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    CAPTURE AND ELECTRONIC PACKAGING Search Results

    CAPTURE AND ELECTRONIC PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    CAPTURE AND ELECTRONIC PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    altera jtag

    Abstract: EPX780 EPF81500A EPF8282A EPF8282AV EPF8636A EPF8820A EPM7128S sdi verilog code EPX740
    Text: JTAG BoundaryScanTesting In Altera Devices November 1995, ver. 3 Introduction Application Note 39 As printed circuit boards PCBs become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s, altera jtag EPX780 EPF81500A EPF8282A EPF8282AV EPF8636A EPF8820A EPM7128S sdi verilog code EPX740

    epm9320

    Abstract: testing of diode IEEE 1149.1 JTAG altera jtag ii FLEX controller vhdl code download register EPF81500A EPF8282A EPF8282AV EPF8636A
    Text: IEEE 1149.1 JTAG Boundary-Scan Testing in Altera Devices August 1999, ver. 4.04 Introduction Application Note 39 As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s, epm9320 testing of diode IEEE 1149.1 JTAG altera jtag ii FLEX controller vhdl code download register EPF81500A EPF8282A EPF8282AV EPF8636A

    Untitled

    Abstract: No abstract text available
    Text: IEEE 1149.1 JTAG Boundary-Scan Testing in Altera Devices August 1998, ver. 4.01 Introduction Application Note 39 As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s,

    20KACEX

    Abstract: EPF8282A EPF8282AV EPF8636A EPM7032S EPM7064S
    Text: IEEE 1149.1 JTAG Boundary-Scan Testing in Altera Devices September 2000, ver. 4.05 Introduction Application Note 39 As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s, 20KACEX EPF8282A EPF8282AV EPF8636A EPM7032S EPM7064S

    vhdl code for phase shift

    Abstract: AGX52013-1
    Text: 13. IEEE 1149.1 JTAG Boundary-Scan Testing for Arria GX Devices AGX52013-1.2 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in


    Original     		PDF AGX52013-1 1980s, vhdl code for phase shift

    Untitled

    Abstract: No abstract text available
    Text: 9. IEEE 1149.1 JTAG Boundary-Scan Testing for Stratix II & Stratix II GX Devices SII52009-3.2 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in


    Original     		PDF SII52009-3 1980s,

    AGX52013-1

    Abstract: Arria II GX FPGA Development Board
    Text: 13. IEEE 1149.1 JTAG Boundary-Scan Testing for Arria GX Devices AGX52013-1.1 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in


    Original     		PDF AGX52013-1 1980s, Arria II GX FPGA Development Board

    Untitled

    Abstract: No abstract text available
    Text: 15. IEEE 1149.1 JTAG Boundary-Scan Testing for Stratix II & Stratix II GX Devices SII52009-3.3 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in


    Original     		PDF SII52009-3 1980s,

    Untitled

    Abstract: No abstract text available
    Text: 9. IEEE 1149.1 JTAG Boundary-Scan Testing for Stratix II and Stratix II GX Devices SII52009-3.3 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in


    Original     		PDF SII52009-3 1980s,

    capture and electronic packaging

    Abstract: Flip Chip Substrate tolerance thermal conductivity of substrate chip pads layout dram layout structure Pb210
    Text: Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing for Cost Effective Flip Chip Technology Designing For Cost Effective Flip Chip Technology Bump and flip approaches to semiconductor packaging have gained acceptance


    Original     		PDF

    ftl specification

    Abstract: packard bell INTEL sdk aztech rgb sensor camera dell FLASH TRANSLATION LAYER FTL
    Text: Portable PC Camera ’98 Design Guideline Digital Camera Peripherals for Volume PC Platforms July 1997 Portable PC Camera ’98 Design Guideline Intel would like to thank the following companies for their support and contributions to this document: Acer Incorporated, Adobe Systems Incorporated, The AGFA-Gevaert Group, Aztech Systems Limited,


