Untitled
Abstract: No abstract text available
Text: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5
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BGA240:
OT711-2
MS-034
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BGA2450
Abstract: BP317 ISM2400
Text: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D302 BGA2450 MMIC power amplifier Objective specification 2000 July 14 Philips Semiconductors Objective specification MMIC power amplifier BGA2450 PINNING FEATURES • Low-voltage operation 3 V PIN • High power-added efficiency (35 %)
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M3D302
BGA2450
OT457)
ISM2400
BGA2450
BP317
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bga244
Abstract: SF-BGA244B-B-11
Text: D Package Code: BGA244B C 22.48mm [0.885"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y X 22.5mm [0.886"] Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]
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BGA244B
FR4/G10
SF-BGA244B-B-11
bga244
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bga244
Abstract: 19X19 SF-BGA244A-B-11
Text: D Package Code: BGA244A .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm 0.025" dia. pad Top View (reference only) 2 0.36mm [0.014"] dia. 0.762mm 5.33mm 3.74mm [0.147"]
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BGA244A
914mm
533mm
762mm
508mm
FR4/G10
SF-BGA244A-B-11
bga244
19X19
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA240 package SOT711-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA240
OT711-1
OT711-1
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SF-BGA248A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA248A C See BGA pattern code to the right for actual pattern layout Y 24.13mm [0.950"] 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA248A
SF-BGA248A-B-11
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5
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BGA240:
OT711-1
MS-034
IC-7315-001
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PDF
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BGA240
Abstract: MS-034 BGA-240 sot711
Text: Package outline Philips Semiconductors BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F E D C B A shape
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BGA240:
OT711-2
MS-034
BGA240
MS-034
BGA-240
sot711
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PDF
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19X19
Abstract: SF-BGA240E-B-11 land pattern BGA 0,50
Text: D Package Code: BGA240E .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm Top View (reference only) 0.025" dia. pad 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA240E
914mm
533mm
762mm
508mm
FR4/G10
SF-BGA240E-B-11
19X19
land pattern BGA 0,50
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PDF
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BGA240
Abstract: IC-7315-001 BGA-240 MS 034 MS-034 sot711
Text: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F
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BGA240:
OT711-1
MS-034
IC-7315-001
BGA240
IC-7315-001
BGA-240
MS 034
MS-034
sot711
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S25FL256
Abstract: S25FL256SA S25FL256SAGMFI00 S25FL256SAG FL256SA fl256saif00 S25FL256S FL128S S25FL256* spansion S25FL256SAGMF
Text: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®
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S25FL128S
S25FL256S
S25FL256S
S25FL256
S25FL256SA
S25FL256SAGMFI00
S25FL256SAG
FL256SA
fl256saif00
FL128S
S25FL256* spansion
S25FL256SAGMF
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SAMSUNG MCP
Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)
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KBB0xB400M
16Mx16)
4Mx16)
80-Ball
80x12
SAMSUNG MCP
ECH information
KBB0xB400M
BA102
ba4901
UtRAM Density
BA5101
samsung NAND memory
BGA180
ba30 transistor
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FL256S
Abstract: SDR-80
Text: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Preliminary)
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S25FL128S
S25FL256S
S25FL256S
FL256S
SDR-80
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PDF
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Untitled
Abstract: No abstract text available
Text: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Advance Information)
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S25FL128S
S25FL256S
S25FL256S
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Untitled
Abstract: No abstract text available
Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised
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K8D6x16UTM
K8D6x16UBM
48TSOP1
16M/16M
08MAX
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PDF
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Untitled
Abstract: No abstract text available
Text: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Preliminary)
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S25FL128S
S25FL256S
S25FL256S
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PDF
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Untitled
Abstract: No abstract text available
Text: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®
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S25FL128S
S25FL256S
S25FL256S
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PDF
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Untitled
Abstract: No abstract text available
Text: S25FL127S 128 Mbit 16 Mbyte MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core Serial Peripheral Interface with Multi-I/O Data Sheet (Preliminary) S25FL127S Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®
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S25FL127S
S25FL127S
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usb video player circuit diagram
Abstract: toshiba laptop schematic diagram OTG243 TDOTG243-000C laptop screen connector pins PC usb ball mouse CIRCUIT diagram ARM720T TDOTG243 OS20 PXA250
Text: Product Brief September 24, 2002 Rev 1.7 OTG243 Three Port, Single Chip USB On-The-Go Host/Function Controller Description TransDimension’s OTG243 is a single chip USB Host and Function controller that is the first of a family of integrated low-cost, high-performance, On-the-Go
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OTG243
OTG243
MU2002,
usb video player circuit diagram
toshiba laptop schematic diagram
TDOTG243-000C
laptop screen connector pins
PC usb ball mouse CIRCUIT diagram
ARM720T
TDOTG243
OS20
PXA250
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Untitled
Abstract: No abstract text available
Text: ARM-based Embedded MPU SAM9N12 SAM9CN11 SAM9CN12 SUMMARY DATASHEET Description Based on the ARM926EJ-S processor, the Atmel SAM9N12/CN11/CN12 devices offer the frequently-requested combination of user interface functionality and high data rate connectivity, with LCD Controller, resistive touch-screen, multiple UARTs, SPI,
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SAM9N12
SAM9CN11
SAM9CN12
ARM926EJ-Sâ
SAM9N12/CN11/CN12
32-Kbyte
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D03316P-103
Abstract: 4.7kohm resistor 88638-61102 DRFC16H st lm385 bcr beckman resistor R36-R38 74C32 Framatome 74c32 datasheet
Text: 0700D _BoM Location Part Descripition QTY U21 IC/SM 74LVC04AD SOIC14 3.3V 1 U4,U26 IC/SM 74LVC08 3.3V TSSOP-14 2 U22 IC/SM 74LVC14 3.3V TSSOP-14 1 U7,U8 IC/SM 74LVTH273 TSSOP-20 3.3V 2 U14,U15 IC/SM 74LVC573 SOIC20 No Bus H 2 U3 IC/SM 74C32 TSSOP-14 1 Q3,Q6,Q7
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0700D
74LVC04AD
SOIC14
74LVC08
TSSOP-14
74LVC14
74LVTH273
TSSOP-20
74LVC573
D03316P-103
4.7kohm resistor
88638-61102
DRFC16H
st lm385
bcr beckman resistor
R36-R38
74C32
Framatome
74c32 datasheet
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PDF
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TAS5412
Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Text: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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SAMSUNG MCP
Abstract: samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5
Text: Preliminary MCP MEMORY K5A3x40YT B B Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History 0.0 Initial Draft Draft Date Remark February 22, 2002 Preliminary
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K5A3x40YT
4Mx8/2Mx16)
512Kx8/256Kx16)
512tRDR
69-Ball
08MAX
SAMSUNG MCP
samsung K5 MCP
BA35
BA4110
ba4410
BA651
Flash Memory SAMSUNG k5
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PDF
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xr20m1172il32-f
Abstract: HVQFN32 Sc2698 SC16C654BIBM,128 SCC2681AC1A44 SC16C752B SCC2691AC1A28 SC28L198
Text: High-speed UARTs and Bridge ICs Advanced serial-interface solutions NXP UART applications Fastest baud rate: 20 Mbps SC16C85xS } General Interface U ART controller is part of the serial data communication of a system. A UART is used to convert parallel data to serial data, and from serial
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SC16C85xS
WLAN/802
SC28L202
xr20m1172il32-f
HVQFN32
Sc2698
SC16C654BIBM,128
SCC2681AC1A44
SC16C752B
SCC2691AC1A28
SC28L198
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