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    CABGA 6x6

    Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
    Text: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is


    Original     		PDF GA98111PDF2/99 CABGA 6x6 CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56

    TQ32

    Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
    Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*


    Original     		PDF Jul-00 Oct-00 Jan-01 Apr-01 Jul-01 Oct-01 10X10, TQ32 ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6

    CRM1076

    Abstract: BFG64 ablestik 8360 ICS8430EY EME-G700 Transistor BC 1078 IDT82V2058XDA Compound EME-G700 CRM1525D IDT75N43102S50BCG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0610-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 16-Oct-2006 MEANS OF DISTINGUISHING CHANGED DEVICES:


    Original     		PDF A0610-02 16-Oct-2006 16-Jan-2007 Waf39FA MPC92469AC MPC92469FA MPC930FA MPC9315AC MPC9315FA MPC9330AC CRM1076 BFG64 ablestik 8360 ICS8430EY EME-G700 Transistor BC 1078 IDT82V2058XDA Compound EME-G700 CRM1525D IDT75N43102S50BCG

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		PDF 64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132

    "x-ray machine"

    Abstract: LCMXO640C-3TN144C TN1074 SMD MARKING CODE k11 lattice machxo lcmxo1200c LC4256ZE LCMXO2280C reflow LCMXO2280C-3FTN256I smd marking code G16 LCMXO1200
    Text: MachXO Family Handbook HB1002 Version 02.4, September 2010 MachXO Family Handbook Table of Contents September 2010 Section I. MachXO Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1002 TN1074 TN1089 TN1091 "x-ray machine" LCMXO640C-3TN144C SMD MARKING CODE k11 lattice machxo lcmxo1200c LC4256ZE LCMXO2280C reflow LCMXO2280C-3FTN256I smd marking code G16 LCMXO1200

    Untitled

    Abstract: No abstract text available
    Text: MachXO Family Handbook HB1002 Version 02.3, March 2010 MachXO Family Handbook Table of Contents March 2010 Section I. MachXO Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1002 TN1074 TN1089

    land pattern BGA 0,50

    Abstract: ROM16X1 Synplify block RAM diamond verilog code for 8 bit fifo register lattice MachXO2 Pinouts files marking code diode Ebr z SMD
    Text: MachXO Family Handbook HB1002 Version 02.7, October 2011 MachXO Family Handbook Table of Contents October 2011 Section I. MachXO Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1002 TN1089 TN1074 land pattern BGA 0,50 ROM16X1 Synplify block RAM diamond verilog code for 8 bit fifo register lattice MachXO2 Pinouts files marking code diode Ebr z SMD

    circuit of smart hearing aid

    Abstract: ir photodiode amplifier rs232 RCore DSP Architecture highpass rf filter WOLA reference wola 0X4010
    Text: BELASIGNA 250 High-Performance Programmable Audio Processing System Introduction BELASIGNA 250 is a complete programmable audio processing system, designed specifically for ultra−low−power embedded and portable digital audio systems. This high−performance chip builds on


    Original     		PDF 16-bit B250/D circuit of smart hearing aid ir photodiode amplifier rs232 RCore DSP Architecture highpass rf filter WOLA reference wola 0X4010

    Untitled

    Abstract: No abstract text available
    Text: BELASIGNA 250 High-Performance Programmable Audio Processing System Introduction BELASIGNA 250 is a complete programmable audio processing system, designed specifically for ultra−low−power embedded and portable digital audio systems. This high−performance chip builds on


    Original     		PDF B250/D

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    LCMXO1200

    Abstract: LCMXO2280 LCMXO256 LCMXO640 LVCMOS15 LVCMOS25 LVCMOS33 LCMXO1200C-3B256C package dimension 256-FTBGA vhdl code for 4 bit ripple carry adder
    Text: MachXO Family Handbook HB1002 Version 02.5, December 2010 MachXO Family Handbook Table of Contents December 2010 Section I. MachXO Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1002 TN1091 TN1086 TN1089 TN1092 LCMXO1200 LCMXO2280 LCMXO256 LCMXO640 LVCMOS15 LVCMOS25 LVCMOS33 LCMXO1200C-3B256C package dimension 256-FTBGA vhdl code for 4 bit ripple carry adder

    circuit of smart hearing aid

    Abstract: WOLA reference belasigna hearing aid high fidelity input WLCSP-48 hearing aid class d hearing aid integrated circuits 566AA CABGA 7x7 wola
    Text: BelaSigna 250 High-Performance Programmable Audio Processing System Introduction BelaSigna 250 is a complete programmable audio processing system, designed specifically for ultra−low−power embedded and portable digital audio systems. This high−performance chip builds on


    Original     		PDF 16-bit B250/D circuit of smart hearing aid WOLA reference belasigna hearing aid high fidelity input WLCSP-48 hearing aid class d hearing aid integrated circuits 566AA CABGA 7x7 wola

    Untitled

    Abstract: No abstract text available
    Text: BelaSigna 250 1.0 General Overview 1.1 Introduction BelaSigna 250 is a complete programmable audio processing system, designed specifically for ultra-low power embedded and portable digital audio systems. This high-performance chip builds on the architecture and design of BelaSigna 200 to deliver exceptional sound


    Original     		PDF 16-bit

    0W888-002-XTP

    Abstract: JSTD020D-01
    Text: BelaSigna 250 1.0 General Overview 1.1 Introduction BelaSigna 250 is a complete programmable audio processing system, designed specifically for ultra-low-power embedded and portable digital audio systems. This high-performance chip builds on the architecture and design of BelaSigna 200 to deliver exceptional sound