    Original     		PDF com/design/pc98/ 1394TA ftl specification packard bell INTEL sdk aztech rgb sensor camera dell FLASH TRANSLATION LAYER FTL

    capture and electronic packaging

    Abstract: teledyne Microelectronics microwave transceiver specification Optical-Pressure-Sensor Optic-Pressure-Sensor military relay pro mechanica Arrayed Waveguide Grating DAR090709 TOSA
    Text: AG100714 Opto Optoelectronics Products, Packaging & Engineering Services Approved for Export COMPANY PROPRIETARY DAR 07/22/10 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.822.3573 • microelectronics@teledyne.com • www.teledynemicro.com


    Original     		PDF AG100714 DAR090709 capture and electronic packaging teledyne Microelectronics microwave transceiver specification Optical-Pressure-Sensor Optic-Pressure-Sensor military relay pro mechanica Arrayed Waveguide Grating DAR090709 TOSA

    CII51014-2

    Abstract: VHDL code for TAP controller
    Text: 14. IEEE 1149.1 JTAG Boundary-Scan Testing for Cyclone II Devices CII51014-2.1 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF CII51014-2 1980s, VHDL code for TAP controller

    ieee 1532

    Abstract: BSDL
    Text: 13. IEEE 1149.1 JTAG Boundary-Scan Testing for MAX II Devices MII51014-1.7 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in smaller boards, making traditional test methods (for


    Original     		PDF MII51014-1 1980s, ieee 1532 BSDL

    dlva

    Abstract: transmission line model orcad pspice 24 GHz Microwave Sensor surface mount htcc capture and electronic packaging E8257C manual 86142B 8703A E4407B Flip Chip on flex
    Text: SC090624 RF & MW DAR060930 RF & Microwave Packaging Capabilities & Engineering Services Approved for Export DAR 6/30/09 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.822.3573 • microelectronics@teledyne.com • www.teledynemicro.com


    Original     		PDF SC090624 DAR060930 MIL-PRF-38534, MIL-STD-883 D6-82479 D1-9000 MIL-STD-790, MIL-PRF-28750, dlva transmission line model orcad pspice 24 GHz Microwave Sensor surface mount htcc capture and electronic packaging E8257C manual 86142B 8703A E4407B Flip Chip on flex

    Untitled

    Abstract: No abstract text available
    Text: High performance handheld scopes Built tough to keep up with you. New 500 MHz 20 years of ScopeMeter Test Tool Innovation 190 Series II ScopeMeter® Portable Oscilloscopes See more. Fix more. ScopeMeter® portable oscilloscopes take you into territory where


    Original     		PDF -36-FLUKE 3801594C 11782-eng

    Pb210

    Abstract: flip chip substrate tolerance
    Text: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump


    Original     		PDF AN0039 Pb210 flip chip substrate tolerance

    8 pin SMD ic 4570 datasheet

    Abstract: ic 4570 datasheet ZIGBEE INTERNAL DIAGRAM BLOCK DIAGRAM OF ZIGBEE Zigbee Based Wireless Electronic Notice Board ADC hard radiation type of antenna used in zigbee circuit diagram of zigbee IC 4570 SMD ic 4570
    Text: CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 ZIGBEE Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4570 ENWCZA0xyzE No. REV. DS-4570-2400-102 04 PAGE Seite 1 of 27


    Original     		PDF IEEE802 PAN4570 DS-4570-2400-102 8 pin SMD ic 4570 datasheet ic 4570 datasheet ZIGBEE INTERNAL DIAGRAM BLOCK DIAGRAM OF ZIGBEE Zigbee Based Wireless Electronic Notice Board ADC hard radiation type of antenna used in zigbee circuit diagram of zigbee IC 4570 SMD ic 4570

    ic tms 1000

    Abstract: ieee 1149 TMS 1100 EP3SE50
    Text: 13. IEEE 1149.1 JTAG Boundary-Scan Testing in Stratix III Devices SIII51013-1.1 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in


