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    BGA SOCKET Search Results

    BGA SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet
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    BGA SOCKET Price and Stock

    Mill-Max Mfg Corp 355 POS BGA SOCKET

    Connector |Mill-Max 355 POS BGA SOCKET
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark 355 POS BGA SOCKET Bulk 25
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    BGA SOCKET Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    reflow temperature rohs bga

    Abstract: 0.65mm pitch BGA
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    BGA 731

    Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    0.65mm pitch BGA

    Abstract: ASTM-B-488 157 BGA socket
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30 PDF

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		26x26 15X15 PDF

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow


    Original     		PDF

    Surface Insulation Resistance FR 4 PCB

    Abstract: No abstract text available
    Text: MAXIMUM solutions MILL-MAX 1mm & .050” GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow


    Original     		VRMS/150 Surface Insulation Resistance FR 4 PCB PDF

    bga PCB footprint

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Aries BGA Adapter Socket FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Socket accepts Aries’ BGA to PGA adapter, Data Sheet No.


    Original     		FR-406. C36000 ASTMB16-00. C17200 ASTM-B194-01 MIL-G-45204 SAE-AMS-QQN-290. PDF

    Untitled

    Abstract: No abstract text available
    Text: Aries BGA to PGA Adapter FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Adapter mates with Aries’ BGA Adapter Socket, Data


    Original     		QQ-B-626. MIL-G-45204 QQ-N-290. PDF

    23009

    Abstract: No abstract text available
    Text: Aries BGA to PGA Adapter FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Adapter mates with Aries’ BGA Adapter Socket, Data


    Original     		QQ-B-626. MIL-G-45204 QQ-N-290. 23009 PDF

    Untitled

    Abstract: No abstract text available
    Text: Aries BGA to PGA Adapter FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Adapter mates with Aries’ BGA Adapter Socket, Data


    Original     		QQ-B-626. MIL-G-45204 QQ-N-290. addit50mm) PDF

    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		CAT16-PREVIEW06 PDF

    MIL-T-10727

    Abstract: No abstract text available
    Text: Aries BGA Adapter Socket FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Socket accepts Aries’ BGA to PGA adapter, Data Sheet No.


    Original     		QQ-B-626. QQ-C-533 MIL-T-10727 MIL-G-45204 QQ-N-290. PDF

    Untitled

    Abstract: No abstract text available
    Text: Aries BGA Adapter Socket FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Socket accepts Aries’ BGA to PGA adapter, Data Sheet No.


    Original     		FR-406. C36000 ASTMB16-00. C17200 ASTM-B194-01 MIL-G-45204 SAE-AMS-QQN-290. 76nge PDF

    Untitled

    Abstract: No abstract text available
    Text: Aries BGA to PGA Adapter FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Adapter mates with Aries’ BGA Adapter Socket, Data


    Original     		FR-406. C36000 ASTM-B16-00. MIL-G-45204 SAE-AMS-QQ-N-290. PDF

    Untitled

    Abstract: No abstract text available
    Text: Aries BGA to PGA Adapter FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Adapter mates with Aries’ BGA Adapter Socket, Data


    Original     		FR-406. C36000 ASTM-B16-00. MIL-G-45204 SAE-AMS-QQ-N-290. PDF

    94vo fr4

    Abstract: 157 BGA socket adapter bga
    Text: ADVANCED Ball Grid Array Socketing System INTERCONNECTIONS ® 5EnergyWay,P . BGAAdapters BGA Ball Grid Array BGA Adapter BGA Adapter Solder


    Original     		Box1019 RI02893USATel Fax401-823-8723 1FGAXXX638X Type-647 Page155 94vo fr4 157 BGA socket adapter bga PDF

    Surface Insulation Resistance FR 4 PCB

    Abstract: alloy 25 BeCu
    Text: MAXIMUM solutions MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s 0.8mm BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are also available to fit 1mm and .050” grid footprints.


    Original     		PDF