reflow temperature rohs bga
Abstract: 0.65mm pitch BGA
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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0.65mm pitch BGA
Abstract: ASTM-B-488 157 BGA socket
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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PCT-GF30
Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount
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bga PCB footprint
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board
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BGA 731
Abstract: bga thermal cycling reliability material for ball grid array packaging
Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board
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Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board
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CAT16-PREVIEW06
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sn63pb37 solder wire
Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen
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Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX166
CuZn36Pb3
C36000)
20x20
514-83-256M20-001148.
CH-2800
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Untitled
Abstract: No abstract text available
Text: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow
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Abstract: No abstract text available
Text: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow
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Abstract: No abstract text available
Text: TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets Table of Models Description: Molded Socket FRG, 1.27mm pitch Material: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Socket Size: 3mm wider and 10mm longer than BGA device.
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Abstract: No abstract text available
Text: TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets Table of Models Description: Molded Socket FRG, 1.27mm pitch Material: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Socket Size: 3mm wider and 10mm longer than BGA device.
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Surface Insulation Resistance FR 4 PCB
Abstract: No abstract text available
Text: MAXIMUM solutions MILL-MAX 1mm & .050” GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow
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VRMS/150
Surface Insulation Resistance FR 4 PCB
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35x35 bga
Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169
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35x35 bga
C17200
C54400
540-88-084-17-400
CuSn4Pb4Zn4
MO-052 footprint
157 BGA socket
51877
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94vo fr4
Abstract: 157 BGA socket adapter bga
Text: ADVANCED Ball Grid Array Socketing System INTERCONNECTIONS ® 5EnergyWay,P . BGAAdapters BGA Ball Grid Array BGA Adapter BGA Adapter Solder
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Box1019
RI02893USATel
Fax401-823-8723
1FGAXXX638X
Type-647
Page155
94vo fr4
157 BGA socket
adapter bga
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Surface Insulation Resistance FR 4 PCB
Abstract: alloy 25 BeCu
Text: MAXIMUM solutions MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s 0.8mm BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are also available to fit 1mm and .050” grid footprints.
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eutectic 157
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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Abstract: No abstract text available
Text: MILL-MAX BGA ADAPTER / SOCKET SYSTEMS Mill-Max adapter and socket systems are gaining in popularity as applications for socketing BGA devices continue to grow. Typically used in ASIC and CPU development, these modules convert a BGA package to a pluggable device, thus allowing
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter
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C36000)
ASTM-B-16
63Sn/37Pb
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EIA-364 65A
Abstract: lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance
Text: 0.5 mm LGA/BGA Sockets DESCRIPTION Tyco Electronics’ polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides electrically transparent signal transfer. APPLICATIONS • • •
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LH-PDF-07/06
EIA-364 65A
lga components
LGA resistance
EIA-364-65A
0.5mm pitch BGA
EIA-364-27
EIA-364-28
EIA-364-31
EIA-364-32
LGA PACKAGE thermal resistance
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Untitled
Abstract: No abstract text available
Text: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.
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