Untitled
Abstract: No abstract text available
Text: AMPMODU Interconnection System Short Point Crimp Snap-In Receptacle Contacts Material and Finish .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp
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C7025,
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567297-2
Abstract: No abstract text available
Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp
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C7025,
567297-2
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104480-9 crimp tool
Abstract: No abstract text available
Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish: Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A—Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin-lead in
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C7025,
104480-9 crimp tool
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PDF
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Untitled
Abstract: No abstract text available
Text: U SB Conn. Series USB Female 3 Ports A Type No. Name Q'ty 1 Housing 1 Material Finish Remarks & Thickness PBT □-L White/Black 2 Pin Term. 12 Copper Alloy NI:1~5u ; Tin:3u. Gold:1~3u" 3 Shell 1 Brass,0.3mm Tin:3~5u Tin Plated 4 Shell 1 Brass,0.3mm Tin:3~5u
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USB-003-A
C7025)
USB-004-A
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sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ALLOY leadframe C7025
Abstract: leadframe C7025 leadframe Cu C7025 C7025 alloy USBQNM50424C N03C QFN-143 USBQNM50403C C7025 TR7 SOT
Text: USBQNM50403C to USBQNM50424C 500W, Bi-directional TVS array Main product characteristics RoHS VWM 3.3V – 24.0V COMPLIANT VBR min / VBR(max) 4.0V / 26.7V HALOGEN CMAX 3pF PPP 500W FREE QFN-143 NON MAGNETIC FOR MRI Description and applications This Transient Voltage Suppressor (TVS) is assembled in a QFN143 package which is compatible (pin for pin)
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USBQNM50403C
USBQNM50424C
QFN-143
QFN143
OT-143
USBQNM504xxCe3/TR7
QFN143
ALLOY leadframe C7025
leadframe C7025
leadframe Cu C7025
C7025 alloy
USBQNM50424C
N03C
QFN-143
C7025
TR7 SOT
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PDF
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QMI519
Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
Text: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
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epax02
Ext686
MM74HCT00MTCX
MM74HCT05MTC
MM74HCT08MTCX
MM74HCT14MTC
MM74HCT240MTCX
QMI519
KEG3000D
QMI-519
ra3906
GR828FC
Kyocera mold compound
Hitachi Datecode
KE-G300
KE-G3000
Henkel
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PDF
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VIPER
Abstract: amphenol 203-743-9272 VIPER 06 VP773-00001 VP773 VP776-00001 3U VPX minimum wipe length engagement VP773-00002 VP776-00032
Text: Amphenol’s VIPER connector is a shielded, high-density, VIPER® Interconnect high-speed press-fit, modular interconnect system. Optimized for differential pair architectures on a 1.8mm x 1.35mm grid, the waferized daughtercard assembly also provides single-ended and power wafer
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TM 1222
Abstract: 1092-HTA m9625 quick disconnect terminal 4na11 M6112 1262TH st 6062 tape IPC-4-45 IPC-4-45T
Text: Part Number Cross Reference Part Number 7/16 632 BET SC 7/16 SEMS SCREW 348 731 792 798 834 835 836 / 836-TAPE 892 893 894 895 901 906 926 927 928-No Screw 928 934 ST.S 934 ST. SC 934 MSS 948 949 953 953-MOD 956 / 956-No Hole 957 972 972-TAB 983 984 990 1021
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836-TAPE
928-No
953-MOD
956-No
972-TAB
Termina15
TM 1222
1092-HTA
m9625
quick disconnect terminal
4na11
M6112
1262TH
st 6062 tape
IPC-4-45
IPC-4-45T
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PDF
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Untitled
Abstract: No abstract text available
Text: Ratioplast-Electronics Ratioplast-Electronics H.Wiedemann GmbH Jockweg 66, D-32312 Lübbecke Tel:+49 0 5741 23661-0 Fac:+49 (0) 5741 23661-20 USB Female 3 Ports A Type No. Name Q'ty 1 Housing 1 Material Finish Remarks & Thickness PBT White/Black 2 Pin Term.