    Original     		PDF SIII51013-1 1980s, ic tms 1000 ieee 1149 TMS 1100 EP3SE50

    8 pin SMD ic 4570 datasheet

    Abstract: ic 4570 datasheet CRYSTAL 32.768KHz DATASHEET SDA Physical Layer Specification Version 2.00 ZIGBEE INTERNAL DIAGRAM 32,768 SMD crystal Component ADC hard radiation 3 terminal 12mhz crystal oscillator ZIGBEE transmitter block DIAGRAM remote control for home appliances rf based
    Text: CLASSIFICATION PRODUCT SPECIFICATION Einstufung Produktspezifikation SUBJECT MODEM FOR IEEE802.15.4 ZIGBEE Thema “ZigBee” Modem“ (IEEE802.15.4) CUSTOMER’S CODE PANASONIC’S CODE PAN4570 ENWCZA0xyzE No. REV. DS-4570-2400-102 07 PAGE Seite 1 of 30


    Original     		PDF IEEE802 PAN4570 DS-4570-2400-102 8 pin SMD ic 4570 datasheet ic 4570 datasheet CRYSTAL 32.768KHz DATASHEET SDA Physical Layer Specification Version 2.00 ZIGBEE INTERNAL DIAGRAM 32,768 SMD crystal Component ADC hard radiation 3 terminal 12mhz crystal oscillator ZIGBEE transmitter block DIAGRAM remote control for home appliances rf based

    chn 4558 c

    Abstract: temic 0675 d4 temic 0675 temic 0675 d6 chn 4558 TFK U 3212 M TFK 626 E 1024 TFK 839 str f 6456 diagram Tfk 821
    Text: TSC 80251A1 TSC 80251A1 Extended 8–bit Microcontroller with Analog Interfaces Datasheet – 1996 TSC 80251A1 Table of Contents General Introduction Extended 8–bit Microcontroller with Analog Interfaces . . . . . . . . . . . . . . . . . 1. Section I: Introduction to TSC80251A1


    Original     		PDF 80251A1 TSC80251A1 chn 4558 c temic 0675 d4 temic 0675 temic 0675 d6 chn 4558 TFK U 3212 M TFK 626 E 1024 TFK 839 str f 6456 diagram Tfk 821

    FBGA672

    Abstract: IOAD16 8 IOG20 AGILENT TECHNOLOGIES 3070 ioa18 ieee 1532 EPC16 EPF81500A EPF8282A EPF8636A
    Text: IEEE 1149.1 JTAG Boundary-Scan Testing in Altera Devices June 2005, ver. 6.0 Introduction Application Note 39 As printed circuit boards PCBs become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s, FBGA672 IOAD16 8 IOG20 AGILENT TECHNOLOGIES 3070 ioa18 ieee 1532 EPC16 EPF81500A EPF8282A EPF8636A

    FBGA672

    Abstract: ioa18 fbga672 paging EPF8282A EPF8282AV EPF8636A EPF8820A EPM7032S EPM7064S AGILENT TECHNOLOGIES 3070
    Text: IEEE 1149.1 JTAG Boundary-Scan Testing in Altera Devices June 2005, ver. 6.0 Introduction Application Note 39 As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surfacemount packaging and PCB manufacturing have resulted in smaller


    Original     		PDF 1980s, FBGA672 ioa18 fbga672 paging EPF8282A EPF8282AV EPF8636A EPF8820A EPM7032S EPM7064S AGILENT TECHNOLOGIES 3070

    electrical engineering mini project

    Abstract: advanced technology in embedded projects capture and electronic packaging Ansoft aero engine hfss implantable medical device Mini Project Temperature Sensor
    Text: ADVANCED PACKAGING EXPERTISE FOR MEDICAL AND HIGH-RELIABILITY APPLICATIONS NEXT-GENERATION MEDICAL TECHNOLOGIES Zarlink’s Advanced Packaging division is actively involved in leading and participating in multi-organization projects addressing customer requirements for


    Original     		PDF 10ZS250 electrical engineering mini project advanced technology in embedded projects capture and electronic packaging Ansoft aero engine hfss implantable medical device Mini Project Temperature Sensor