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TLP2766A
|
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Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), High-speed, 20 Mbps, 5000 Vrms, SO6L |
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UPA2766T1A-E2-AY
|
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Renesas Electronics Corporation
|
Nch Single Power Mosfet 30V 130A 0.88Mohm 8Pin HVSON (6051) |
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77313-827-66LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions |
|
|
|
77313-427-66LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions |
|
|
|
77313-127-66LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions |
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