SF-BGA272A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA272A C 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] typ. 0.76mm [0.030"] typ. 24.13mm [0.950"] X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. Ø 0.40mm [Ø 0.0156"] tooling hole X2
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BGA272A
SF-BGA272A-B-11
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MPC555
Abstract: J137 LA-BGA-MPC555-S-B-01 PB-BGA-MPC555-01 C6215
Text: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View LS-BGA272A-01 included PB-BGA-MPC555-01 (included) 16.10mm [0.634"] Plugged 2 1.321mm [0.052"] 5.959mm [0.235"]
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J3-37
J3-38
J1-38
J1-37
LS-BGA272A-01
PB-BGA-MPC555-01
321mm
959mm
C6215
000mm
MPC555
J137
LA-BGA-MPC555-S-B-01
PB-BGA-MPC555-01
C6215
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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