MXP400X
Abstract: 7400 family bonder 150-degree
Text: Application Note - MXP400x Wire bond InGaAs/InP PIN Photo Diode Family OPTO-ELECTRONIC PRODUCTS W W W. Microsemi .COM Guideline for wire bond to MXP400x bare die. Recommend Wedge Bond used. Wedge detail informations: * 45 degee wire feed angle. * .0015 in. hole size.
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MXP400x
400-15A-32-34
7400 family
bonder
150-degree
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Untitled
Abstract: No abstract text available
Text: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: February 25, 2008 May 25, 2008 Alert Category: DCS/PCN-1093 Alert Type: Bond Wire Change Discrete Semiconductor PCN #: PCN-1093 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE
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DCS/PCN-1093
PCN-1093
BAV99-7-F
BAV70-7-F
MMBT3904-7-F
MMBT3906-7-F
2N7002-7-F
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Untitled
Abstract: No abstract text available
Text: PRODUCT CHANGE NOTICE DCS/PCN-1105 Contact Date: Implementation Date: Alert Category: Alert Type: March 31, 2008 June 30, 2008 Analog Semiconductors Bond Wire Change PCN #: PCN #: 1105 TITLE ANALOG COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE
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DCS/PCN-1105
PCN-1105
AP1084K18L-U
AP1084K25L
AP1084K50L-U
AP1084K15L
AP1084K15L-13
AP1084K15L-U,
AP1084K18L
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702 sot23
Abstract: 1N4448W13F BAV99-7-05-F sot 23 70.2 MMBT3906R BZT52C6V8 DVRN6056
Text: PRODUCT CHANGE NOTICE DCS/PCN-1116 Contact Date: Implementation Date: Alert Category: Alert Type: September 16, 2008 December 15, 2008 Discrete Semiconductor Bond Wire Change PCN #: PCN #: 1116 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE
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DCS/PCN-1116
MMST3906-7-F
MMST4124-7-F
MMST4126-7-F
MMST4401-7-F
MMTT2222A-7-F
SD107WS-13
SD107WS-7-F
SDA004-7
SDA006-7
702 sot23
1N4448W13F
BAV99-7-05-F
sot 23 70.2
MMBT3906R
BZT52C6V8
DVRN6056
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FMMT593TA
Abstract: No abstract text available
Text: PRODUCT CHANGE NOTICE Initial DCS/PCN-1155 Rev00 Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: December 11, 2009 March 11, 2010 Discrete Semiconductor Bond Wire Change PCN #: 1155 Rev00 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT
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DCS/PCN-1155
Rev00
FMMT38CTA,
FMMT38CTC
FMMT593TA,
FMMT593TC
FZT849TA,
FZT849TC
FZT788BTA,
FMMT593TA
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23/DMP2215L-7
Abstract: No abstract text available
Text: PRODUCT CHANGE NOTICE DCS/PCN-1111 Contact Date: Implementation Date: Alert Category: Alert Type: May 23, 2008 June 21, 2008 Discrete Semiconductor Bond Wire Change PCN #: PCN #: 1111 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE
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DCS/PCN-1111
2N7002A-7,
DMN66D0LDW-7,
DMN3150L-7,
DMP2130LDM-7,
DMP2215L-7,
DMN3033LSN-7
PCN-1111
PCN-1111
2N7002A-7
23/DMP2215L-7
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ZXNB4200JA16TC
Abstract: No abstract text available
Text: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: Alert Category: November 20, 2008 December 20, 2008 Analog Semiconductors Products DCS/PCN-1121 Alert Type: PCN #: Bond wire change PCN #: 1121 TITLE Copper bond wire implementation IMPACT None DESCRIPTION OF CHANGE
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DCS/PCN-1121
ZXNB4200JA16TC
ZXNB4200JB16TC
ZXNB2200JA16TC
PCN-1121
ZXNB4200JA16TC
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Untitled
Abstract: No abstract text available
Text: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: Alert Category: Alert Type: June 19, 2008* September 17, 2008* Analog Semiconductor Bond Wire Change DCS/PCN-1115 Rev 03 PCN #: PCN-1115, Rev 03 TITLE ANALOG COPPER BOND WIRE IMPLEMENTATION IMPACT None
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DCS/PCN-1115
PCN-1115,
PCN-1115
O220-3L
AP1117D50G-13
252-3L
APX1117DG-U
AP1117D50G-U
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Untitled
Abstract: No abstract text available
Text: TaNSil WIRE BONDABLE SILICON CHIP RESISTORS ISO-9001 Registered WBC SERIES • Highly reliable aluminum bond pads Gold bond pads available • Discrete or tapped schematics • Ultra-stable TaNSil® resistors on silicon • MIL screening available • High resistor density
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ISO-9001
selfpassivaR0202:
10-100K
T0303:
10-100K
R0202
T0303
T0303AS
