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    MSP430F2274MDATEP Texas Instruments 16-bit Ultra-Low-Power Micro controller, 32kB Flash, 1K RAM 38-TSSOP -55 to 125 Visit Texas Instruments Buy

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    POD-SOT23

    Abstract: MO-178 sot 23- POD
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 6 Lead CASE 527AJ−01 ISSUE O D e E1 E DATE 19 DEC 2008 SYMBOL MIN NOM A 0.90 A1 0.00 A2 0.90 b 0.30 0.50 c 0.08 0.22 1.45 0.15 1.15 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 BSC L 0.45 0.30 0.60 0.60 REF


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    PDF OT-23, 527AJ-01 MO-178. 98AON34321E 527AJ POD-SOT23 MO-178 sot 23- POD

    SOT23-5 JEDEC standard

    Abstract: POD-SOT23 SOT235 MO-178 sot 23- POD 527AH
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 5 Lead CASE 527AH−01 ISSUE O D DATE 19 DEC 2008 SYMBOL E1 MIN NOM A 0.90 1.45 A1 0.00 0.15 A2 0.90 b 0.30 0.50 c 0.08 0.22 E 1.15 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC 0.95 BSC e e L 0.45 0.30 L1 PIN #1 IDENTIFICATION


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    PDF OT-23, 527AH-01 MO-178. 98AON34320E 527AH SOT23-5 JEDEC standard POD-SOT23 SOT235 MO-178 sot 23- POD 527AH

    POD-SOT23

    Abstract: 527AK MO-178 L2 SOT23-8
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 8 Lead CASE 527AK−01 ISSUE A DATE 18 MAR 2009 SYMBOL E1 e E b PIN #1 IDENTIFICATION NOM MAX A 0.90 1.45 A1 0.00 0.15 A2 0.90 A3 0.60 0.80 b 0.28 0.38 c 0.08 0.22 1.10 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC


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    PDF OT-23, 527AK-01 MO-178. 98AON34327E 527AK POD-SOT23 527AK MO-178 L2 SOT23-8

    MO-193

    Abstract: 419AE TSOT235 419AE-01
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOT−23, 5 LEAD CASE 419AE−01 ISSUE O DATE 19 DEC 2008 SYMBOL D MIN NOM A e E1 MAX 1.00 A1 0.01 0.05 0.10 A2 0.80 0.87 0.90 b 0.30 c 0.12 E 0.45 0.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 TYP 0.30 L L1 0.40


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    PDF TSOT-23, 419AE-01 MO-193. 98AON34392E 419AE MO-193 419AE TSOT235 419AE-01

    TSOT236-006-01

    Abstract: MO-193 TSOT236
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOT−23, 6 LEAD CASE 419AF−01 ISSUE O DATE 19 DEC 2008 SYMBOL D MIN NOM A e E1 MAX 1.00 A1 0.01 0.05 0.10 A2 0.80 0.87 0.90 b 0.30 c 0.12 E 0.45 0.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 TYP 0.30 L L1 0.40


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    PDF TSOT-23, 419AF-01 MO-193. 98AON34406E 419AF TSOT236-006-01 MO-193 TSOT236

    SOT233

    Abstract: POD-SOT23 sot 23- POD 527AG
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 3 Lead CASE 527AG−01 ISSUE O D DATE 19 DEC 2008 SYMBOL MIN A 0.89 1.12 A1 0.013 0.10 b 0.37 0.50 c 0.085 0.18 D 2.80 3.04 E 2.10 2.64 E1 1.20 3 E1 E NOM MAX 1.40 e 0.95 BSC e1 1.90 BSC L 0.40 REF e1 L1


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    PDF OT-23, 527AG-01 O-236. 98AON34319E 527AG SOT233 POD-SOT23 sot 23- POD 527AG

    footprint soic28

    Abstract: DIMENSIONS soic 28 SOIC28-049-01 SOIC28 751BN-01 SOIC-28
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−28, 300 mils, Extended Footprint CASE 751BN−01 ISSUE A DATE 17 MAR 2009 SYMBOL E MIN NOM A 2.35 2.65 A1 0.10 0.30 A2 2.05 2.55 b 0.31 0.51 c 0.20 0.33 D 17.78 18.03 E 11.43 12.12 E1 7.34 7.60 1.27 BSC e b


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    PDF SOIC-28, 751BN-01 98AON34303E SOIC-28 751BN footprint soic28 DIMENSIONS soic 28 SOIC28-049-01 SOIC28 751BN-01

    MS-013

    Abstract: SOIC24
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−24, 300 mils CASE 751BK−01 ISSUE O E1 DATE 19 DEC 2008 SYMBOL MIN A 2.35 E e PIN#1 IDENTIFICATION MAX 2.65 A1 0.10 0.30 A2 2.05 2.55 b 0.31 0.51 c 0.20 0.33 D 15.20 15.40 E 10.11 10.51 E1 7.34 7.60 1.27 BSC


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    PDF SOIC-24, 751BK-01 MS-013. 98AON34291E 751BK MS-013 SOIC24

    soic14 150

    Abstract: SOIC14
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−14, 150 mils CASE 751BF−01 ISSUE O E1 DATE 19 DEC 2008 SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 E MAX c 0.19 D 8.55 8.65 8.75 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 0.25 1.27 BSC e PIN#1 IDENTIFICATION


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    PDF SOIC-14, 751BF-01 MS-012. 98AON34274E 751BF soic14 150 SOIC14

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP20, 4.4x6.5 CASE 948AQ−01 ISSUE A DATE 19 MAR 2009 b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 6.40 6.50 6.60 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 e L 0.65 BSC 0.45 L1


