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    SF-BGA400D-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA400D C 30.48mm [1.200"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 30.48mm [1.200"] X 1.27mm typ. [0.050"] Top View reference only 2 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA400D FR4/G10 25X25 SF-BGA400D-B-11

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X