T0303
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Untitled
Abstract: No abstract text available
Text: TaNSil Wire Bondable W NE Silicon Chip Resistors WBC SERIES ● Ultra-stable TaNSil® resistors on silicon ● MIL screening available ● High resistor density ● Highly reliable aluminium bond pads Gold bond pads available ● Discrete or tapped schematics
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R0202
extremely00k
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Untitled
Abstract: No abstract text available
Text: TaNSil Wire Bondable Silicon Chip Resistors Welwyn Components WBC Series • Ultra-stable TaNSil® resistors on silicon • MIL screening available • High resistor density • Highly reliable aluminium bond pads Gold bond pads available • Discrete or tapped schematics
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R0202
T0303
R0202/
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Untitled
Abstract: No abstract text available
Text: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME
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25ppm/Â
106-F-0306
AT-10001F-G
50ppm/Â
10ppm/Â
100ppm/Â
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Untitled
Abstract: No abstract text available
Text: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME
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25ppm/
50ppm/
10ppm/
100ppm/
106-F-0306
T-10001F-G
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Untitled
Abstract: No abstract text available
Text: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT 0.035" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME
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50ppm/
25ppm/
10ppm/
100ppm/
106-D-1198
T-10001F-G
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tantalum nitride
Abstract: ceramic resistor
Text: TT electronics: Bond With The Best TaNFilm silicon and ceramic wire bondable resistor/capacitor chips from TT electronics T T electronics now provides its proven tantalum nitride thin film technology in ultra-miniature silicon or ceramic-based wire bondable
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400KV
000pF.
tantalum nitride
ceramic resistor
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heraeus
Abstract: Heraeus paste profile sl dielectric thinners W. HUGHES cool compiled 5007 resistivity wire in 5007 screen emulsion
Text: Conductors C 5007 Cadmium-Free & Bondable Au Conductor Paste Description: C 5007 is a wire bondable gold conductor, containing a mixed bonded Au formulation. It is entirely free of Cadmium and may therefore be classified as non-harmful & non-toxic. It offers excellent aged wire bond adhesion and contact
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Untitled
Abstract: No abstract text available
Text: RFLW 5N www.vishay.com Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: RFLW 3N www.vishay.com Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030" FEATURES • High frequency • Wire bond assembly • Small size: 0.030" x 0.030" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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11-Mar-11
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bcr20
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
bcr20
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hot wire anemometer
Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
Text: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance
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power inductor markings
Abstract: RFLW5N1500 bond wire gold AEC-Q200-002
Text: RFLW 5N Vishay Electro-Films Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF RFLW series of thin film spiral inductors on quartz are
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18-Jul-08
power inductor markings
RFLW5N1500
bond wire gold
AEC-Q200-002
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Untitled
Abstract: No abstract text available
Text: RFLW 3N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030" FEATURES • High frequency • Wire bond assembly • Small size: 0.030" x 0.030" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed
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2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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PDF
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RFLW5N1500
Abstract: No abstract text available
Text: RFLW 5N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed
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11-Mar-11
RFLW5N1500
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