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    PDF TSSOP20, 948AQ-01 MO-153. 98AON34453E 948AQ

    MS-013

    Abstract: SOIC16 SOIC16-300 mar 739 DIMENSIONS soic 16
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16, 300 mils CASE 751BH−01 ISSUE A DATE 18 MAR 2009 D SYMBOL MIN NOM MAX 2.49 2.64 A 2.36 A1 0.10 b 0.33 0.41 0.51 c 0.18 0.23 0.28 D 10.08 10.31 10.49 E 10.01 10.31 10.64 E1 7.39 7.49 7.59 E1 E 0.30 1.27 BSC


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    PDF SOIC-16, 751BH-01 MS-013. 98AON34279E 751BH MS-013 SOIC16 SOIC16-300 mar 739 DIMENSIONS soic 16

    751BD

    Abstract: 751BD-01
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 DATE 19 DEC 2008 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50


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    PDF 751BD-01 MS-012. 98AON34272E 751BD 751BD 751BD-01

    tssop16

    Abstract: TSSOP-16
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP16, 4.4x5 CASE 948AN−01 ISSUE O DATE 19 DEC 2008 b SYMBOL MIN NOM A E1 E MAX 1.10 A1 0.05 0.15 A2 0.85 0.95 b 0.19 0.30 c 0.13 0.20 D 4.90 5.10 E 6.30 6.50 E1 4.30 4.50 0.65 BSC e L 1.00 REF L1 0.45 0.75 θ


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    PDF TSSOP16, 948AN-01 MO-153. 98AON34436E 948AN tssop16 TSSOP-16

    948AL

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O DATE 19 DEC 2008 b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 0.15 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.90 e 0.65 BSC L 1.00 REF L1


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    PDF 948AL-01 MO-153. 98AON34428E 948AL 948AL

    MTR28515TF

    Abstract: QML-38534 mtr28515
    Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R006-96. 95-10-18 K.A. Cottonaim B Correct oaraarach 1.4, output currents. 97-10-22 K.A. Cottonaim C Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53


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    PDF 5962-R006-96. MTR28515TF/883 MTR28515TF QML-38534 mtr28515

    AT 980202

    Abstract: QML-38534 980202 MTR28512T883 MTR28512TF DSCC 93073
    Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R005-96. 95-10-18 K.A. Cottonaim B Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53 maximum. Table I, delete note 4 from output current test (Iq u t ) ancl


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    PDF 5962-R005-96. MTR28512TF/883 AT 980202 QML-38534 980202 MTR28512T883 MTR28512TF DSCC 93073

    l282

    Abstract: L-282
    Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n t i n u e d DCN REV DESCRIPTION 17288 03 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: (UNLES OTHERWISE SPECIFIED; 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.


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    PDF L28-2 l282 L-282

    28 LEADLESS CHIP CARRIER DWG

    Abstract: MS-009-AE
    Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER DCN REV DESCRIPTION 17 295 05 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A E NOTES: 2. E UNLES OTHERWISE SPECIFIED; BSC - BASIC LEAD SPACING BETWEEN CENTERS. DWG # SYMBOL MIN A .060 .075 A1 .050 .065 B1 R9 L 20-1


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    PDF L20-1 28 LEADLESS CHIP CARRIER DWG MS-009-AE

    Untitled

    Abstract: No abstract text available
    Text: REV 00 DCN DESCRIPTION 20289 ORIGINAL ISSUE ——I |—— bl DATE APPROVED ——Ie |—— S1 - mwwffl b — ► li^ — £11 L1 _\w S —• — SEATING PLANE NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.


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    Untitled

    Abstract: No abstract text available
    Text: DCN 17289 REV 03 DESCRIPTION UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 3 PL \3 NOTES: UNLES OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. SYMBOL A1 B1 B2 B3 D1/E1 D2/E2 D3/E3 e1 L1 L2 L3 ND/NE N


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    Untitled

    Abstract: No abstract text available
    Text: DCN 17289 REV 03 DESCRIPTION UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: UNLES OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. SYMBOL A1 B1 B2 B3 .D/E. D1/E1 D2/E2 D3/E3 e1 L1 L2 L3 ND/NE N MIN


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    Untitled

    Abstract: No abstract text available
    Text: THIS DRAWING IS UNPUBLISHED. O. COPYRIGHT 20 RELEASED FDR PUBLICATION 20 LOC A L L RIGHTS RESERVED. BY - REVISIONS DIST DS LTR D1 DESCRIPTION REVISED ECR-12-012238 DATE DWN APVD 1 9 / E IC T / '12 SJ HG D D KEY e e part­ TABLE - / lb BSC A -10, 0 B S C


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    PDF ECR-12-012238) j0-368504-l/0-368150-l D0779

    Untitled

    Abstract: No abstract text available
    Text: .350 DIA GLASS LENS MAX .225 .014 .023 .038 .065 .006 .015 2.096 .510 .620 .590 .630 .100 BSC .125 .200 .150 .020 .060 — .098 .005 0" 15' LTR A MIN - B B1 C D E E1 e L L1 Q S S1 a SIGNATURE ALL DIMENSIONS SHOWN ARE IN INCHES. a; DATE DOC. CONTROL: ENGR. MGR:


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    Untitled

    Abstract: No abstract text available
    Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP C ARRIER C o 11 1i 1111 e d DCN REV 17294 02 DESCRIPTION UPDATE DATE TO S T A N D A R D I Z E APPROVAL DRAWI NG A A1 NOTES: (UNLES OTHERWI SE 1. A LL DI MENSI ONS ARE 2. BSC - BASI C LEAD BETWEEN CENTERS. IN INCHES.


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    PDF L22-1