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D-32312
USB-003-A
C7025)
USB-004-A
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PDF
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Untitled
Abstract: No abstract text available
Text: 1-104480-5 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we Chat with a Product Information Specialist Products Industries Resources About TE My Part Lists | S Support Center 1-104480-5 Product Details Share .100 AMPMODU Headers, Housings &
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com/catalog/pn/en/1-104480-5
21-Jun-2012
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Untitled
Abstract: No abstract text available
Text: 104480-9 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-9 Product Details Active Print Email Check Pricing & Availability
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com/catalog/pn/en/104480-9
13-Jun-2012
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PDF
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Untitled
Abstract: No abstract text available
Text: 1-104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Products Industries Resources About TE Support Center 1-104480-4 Product Details Share .100 AMPMODU Headers, Housings & Contacts My Par My Account Print Email Quick Links Check Pricing & Availability
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com/catalog/pn/en/1-104480-4
17-Apr-2012
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PDF
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Untitled
Abstract: No abstract text available
Text: 104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-4 Product Details Active Print Email Check Pricing & Availability
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com/catalog/pn/en/104480-4
13-Jun-2012
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CDA 194
Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Text: Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.
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D2863-77,
CDA 194
jedec mo-142 footprint
jedec ms-024
D2863-77
leadframe C7025
ALJ- 1300
footprint WSON
leadframe Cu C7025
MO-052
MO-108
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tsop 0038
Abstract: TSOP 48 LAYOUT TSOP 56 LAYOUT 0038 tsop TSOP 56 Package C7025
Text: TSOP: THIN SMALL OUTLINE PACKAGE DRAWING A2 Z e SEE DETAIL B E Y A1 D1 D SEATING PLANE SEE DETAIL A A DETAIL A DETAIL B c b φ L Thin Small Outline Package TSOP Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch
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56-Lead
48-Lead
C7025
40-lead,
40lead
32-lead
tsop 0038
TSOP 48 LAYOUT
TSOP 56 LAYOUT
0038 tsop
TSOP 56 Package
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LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com
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DS1685,
LMISR4
J-STD20A
J-STD-20A
ablebond
copper bond wire
copper bond wire amkor
ti 9841
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TSG 3255
Abstract: ALLOY leadframe C7025 leadframe C7025 tsg 271 C7025 certificate c7025
Text: Index INDEX A alloy 42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10 B boxes intermediate see Q-PACK boxes outer (see outer container boxes) tubes, protection from . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
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ALLOY leadframe C7025 material property
Abstract: smd code marking 56L 20L SMD SOT-23 9l marking sot23 ALLOY leadframe C7025 lead frame cu C194 marking code 56l 100L C194 C7025
Text: A Structured Approach To Lead-Free IC Assembly Transitioning L. Nguyen, R. Walberg, Z. Lin*, T. Koh*, YY Bong*, MC Chua*, S. Chuah*, JJ Yeoh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore
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FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
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ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
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ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
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D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
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PDF
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567297-2
Abstract: No abstract text available
Text: Catalog 1307612 MTE Interconnection System Revised 7-01 In te rc h an g e ab le C o n tacts, W ire C rim p S nap -In Material and Finish: Short Point Receptacles .068 Copper alloy C7025, plated as follows: Plating A— Duplex plated .000030 [0.00076] min. gold on contact area,
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C7025,
567297-2
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Untitled
Abstract: No abstract text available
Text: Catalog 296642 Focused Product Guide ampm odu .025 [0 .64] Revised 7-98 Printed Circuit Board Connectors Continued Interconnection System - Mod. IV Wire-Applied Housings, Double-Row,
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C7025,
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104480-9
Abstract: 567297-2
Text: AMPMODU .100 [2.54] Centerline Wire-to-Board Receptacles Catalog 1307612 Revised 7-01 Short Point Crimp Snap-In Receptacle Contacts Material and Finish: .068 [1.73] .060 [1.52] .460 [11.68] rv n . I t — Related Product Data: Performance Characteristics—
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C7025,
104480-9
567297-2
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