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    BGA PIN 676 Search Results

    BGA PIN 676 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    BGA PIN 676 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AH35

    Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
    Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


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    PDF EP20K1000C 652-Pin 672-Pin 020-Pin AH35 AA10 AM11 AN10 AN11 817 g24 b34 844 AB30 af31

    AA10

    Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
    Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


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    PDF EP20K600C 652-Pin 672-Pin 020-Pin AA10 AE10 AF10 AG10 AJ10 AK10 AF31

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


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    PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 587-10-676-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-005 26 X 26 # Of Pins Mill-Max Part Number 676 587-10-676-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737


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    PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-676-13-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-001 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


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    PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    AG10

    Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
    Text: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7


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    PDF 020-Pin 672-Pin TRACEPKT10 TRACEPKT11 AG10 AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528

    B8530

    Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
    Text: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7


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    PDF 020-Pin 672-Pin TRACEPKT10 TRACEPKT11 B8530 OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640

    fg676

    Abstract: 676-Pin bga pin 676
    Text: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)


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    PDF FG676 676-PIN FG676) fg676 bga pin 676

    676 BGA package tray

    Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)


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    PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 385-pin 400-pin 676 BGA package tray tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27

    F33 1067

    Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
    Text: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6


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    PDF EP20K1500C 652-Pin 020-Pin F33 1067 1010 817 f15 AA10 AM11 AN10 837 B34 AM3 940

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


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    PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    2M253

    Abstract: EPXA10F1020 af176 AA10 AC10 AD10 AE10 AF10 AG10 E7916
    Text: EPXA10F1020 I/O Pins ver. 1.31 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 1,020-Pin FineLine BGA 13 1 VCCINT VCCINT 13 2 GNDINT GND 13 3 VCCINT VCCINT 13 4 GNDINT GND 13 5 VCCINT VCCINT 13 6 GNDINT GND 13 7 VCCINT VCCINT 13 8 GNDINT GND 9 9 I/O


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    PDF EPXA10F1020 020-Pin 2M253 af176 AA10 AC10 AD10 AE10 AF10 AG10 E7916

    OT239

    Abstract: AF2310 EPXA10F1020 AA10 AC10 AD10
    Text: EPXA10F1020 I/O Pins ver. 1.4 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 1,020-Pin FineLine BGA 1 VCCINT VCCINT 2 GNDINT GND 3 VCCINT VCCINT 4 GNDINT GND 5 VCCINT VCCINT 6 GNDINT GND 7 VCCINT VCCINT 8 GNDINT GND 13 9 I/O E6 13 10 I/O A8 11 VCCINT


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    PDF EPXA10F1020 020-Pin VCCIO13 OT239 AF2310 AA10 AC10 AD10

    676 BGA package tray

    Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)


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    PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 676 BGA package tray BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray

    DDR3-1066

    Abstract: DDR3-1333 PC3-10600 A0222 VL53B5263A-K9S-F8S-E7S A6211
    Text: Product Specifications PART NO: VL53B5263A-K9S-F8S-E7S REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC 244 PIN Mini-RDIMM Description: The VL53B5263A is a 512Mx72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered


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    PDF VL53B5263A-K9S-F8S-E7S 512MX72 VL53B5263A 256Mx8 28-bit 244-pin A10/AP A12/BC# DDR3-1066 DDR3-1333 PC3-10600 A0222 VL53B5263A-K9S-F8S-E7S A6211

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO.: VL33B2K66F-K9S REV: 1.0 General Information 16GB 2Gx72 DDR3 SDRAM ULP ECC REGISTERED DIMM 240-PIN Description The VL33B2K66F is a 2Gx72 DDR3 SDRAM high density RDIMM. This four rank memory module consists of eighteen DDP CMOS 1Gx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages, a 28-bit registered


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    PDF VL33B2K66F-K9S 2Gx72 240-PIN VL33B2K66F 28-bit 240-pin

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered


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    PDF VL43B1G63A-K0/K9/F8/E7M 1Gx72 204-PIN VL43B1G63A 512Mx8 28-bit 204-pin

    rda 1846

    Abstract: PC3-10600
    Text: Product Specifications PART NO: REV: 1.0 VL33B1K60A-K9S/F8S/E7S General Information 8GB 1GX72 DDR3 SDRAM ECC 240 PIN RDIMM Description: The VL33B1K60A is a 1Gx72 DDR3 SDRAM high density RDIMM. This memory module consists of thirty-six CMOS 512Mx4 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL


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    PDF VL33B1K60A-K9S/F8S/E7S 1GX72 VL33B1K60A 512Mx4 28-bit 240-pin DQS17 DQS17 rda 1846 PC3-10600

    E1 3005-2

    Abstract: rda 1846
    Text: Product Specifications REV: 1.0 VL33B1K60A-K9S/F8S/E7S PART NO: General Information 8GB 1GX72 DDR3 SDRAM ECC 240 PIN RDIMM Description: The VL33B1K60A is a 1Gx72 DDR3 SDRAM high density RDIMM. This memory module consists of thirty-six CMOS 512Mx4 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL


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    PDF VL33B1K60A-K9S/F8S/E7S 1GX72 VL33B1K60A 512Mx4 28-bit 240-pin E1 3005-2 rda 1846

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered


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    PDF VL43B1G63A-K0/K9/F8/E7M 1Gx72 204-PIN VL43B1G63A 512Mx8 28-bit 204-pin

    DDR3-1066

    Abstract: DDR3-1333 PC3-10600 A6211
    Text: Product Specifications PART NO.: VL53B5269E-K9S/F8S/E7S REV: 1.0 General Information 4GB 512M x 72 DDR3 SDRAM VLP ECC Mini-RDIMM 244-PIN Description The VL53B5269E is a 512M x 72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of nine stacked CMOS 512M x 8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered


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    PDF VL53B5269E-K9S/F8S/E7S 244-PIN VL53B5269E 28-bit 244-pin VN-240909 DDR3-1066 DDR3-1333 PC3-10600 A6211

    Untitled

    Abstract: No abstract text available
    Text: MEMORY MODULE SDRam 32Mx72-BGA 3D SD2G72VB5489 -pjuspj a HEICO company Synchronous Dynamic Ram MODULE 2Gbit SDRam organized as 32Mx72, based on 32Mx16 Pin Assignment Top View BGA 134 - (9x15 - Pitch : 1.27 mm) (TOP VIEW- VIEWED BY TRANSPARENCY) 9 8 7 6 5


    OCR Scan
    PDF 32Mx72-BGA SD2G72VB5489 32Mx72, 32Mx16 512Mbit 32Mx72-bit. 3DFP-0489-REV

    Untitled

    Abstract: No abstract text available
    Text: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FEATURES 324 Pin BGA North Bridge Chip Supports the Pentium C om patible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and


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    PDF SLC90E42 SLC90E42

    9042h

    Abstract: DRB102
    Text: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FE A TU R E S 324 Pin BGA North Bridge Chip Supports the Pentium Compatible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and


    OCR Scan
    PDF SLC90E42 SLC90E42 64Mbit 9042h DRB102