-028
JEP95
JEP95
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NEC A39A
Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES
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C10943XJ6V0IF00
IEI-635,
IEI-1213)
ED-7411
NEC A39A
NEC A39A 240
SOP28 330 mil land pattern
NEC A39A 8 PIN
mjh 106
120-PIN 282 185 01
smd TRANSISTOR code b6
ED-7500
transistor a39a
SIP 400B
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S146
Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,
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15mmH
misali6-2-2557-7351
S146
S514
S144
200POS
IT3D-200S-BGA37
IT3D-100S-BGA
BGA reflow guide
S142
PEAK TRAY bga
hirose it3
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