    Original     		PDF 16-bit 0W888-002-XTP JSTD020D-01

    WOLA reference

    Abstract: AMI Semiconductor hearing aid
    Text: BelaSigna 250 Production Data Sheet General Overview 1.0 General Overview 1.1 Introduction BelaSigna 250 is a complete programmable audio processing system, designed specifically for ultra-low power embedded and portable digital audio systems. This high-performance chip builds on the architecture and design of BelaSigna 200 to deliver exceptional sound


    Original     		PDF 16-bit M-20461-005, WOLA reference AMI Semiconductor hearing aid

    GAL 6001 programming Guide

    Abstract: GAL programming Guide LQ128 16v8z gal16lv8c GAL16V8D GAL20V8B GAL22V10D sample 84 pin plcc lattice dimension pAL programming Guide
    Text: Product Selector Guide September 2000 Lattice ISP Solutions Introduction ispMACH and ispLSI Lattice Semiconductor has developed three product lines, and associated design software, that allow you to design industryleading, reconfigurable systems today! Programmable logic designers continue to make demands that


    Original     		PDF 16-pin PAC-SYSTEM10 ispPAC10 PAC-SYSTEM20 ispPAC20 PAC-SYSTEM80 ispPAC80 GAL 6001 programming Guide GAL programming Guide LQ128 16v8z gal16lv8c GAL16V8D GAL20V8B GAL22V10D sample 84 pin plcc lattice dimension pAL programming Guide

    gal16v8d programming algorithm

    Abstract: gal programming algorithm vantis jtag schematic 1 of 8 selector 96 L 2 GAL16V8D LATTICE 3000 SERIES cpld PALCE610H-XX ISPGDX160A GAL22V10D
    Text: Lattice and Vantis Product Selector Guide February 2000 Universe of Programmable Solutions Introduction Lattice and Vantis 3.3V and 2.5V ISP CPLD Families Lattice and Vantis. The companies that gave the world ISP and took you Beyond Performance now bring you their combined


    Original     		PDF ISPpPAC10 28-pin ispPAC20-01JI ispPAC20 44-pin PAC-SYSTEM10 ispPAC10 PAC-SYSTEM20 gal16v8d programming algorithm gal programming algorithm vantis jtag schematic 1 of 8 selector 96 L 2 GAL16V8D LATTICE 3000 SERIES cpld PALCE610H-XX ISPGDX160A GAL22V10D

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    m28927-29

    Abstract: G.SHDSL LOOP modems HDSL2 m28927
    Text: A CONEXANT BUSINESS ZipWirePlus™ G.shdsl Transceiver with Embedded Microprocessor M28975 Complete G.shdsl/HDSL2/SDSL Multi-Rate DSL Solution > K E Y F E AT U R E S > Single-port CPE solution > Operation up to 4.6MB Multimode Operation > Multimode operation


    Original     		PDF M28975 Nx64K m28927-29 G.SHDSL LOOP modems HDSL2 m28927

    TR28 transformer

    Abstract: AFE LINE DRIVER DSL Line TRANSFORMER and Hybrid LINE DRIVER AFE/LD G.SHDSL SDSL AFE CX28975 TR-28 g991
    Text: ZipWirePlus G.shdsl Transceiver with Embedded Microprocessor CX28975 Complete G.shdsl/HDSL2/SDSL/HDSL/IDSL Multi-rate DSL Solution > K EY F E AT U R E S > Single-port CPE solution Multimode Operation > Multimode operation The ZipWirePlus single-port multimode DSL solution not


    Original     		PDF CX28975 Nx64K TR28 transformer AFE LINE DRIVER DSL Line TRANSFORMER and Hybrid LINE DRIVER AFE/LD G.SHDSL SDSL AFE CX28975 TR-28 g991

    m28927-29

    Abstract: M28945 m28927 LINE DRIVER AFE/LD G.SHDSL LOOP modems modems SDSL SDSL AFE NX64K
    Text: A CONEXANT BUSINESS ZipWirePlus™ G.shdsl Transceiver with Embedded Microprocessor M28945 Complete G.shdsl/HDSL2/SDSL Multi-Rate DSL Solution > K E Y F E AT U R E S > Single-port CPE solution > Operation up to 4.6MB Multimode Operation > Multimode operation


    Original     		PDF M28945 m28927-29 M28945 m28927 LINE DRIVER AFE/LD G.SHDSL LOOP modems modems SDSL SDSL AFE NX64K

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    DAEWON tray drawing

    Abstract: daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA
    Text: MIE APPROVAL 02/24/98 KY KW SEE DETAIL 'D' — 6.35 ►0.20 0 A Xd •0.20(0) A ZQ — 7.62 - 311.15-+0.25 -0.13 -132.08- +0.25 -0.13 +0.25 -0.13 - 311.66 - - +0.25 -0.13 - 132.59 - - ^10.20(0)1 A| X(R)| •0-10.20(0)1A|Z(0)| 135.9 92.1 SECTIDN


    OCR Scan     		PDF 12C-0707 JCL-0707-1 DAEWON tray drawing daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA

    Untitled

    Abstract: No abstract text available
    Text: TH IS DRAW ING IS ta/u/w m a ama. mere ft DAEW DN P R O P R IE T A R Y ND CDPY IS ALLOVEI] VITHDUT DAEMON'S PERMISSION [ -6 .3 5 H f lH M E E a - 7,6£ - — i3e.oa 311.15 - m + -8 :f: +0.25 +0.25 -a i3 -0,13 - 31166 — < - 132.59 — i $ io.2Q<h>i m z <B>


    OCR Scan     		PDF 12C-07D7-CB& 0707-CL3 lZC-0707-ClS lZC-0707-Cll 131253B JCL-0707-1