BGA456
Abstract: MS-034 sot795
Text: Package outline Philips Semiconductors BGA456: plastic ball grid array package; 456 balls; body 27 x 27 x 1.75 mm SOT795-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C AF AD AB AE AC AA Y V T P M K H F D B e
|
Original
|
PDF
|
BGA456:
OT795-1
MS-034
BGA456
MS-034
sot795
|
JEDEC tray standard
Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
Text: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)
|
Original
|
PDF
|
BGA45
1849-pin
1752-pin
BGA45
SSD-A-H7053-1
JEDEC tray standard
JEDEC TRAY DIMENSIONS
SSD-A-H7053-1
45374
H705
BGA4545
|
PRBG0456DA-A
Abstract: PBGA456
Text: JEITA Package Code P-BGA456-35x35-1.27 RENESAS Code PRBG0456DA-A B D Previous Code 456F7X-B A D1 MASS[Typ.] 5.0g A ZD b S AB e y S Index mark S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
|
Original
|
PDF
|
P-BGA456-35x35-1
PRBG0456DA-A
456F7X-B
PRBG0456DA-A
PBGA456
|
sot583
Abstract: BGA456 BGA-456
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 2.15 mm SOT583-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA
|
Original
|
PDF
|
BGA456:
OT583-1
sot583
BGA456
BGA-456
|
BGA456
Abstract: sot584
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K
|
Original
|
PDF
|
BGA456:
OT584-1
BGA456
sot584
|
BGA452
Abstract: No abstract text available
Text: Package outline BGA452: plastic ball grid array package; 452 balls SOT1096-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X C e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25
|
Original
|
PDF
|
BGA452:
OT1096-1
sot1096-1
MS-034
BGA452
|
BGA456
Abstract: MS-034 BGA-456
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB Y V T P M K H
|
Original
|
PDF
|
BGA456:
OT584-1
MS-034
BGA456
MS-034
BGA-456
|
BGA452
Abstract: SF-BGA452A-B-11
Text: D Package Code: BGA452A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 31.75mm [1.250"] X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
|
Original
|
PDF
|
BGA452A
FR4/G10
SF-BGA452A-B-11
BGA452
|
Untitled
Abstract: No abstract text available
Text: Package outline BGA456: plastic ball grid array package; 456 balls SOT1153-1 B D J1 A ball A1 index area J2 A2 A E A1 detail X e1 e AB Y V T P M K H F D B 1/2 e ∅v ∅w b AA C C A B C y y1 C e W U R N e2 L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 2 4 6 8 10 12 14 16 18 20 22
|
Original
|
PDF
|
BGA456:
OT1153-1
sot1153-1
MS-034D
|
P-BGA-456
Abstract: PBGA456 PRBG0456DD-A PBGA-456 bga456
Text: JEITA Package Code P-BGA456-35x35-1.27 RENESAS Code PRBG0456DD-A D A D1 B Previous Code 456F7A MASS[Typ.] 4.1g A b ZD S AB e y S Index mark S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
|
Original
|
PDF
|
P-BGA456-35x35-1
PRBG0456DD-A
456F7A
P-BGA-456
PBGA456
PRBG0456DD-A
PBGA-456
bga456
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT584-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
PDF
|
BGA456
OT584-1
OT584-1
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT795-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
PDF
|
BGA456
OT795-1
OT795-1
|
BGA456
Abstract: MS-034 27x27
Text: PDF: 2002 Nov 19 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 27 x 27 x 1.75 mm SOT795-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C AF AD AB AE AC AA Y V
|
Original
|
PDF
|
BGA456:
OT795-1
MS-034
BGA456
MS-034
27x27
|
Lead Free reflow soldering profile BGA
Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Text: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109
|
Original
|
PDF
|
8833he
485mm)
241mm)
Lead Free reflow soldering profile BGA
BGA-3591
Metcal BGA-3591
Metcal CSP 3502
CSP-3500
BGA-3590
BGA-3592
CSP-085-102
ceramic rework
bga rework
|
|
|
2am smd transistor
Abstract: ALP 102 B4 i386ex intel tc55v2325ff application note scr tic 106 TC55V2325FF ATM622 alps ALP 102
Text: ICs for Communications ATM Layer Processor ALP PXB 4350 E Version 1.1 Data Sheet 08.2000 DS 1 3;% 5HYLVLRQ +LVWRU\ &XUUHQW 9HUVLRQ Previous Version: Preliminary Data Sheet 09.98 (DS 2 Page Page Subjects (major changes since last revision)
|
Original
|
PDF
|
87OPIA
2am smd transistor
ALP 102 B4
i386ex intel
tc55v2325ff application note
scr tic 106
TC55V2325FF
ATM622
alps ALP 102
|
ATMEL 24C512
Abstract: TM3260 ATmel 750 24c04 trimedia tm3260 24C512 atmel 24c04 CR 6562 NTSC/PAL to RGB/VGA Encoding atmel 24c256 data sheet DATA SHEET 24C256
Text: PNX15xx Series Data Book Volume 1 of 1 Connected Media Processor Rev. 2 — 1 December 2004 PNX15xx Series Philips Semiconductors Volume 1 of 1 Connected Media Processor Table of Contents Chapter 1: Integrated Circuit Data 1. 2. 2.1 2.2 2.3 2.3.1 2.3.2 3.
