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    Intel reflow soldering profile BGA

    Abstract: Intel reflow soldering profile BGA ich7 ich7 bga ICH7 C92237-001 Intel reflow soldering profile BGA intel intel package drawings 6702PXH BGA OUTLINE DRAWING T-710
    Text: Intel 3000 and 3010 Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide August 2006 Reference Number: 313955 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS


    Original     		PDF

    C92210

    Abstract: C9224 C92112
    Text: C92000 Power Inductors for Commercial Applications FEATURES Compact, low profile package, ideal for automatic placement. Leadless Device for minimum footprint. Low Thermal Expansion permits mounting on most substrate materials. Different values and tighter tolerances


    Original     		C92000 CoC92132 C92133 C92134 C92135 C92231 C92232 C92233 C92234 C92235 C92210 C9224 C92112 PDF

    Untitled

    Abstract: No abstract text available
    Text: 8 P A R T N UMBER 922-373A-B3B 6 COMPLIANT PIN IMPEDANCE TABLE 1 DESCRIPTION 922-373A-B3C 922-373A-B3D 00.0177" 922-373A-B3F 922-373A-B3G 922-373A-B3H 100G H I G H SPEED MODULE Ni S U L F A M A T E , H I G H G OL D , L E A D F R E E 922-373A-B3J 922-373F-B3B


    OCR Scan     		22-373A-B3B 22-373A-B3J 922-373F-B3C 922-373F-B3D C922-373A-500 Q1189-DC-3PR-iP0S-G2-C0NN-B-100 PDF