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    BGA PACKAGE WEIGHT Search Results

    BGA PACKAGE WEIGHT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE WEIGHT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PCN0214

    Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
    Text: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:


    Original     		PCN0214 packagesK1500E 1020-Ball EP20K600E 672-Ball EP20K400 EP20K400E PCN0214 Altera bga BGA PACKAGE OUTLINE EP1M120 EP20K1000E EPXA10 amkor flip alsic PDF

    IPC-D-317A

    Abstract: SN74V293 capacitance in BGA package SDMA002 IPC-D-317
    Text: Application Report SDMA002 - June 2001 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for


    Original     		SDMA002 SN74V293 IPC-D-317A capacitance in BGA package IPC-D-317 PDF

    "0.4mm" bga "ball collapse" height

    Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
    Text: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller


    Original     		TMS320 TMS320C6x TMS320C6201 AN1231. "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 PDF

    GE863-GPS

    Abstract: No abstract text available
    Text: wireless solutions wireless solutions GE 863-GPS Embedded SiRF Powered The new GE863-GPS is the smallest combined GPRS/GPS module on the market! BGA Package The unique Ball-Grid-Array BGA package enables a very low profile and small product size to design extremely compact applications using location technology.


    Original     		863-GPS GE863-GPS 20-channel I-34010 PDF

    BGA-320P-M06

    Abstract: No abstract text available
    Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max


    Original     		BGA-320P-M06 320-pin BGA-320P-M06) BGA320006S-c-2-1 BGA-320P-M06 PDF

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000 PDF

    Untitled

    Abstract: No abstract text available
    Text: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).


    Original     		TMS320C6472 SPRS612G TMS320C6472 500-MHz 625-MHz 737-Pin PDF

    MCP 256M nand toshiba

    Abstract: TY80009000AMGF toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9
    Text: TY80009000AMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY80009000AMGF is a mixed multi-chip package containing a 268,435,456-bit Low Power Synchronous DRAM and a 553,648,128-bit Nand E2PROM. The TY80009000AMGF is available in a 149-pin BGA package


    Original     		TY80009000AMGF TY80009000AMGF 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-39/39 MCP 256M nand toshiba toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9 PDF

    TPA2000D1PW

    Abstract: TPA2000D1PWR 2512067007Y3 GRM235-Y5V106Z16 SCD0703T TPA2000D1 TPA2000D1GQCR
    Text: TPA2000D1 2-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS328E – JUNE 2000 – REVISED MAY 2003 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options


    Original     		TPA2000D1 SLOS328E TPA2000D1PW TPA2000D1PWR 2512067007Y3 GRM235-Y5V106Z16 SCD0703T TPA2000D1 TPA2000D1GQCR PDF

    SLLA229

    Abstract: No abstract text available
    Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package


    Original     		PCI1510 SLLA229 144-terminal 209-terminal 16-bit TPS2211A SLLA229 PDF

    Untitled

    Abstract: No abstract text available
    Text: TPA2000D1 2-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS328D – JUNE 2000 – REVISED NOVEMBER 2002 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options


    Original     		TPA2000D1 SLOS328D PDF

    TPA2001D1

    Abstract: TPA2001D1PW TPA2001D1PWR GRM235-Y5V106Z16 TPA005Dxx
    Text: TPA2001D1 1-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS338B – SEPTEMBER 2000 – REVISED AUGUST 2002 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options


    Original     		TPA2001D1 SLOS338B TPA2001D1 TPA2001D1PW TPA2001D1PWR GRM235-Y5V106Z16 TPA005Dxx PDF

    144-TERMINAL

    Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
    Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package


    Original     		PCI1510 SLLA229 144-terminal 209-terminal 16-bit TPS2211A 82365SL PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU PDF

    Untitled

    Abstract: No abstract text available
    Text: 2 x 2.5 mm MOSFET BGA Package Dimensions 2 x 2.5 mm FS PKG Code Z1 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: millimeters Part Weight per unit (gram): 0.019 ã 1998 Fairchild Semiconductor Corporation 2002 Fairchild Semiconductor Corporation


    Original     		PDF

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS82582QT06/11/20/38E-500/450/400/375 288Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


    Original     		GS82582QT06/11/20/38E-500/450/400/375 165-Bump 165-bump, GS82582QTxxE-375T. 82582QT2038 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS82582Q06/11/20/38E-500/450/400/375 288Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


    Original     		GS82582Q06/11/20/38E-500/450/400/375 165-Bump 165-bump, GS82582QxxE-375T. 82582Q2038 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342TT06/11/20/38BD-550/500/450/400/350 36Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 Clock Latency • Simultaneous Read and Write SigmaDDRTM Interface • JEDEC-standard pinout and package


    Original     		GS8342TT06/11/20/38BD-550/500/450/400/350 165-Bump 165-bump, 165GA GS8342TT38BD-400T. PDF

    st LD33

    Abstract: ld33 st LD33 LD33 data sheet LD33 V ld33 linear st st ld50 Architecture of TMS320C4X FLOATING POINT PROCESSED CLC146 ld33 ST ELECTRONIC
    Text: NM6403 Digital Signal Processor 431282.001D3 Features General Description 40 MIPS, 25 ns Instruction Rate. CMOS 0,5µm Technology. 256-pin BGA Package. Low Voltage Supply, 3.0V to 3.6V. Memory Address Space - 16 Gbytes. Scalar and Vector Data Format: 32-bit Scalar Data,


    Original     		NM6403 001D3 256-pin 32-bit 64-bit 64-bits NM6403 st LD33 ld33 st LD33 LD33 data sheet LD33 V ld33 linear st st ld50 Architecture of TMS320C4X FLOATING POINT PROCESSED CLC146 ld33 ST ELECTRONIC PDF

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB PDF

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342T06/11/20/38BD-550/500/450/400/350 36Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 Clock Latency • Simultaneous Read and Write SigmaDDRTM Interface • JEDEC-standard pinout and package


    Original     		GS8342T06/11/20/38BD-550/500/450/400/350 165-Bump 165-bump, GS8342T38BD-400T. PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342T06/11/20/38BD-550/500/450/400/350 36Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 Clock Latency • Simultaneous Read and Write SigmaDDRTM Interface • JEDEC-standard pinout and package


    Original     		GS8342T06/11/20/38BD-550/500/450/400/350 165-Bump 165-bump, GS8342T38BD-400T. PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342QT07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


    Original     		GS8342QT07/10/19/37BD-357/333/300/250/200 165-Bump 165-bump, GS8342QTxxBD-300T. PDF