|
Original
|
PDF
|
PNX15xx
ATMEL 24C512
TM3260
ATmel 750 24c04
trimedia tm3260
24C512
atmel 24c04
CR 6562
NTSC/PAL to RGB/VGA Encoding
atmel 24c256 data sheet
DATA SHEET 24C256
|
d452a
Abstract: PC28F640P33 sharp 21A U12 circuit diagram HP 30 pin lcd flex cable pinout C117 S4 87A CB-502 sharp CMOS Camera Module CSI 74LVC254 IC SOCKET TSOP48 SMT
Text: phyCORE-i.MX31 HARDWARE MANUAL EDITION JULY 2007 2007 A product of a PHYTEC Technology Holding company phyCOREi.MX31 In this manual are descriptions for copyrighted products that are not explicitly indicated as such. The absence of the trademark and copyright () symbols does not imply
|
Original
|
PDF
|
L-700e
D-55135
d452a
PC28F640P33
sharp 21A U12 circuit diagram
HP 30 pin lcd flex cable pinout
C117
S4 87A
CB-502
sharp CMOS Camera Module CSI
74LVC254
IC SOCKET TSOP48 SMT
|
KB910
Abstract: KB910 B4 edw10 la-2301 IXP150 AOS 3401 RC300ML af7 smd transistor smd transistor MP3 Y8 R833 VL28
Text: 5 4 3 2 1 D D Compal Confidential C C Fortworth20 EDW10 Schematic Document Intel Protability Processor with ATi RC300ML + IXP150 2004-05-26 B B REV: 1.0 A A Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
|
Original
|
PDF
|
Fortworth20
EDW10
RC300ML
IXP150
LA-2301
KB910
KB910 B4
edw10 la-2301
IXP150
AOS 3401
RC300ML
af7 smd transistor
smd transistor MP3 Y8
R833
VL28
|
CP2211
Abstract: VT1634 ac14g mitac 8 W83L950 LM358 K8N800 h55 MOTHERBOARD CIRCUIT diagram ICS952007 cb-1410
Text: SERVICE MANUAL FOR 8889 BY: Star Meng Repair Technology Research Department /EDVD Nov.2004 8889 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4
|
Original
|
PDF
|
Athon64
K8N800
VT8235
ICS950405
W83L950D
CP2211
VT1634
ac14g
mitac 8
W83L950
LM358
h55 MOTHERBOARD CIRCUIT diagram
ICS952007
cb-1410
|
fw82443bx
Abstract: HA20 HD-61
Text: A B C D E 440BX U15A 4 +3V C141 0.1U 0603 C74 0.1U 0603 C112 0.1U 0603 C193 0.1U 0603 GND +3V C145 1000P 0603 G_ST[0.2] 9 GTL_HD#[0.63] 2 GTL_HD#[0.63] C73 1000P 0603 C97 1000P 0603 C194 1000P 0603 GND 3 2 GTL_HA#[3.31] GTL_HD#0 GTL_HD#1 GTL_HD#2 GTL_HD#3
|
Original
|
PDF
|
440BX
BGA456
SD411667700002
fw82443bx
HA20
HD-61
|
BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
|
Original
|
PDF
|
BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
|
udf1
Abstract: h9311 i386ex intel CRC-10 bga456 Q67001-H9311 GR-1248-CORE life cycle of sustainable product
Text: ICs for Communications ATM Layer Processor ALP PXB 4350 Version 1.1 Product Overview 04.97 T4350-XV11-O1-7600 PXB 4350 Revision History: Current Version: 04.97 Previous Version: non Page in previous Version Page (in current Version) Editorial Update Subjects (major changes since last revision)
|
Original
|
PDF
|
T4350-XV11-O1-7600
622MBit/s
udf1
h9311
i386ex intel
CRC-10
bga456
Q67001-H9311
GR-1248-CORE
life cycle of sustainable product
|
PCR 406 J
Abstract: marking w25 SMD transistor pcr 406 TRANSISTOR SMD MARKING CODE W25 SMD TRANSISTOR MARKING P2 PCR 406 J transistor smd marking K23 transistor pcr 405 Motorola transistor smd marking codes marking g23 SMD
Text: Da ta Sh ee t, D S 2, D ec em be r 20 01 A B M P r e mi um A T M B uf f e r M a na ge r P XF 4 33 6 V e r s i on 1 . 1 W ir ed Co m mu n ic a ti o n s N e v e r s t o p t h i n k i n g . Edition 2001-12-17 Published by Infineon Technologies AG, St.-Martin-Strasse 53,
|
Original
|
PDF
|
D-81541
PCR 406 J
marking w25 SMD
transistor pcr 406
TRANSISTOR SMD MARKING CODE W25
SMD TRANSISTOR MARKING P2
PCR 406 J transistor
smd marking K23
transistor pcr 405
Motorola transistor smd marking codes
marking g23 SMD
|
marking w25 SMD
Abstract: TRANSISTOR SMD MARKING CODE W25 smd marking g23 SMD CODE w25 SMD MARKING CODE E1H smd w25 66 2310 dhi TOP 242 PN SMD TRANSISTOR MARKING 9b marking g23 SMD
Text: Da ta Sh ee t, D S 1, D ec em be r 20 01 ABM 3G A T M B uf f e r M a na ge r P XF 4 33 3 V e r s i on 1 . 1 W ir ed Co m mu n ic a ti o n s N e v e r s t o p t h i n k i n g . Edition 2001-12-17 Published by Infineon Technologies AG, St.-Martin-Strasse 53,
|
Original
|
PDF
|
D-81541
marking w25 SMD
TRANSISTOR SMD MARKING CODE W25
smd marking g23
SMD CODE w25
SMD MARKING CODE E1H
smd w25 66
2310 dhi
TOP 242 PN
SMD TRANSISTOR MARKING 9b
marking g23 SMD
|
